covering only portions of the surface to be connected

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H01L2224/14164

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/14164covering only portions of the surface to be connected

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Patents Grantslast 30 patents

Information Patent Grant
Mechanisms for forming package structure
- Patent number 10,141,280
- Issue date Nov 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC stacking device and method of manufacture
- Patent number 10,109,613
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,728,489
- Issue date Aug 8, 2017
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat dissipation
- Patent number 8,581,390
- Issue date Nov 12, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3DIC Stacking Device and Method of Manufacture
- Publication number 20170005073
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361430
- Publication date Dec 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Methods of Formation Thereof
- Publication number 20130292684
- Publication date Nov 7, 2013
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION
- Publication number 20130264698
- Publication date Oct 10, 2013
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS