covering only portions of the surface to be connected

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H01L2224/30164

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/30164covering only portions of the surface to be connected

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with heat dissipation
- Patent number 8,581,390
- Issue date Nov 12, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
I/O pad structures for integrated circuit devices
- Patent number 7,898,088
- Issue date Mar 1, 2011
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using semiconductor chip
- Patent number 7,002,185
- Issue date Feb 21, 2006
- Rohm Co., Ltd.
- Shinji Isokawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION
- Publication number 20130264698
- Publication date Oct 10, 2013
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
I/O PAD STRUCTURES FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20090091016
- Publication date Apr 9, 2009
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device using semiconductor chip
- Publication number 20050242424
- Publication date Nov 3, 2005
- Rohm Co., Ltd.
- Shinji Isokawa
- H01 - BASIC ELECTRIC ELEMENTS