covering only portions of the surface to be connected

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H01L2224/14134

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14134covering only portions of the surface to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Method of manufacturing semiconductor device including cutting a mo...
- Patent number 11,887,907
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Wonyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 11,658,153
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 11,646,296
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having planarized passivation layer and method...
- Patent number 11,488,894
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor chip and outer connect...
- Patent number 11,373,919
- Issue date Jun 28, 2022
- Samsung Electronics Co., Ltd.
- Wonyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,244,919
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 11,004,827
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having planarized passivation layer and method...
- Patent number 10,847,447
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,790,231
- Issue date Sep 29, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management application of interconnect substrates
- Patent number 10,748,845
- Issue date Aug 18, 2020
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 10,685,936
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on same substrate
- Patent number 10,629,567
- Issue date Apr 21, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,418,329
- Issue date Sep 17, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management application of interconnect substrates
- Patent number 10,332,827
- Issue date Jun 25, 2019
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 10,290,613
- Issue date May 14, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device, method for manufacturing the electronic device,...
- Patent number 10,283,434
- Issue date May 7, 2019
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure, display module, and inspection method...
- Patent number 10,261,369
- Issue date Apr 16, 2019
- AU OPTRONICS CORPORATION
- Neng-Yi Lin
- G02 - OPTICS
Information Patent Grant
Mechanisms for forming package structure
- Patent number 10,141,280
- Issue date Nov 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC stacking device and method of manufacture
- Patent number 10,109,613
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated interface structure
- Patent number 9,875,956
- Issue date Jan 23, 2018
- GLOBALFOUNDRIES Inc.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,728,527
- Issue date Aug 8, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concentric bump design for the alignment in die stacking
- Patent number 9,721,916
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management applications of interconnect substrates
- Patent number 9,520,342
- Issue date Dec 13, 2016
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die on a...
- Patent number 9,478,485
- Issue date Oct 25, 2016
- STATS ChipPAC Pte. Ltd.
- XuSheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with stress-reducing structures and methods of forming same
- Patent number 9,472,481
- Issue date Oct 18, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with external connection bumps
- Patent number 9,472,526
- Issue date Oct 18, 2016
- Synaptics Japan GK
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package structure and method for an integrated switching...
- Patent number 9,245,872
- Issue date Jan 26, 2016
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240304584
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hai-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD
- Publication number 20240071972
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20240006397
- Publication date Jan 4, 2024
- Prilit Optronics, Inc.
- Biing-Seng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20230253370
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE OF CHIP
- Publication number 20220336398
- Publication date Oct 20, 2022
- Sitronix Technology Corp.
- KUO-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20220328373
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Wonyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE AND DISPLAY DEVICE
- Publication number 20220216183
- Publication date Jul 7, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Mingxing WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...
- Publication number 20210305212
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20210249323
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- Wonyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PLANARIZED PASSIVATION LAYER AND METHO...
- Publication number 20210028092
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- YOUNG LYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20200395301
- Publication date Dec 17, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20200286863
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...
- Publication number 20200091114
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20190355666
- Publication date Nov 21, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MANAGEMENT APPLICATION OF INTERCONNECT SUBSTRATES
- Publication number 20190341344
- Publication date Nov 7, 2019
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE
- Publication number 20190148344
- Publication date May 16, 2019
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20180301436
- Publication date Oct 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3DIC Stacking Device and Method of Manufacture
- Publication number 20170005073
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH STRESS-REDUCING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20150228600
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...
- Publication number 20140291834
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140103544
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- KENJI YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE STRUCTURE AND METHOD FOR AN INTEGRATED SWITCHING...
- Publication number 20140070385
- Publication date Mar 13, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20130228895
- Publication date Sep 5, 2013
- FUJI XEROX CO., LTD
- Daisuke IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MANAGEMENT APPLICATIONS OF INTERCONNECT SUBSTRATES
- Publication number 20130087366
- Publication date Apr 11, 2013
- Volterra Semiconductor Corporation
- Mihalis Michael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC-DC CONVERTER
- Publication number 20120013316
- Publication date Jan 19, 2012
- Kabushiki Kaisha Toshiba
- Kazutoshi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

covering only portions of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Multiple plated via arrays of different wire heights on a same subs...

Method of manufacturing semiconductor device including cutting a mo...

Forming recesses in molding compound of wafer to reduce stress

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor device having planarized passivation layer and method...

Semiconductor package having a semiconductor chip and outer connect...

Package structure and method of fabricating the same

Microelectronic structures having multiple microelectronic devices...

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor device having planarized passivation layer and method...

Microelectronic structures having multiple microelectronic devices...

Power management application of interconnect substrates

Forming recesses in molding compound of wafer to reduce stress

Multiple plated via arrays of different wire heights on same substrate

Microelectronic structures having multiple microelectronic devices...

Power management application of interconnect substrates

Multiple bond via arrays of different wire heights on a same substrate

Electronic device, method for manufacturing the electronic device,...

Integrated circuit structure, display module, and inspection method...

Mechanisms for forming package structure

3DIC stacking device and method of manufacture

Integrated interface structure

Multiple bond via arrays of different wire heights on a same substrate

Concentric bump design for the alignment in die stacking

Power management applications of interconnect substrates

Semiconductor device and method of stacking semiconductor die on a...

Packages with stress-reducing structures and methods of forming same

Semiconductor device with external connection bumps

Flip-chip package structure and method for an integrated switching...

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

PACKAGE STRUCTURE

SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD

DISPLAY PANEL

Forming Recesses in Molding Compound of Wafer to Reduce Stress

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

BUMP STRUCTURE OF CHIP

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

DISPLAY SUBSTRATE AND DISPLAY DEVICE

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE HAVING PLANARIZED PASSIVATION LAYER AND METHO...

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

Forming Recesses in Molding Compound of Wafer to Reduce Stress

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

POWER MANAGEMENT APPLICATION OF INTERCONNECT SUBSTRATES

MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE

Multiple bond via arrays of different wire heights on a same substrate

3DIC Stacking Device and Method of Manufacture

PACKAGES WITH STRESS-REDUCING STRUCTURES AND METHODS OF FORMING SAME

SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...

SEMICONDUCTOR DEVICE

FLIP-CHIP PACKAGE STRUCTURE AND METHOD FOR AN INTEGRATED SWITCHING...

PACKAGE SUBSTRATE AND SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

POWER MANAGEMENT APPLICATIONS OF INTERCONNECT SUBSTRATES

DC-DC CONVERTER