Covering only the central area of the surface to be connected

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H01L2224/14156

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/14156Covering only the central area of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip power supply system, chip, PCB, and computer device
- Patent number 11,387,226
- Issue date Jul 12, 2022
- Huawei Technologies Co., Ltd.
- Yadong Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount high-frequency circuit
- Patent number 9,691,722
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Yuasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for semiconductor package
- Patent number 9,355,977
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,224,713
- Issue date Dec 29, 2015
- Kabushiki Kaisha Toshiba
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having electrodes formed from bumps with different diameters
- Patent number 9,048,221
- Issue date Jun 2, 2015
- PS4 Luxco S.A.R.L.
- Yu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic workpieces and methods for manufacturing microelect...
- Patent number 8,987,874
- Issue date Mar 24, 2015
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,981,532
- Issue date Mar 17, 2015
- PS4 Luxco S.A.R.L.
- Koji Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for semiconductor package
- Patent number 8,970,035
- Issue date Mar 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump for semiconductor package, semiconductor package having bump,...
- Patent number 8,823,183
- Issue date Sep 2, 2014
- SK Hynix Inc.
- Ki Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,710,654
- Issue date Apr 29, 2014
- Kabushiki Kaisha Toshiba
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,697,546
- Issue date Apr 15, 2014
- Kenta Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing and packaging th...
- Patent number 8,598,691
- Issue date Dec 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic workpieces with stand-off projections and methods f...
- Patent number 8,492,198
- Issue date Jul 23, 2013
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic workpieces and methods for manufacturing microelect...
- Patent number 7,928,582
- Issue date Apr 19, 2011
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,259,046
- Issue date Aug 21, 2007
- Kabushiki Kaisha Toshiba
- Hideo Aoki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP POWER SUPPLY SYSTEM, CHIP, PCB, AND COMPUTER DEVICE
- Publication number 20210143141
- Publication date May 13, 2021
- Huawei Technologies Co., Ltd
- Yadong Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING PLURAL SEMICOND...
- Publication number 20140295620
- Publication date Oct 2, 2014
- Youkou ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140206144
- Publication date Jul 24, 2014
- KABUSHIKI KAISHA TOSHIBA
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structures for Semiconductor Package
- Publication number 20140061897
- Publication date Mar 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC WORKPIECES AND METHODS FOR MANUFACTURING MICROELECT...
- Publication number 20130302941
- Publication date Nov 14, 2013
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130183799
- Publication date Jul 18, 2013
- Elpida Memory, Inc.
- Jun SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130134583
- Publication date May 30, 2013
- Kabushiki Kaisha Toshiba
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING PLURAL SEMICOND...
- Publication number 20130137216
- Publication date May 30, 2013
- Elpida Memory, Inc.
- Youkou ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130134548
- Publication date May 30, 2013
- Elpida Memory, Inc.
- Koji TORII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE
- Publication number 20130127048
- Publication date May 23, 2013
- Elpida Memory, Inc.
- Yu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacturing and Packaging Th...
- Publication number 20130062741
- Publication date Mar 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120295415
- Publication date Nov 22, 2012
- Elpida Memory, Inc.
- Kenta ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP,...
- Publication number 20120091584
- Publication date Apr 19, 2012
- Hynix Semiconductor Inc.
- Ki Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)
- Publication number 20120080789
- Publication date Apr 5, 2012
- Sharp Kabushiki Kaisha
- Motoji Shiota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC WORKPIECES AND METHOD FOR MANUFACTURING MICROELECTR...
- Publication number 20110212614
- Publication date Sep 1, 2011
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-CHIP DEVICE
- Publication number 20100052111
- Publication date Mar 4, 2010
- Kabushiki Kaisha Toshiba
- Yukihiro Urakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC WORKPIECES AND METHODS FOR MANUFACTURING MICROELECT...
- Publication number 20080217763
- Publication date Sep 11, 2008
- Micron Technology, Inc.
- Kevin W. Hutto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050199989
- Publication date Sep 15, 2005
- Hideo Aoki
- H01 - BASIC ELECTRIC ELEMENTS

Covering only the central area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip power supply system, chip, PCB, and computer device

Surface mount high-frequency circuit

Bump structures for semiconductor package

Semiconductor device and manufacturing method thereof

Device having electrodes formed from bumps with different diameters

Microelectronic workpieces and methods for manufacturing microelect...

Semiconductor device and manufacturing method thereof

Bump structures for semiconductor package

Bump for semiconductor package, semiconductor package having bump,...

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor device

Semiconductor devices and methods of manufacturing and packaging th...

Microelectronic workpieces with stand-off projections and methods f...

Microelectronic workpieces and methods for manufacturing microelect...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

CHIP POWER SUPPLY SYSTEM, CHIP, PCB, AND COMPUTER DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING PLURAL SEMICOND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Bump Structures for Semiconductor Package

MICROELECTRONIC WORKPIECES AND METHODS FOR MANUFACTURING MICROELECT...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING PLURAL SEMICOND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DEVICE

Semiconductor Devices and Methods of Manufacturing and Packaging Th...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP,...

SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)

MICROELECTRONIC WORKPIECES AND METHOD FOR MANUFACTURING MICROELECTR...

STACKED-CHIP DEVICE

MICROELECTRONIC WORKPIECES AND METHODS FOR MANUFACTURING MICROELECT...

Semiconductor device and manufacturing method thereof