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Covering only the central area of the surface to be connected
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Industry
CPC
H01L2224/30136
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/30136
Covering only the central area of the surface to be connected
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Patents Grants
last 30 patents
Information
Patent Grant
Method for coating conductive substrate with adhesive
Patent number
10,056,534
Issue date
Aug 21, 2018
G-SMATT CO., LTD.
Hak Ryul Shin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
Publication number
20160284958
Publication date
Sep 29, 2016
G-SMATT CO., LTD.
Hak Ryul SHIN
H01 - BASIC ELECTRIC ELEMENTS