Covering only the central area of the surface to be connected

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H01L2224/14146

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/14146Covering only the central area of the surface to be connected

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Patents Grantslast 30 patents

Information Patent Grant
Method of making an electronic assembly
- Patent number 7,421,778
- Issue date Sep 9, 2008
- Intel Corporation
- Jason A. Garcia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated device and electronic system
- Patent number 7,221,053
- Issue date May 22, 2007
- Infineon Technologies AG
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly having multi-material interconnects
- Patent number 7,183,493
- Issue date Feb 27, 2007
- Intel Corporation
- Jason A. Garcia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321797
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yoshiaki SHIMOOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated device and electronic system
- Publication number 20060208357
- Publication date Sep 21, 2006
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic assembly having multi-material interconnects
- Publication number 20060162959
- Publication date Jul 27, 2006
- Jason A. Garcia
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic assembly having multi-material interconnects
- Publication number 20060001159
- Publication date Jan 5, 2006
- Jason A. Garcia
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...