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  • H01L2224/17136
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/17136Covering only the central area of the surface to be connected
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Microelectronic assemblies
    • Patent number 12,113,048
    • Issue date Oct 8, 2024
    • Intel Corporation
    • Adel A. Elsherbini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Pad structure design in fan-out package
    • Patent number 11,984,405
    • Issue date May 14, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of direct bonding semiconductor components
    • Patent number 11,810,892
    • Issue date Nov 7, 2023
    • Imec VZW
    • Jaber Derakhshandeh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Microelectronic assemblies
    • Patent number 11,616,047
    • Issue date Mar 28, 2023
    • Intel Corporation
    • Adel A. Elsherbini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Microelectronic assemblies
    • Patent number 11,469,206
    • Issue date Oct 11, 2022
    • Intel Corporation
    • Adel A. Elsherbini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package and manufacturing method thereof
    • Patent number 11,456,268
    • Issue date Sep 27, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Jung-Hua Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Pad structure design in fan-out package
    • Patent number 11,424,189
    • Issue date Aug 23, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Pad structure design in fan-out package
    • Patent number 10,510,670
    • Issue date Dec 17, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ball grid array system
    • Patent number 9,867,295
    • Issue date Jan 9, 2018
    • Dell Products L.P.
    • Bhavesh Patel
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Pad structure design in fan-out package
    • Patent number 9,576,926
    • Issue date Feb 21, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 9,105,463
    • Issue date Aug 11, 2015
    • Panasonic Corporation
    • Kenji Yokoyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 9,000,572
    • Issue date Apr 7, 2015
    • Samsung Electronics Co., Ltd.
    • Hoon Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package equipped with semiconductor chip and method for producing same
    • Patent number 7,649,267
    • Issue date Jan 19, 2010
    • Panasonic Corporation
    • Tsukasa Shiraishi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    MICROELECTRONIC ASSEMBLIES
    • Publication number 20250022845
    • Publication date Jan 16, 2025
    • Intel Corporation
    • Adel A. Elsherbini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240222330
    • Publication date Jul 4, 2024
    • Samsung Electronics Co., Ltd.
    • Youngjun YOON
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
    • Publication number 20240021558
    • Publication date Jan 18, 2024
    • Powertech Technology Inc.
    • Shang-Yu CHANG-CHIEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MICROELECTRONIC ASSEMBLIES
    • Publication number 20230133235
    • Publication date May 4, 2023
    • Intel Corporation
    • Adel A. Elsherbini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230034654
    • Publication date Feb 2, 2023
    • Samsung Electronics Co., Ltd.
    • Yong Ho KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Pad Structure Design in Fan-Out Package
    • Publication number 20220352080
    • Publication date Nov 3, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
    • Publication number 20210159207
    • Publication date May 27, 2021
    • IMEC vzw
    • Jaber Derakhshandeh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MICROELECTRONIC ASSEMBLIES
    • Publication number 20210111156
    • Publication date Apr 15, 2021
    • Intel Corporation
    • Adel A. Elsherbini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20200235065
    • Publication date Jul 23, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jung-Hua Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Pad Structure Design in Fan-Out Package
    • Publication number 20200091075
    • Publication date Mar 19, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chen-Hua Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MICROELECTRONIC ASSEMBLIES
    • Publication number 20190385977
    • Publication date Dec 19, 2019
    • Intel Corporation
    • Adel A. Elsherbini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    • Publication number 20170098628
    • Publication date Apr 6, 2017
    • MEDIATEK INC.
    • Nai-Wei LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20140103544
    • Publication date Apr 17, 2014
    • PANASONIC CORPORATION
    • KENJI YOKOYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20130037964
    • Publication date Feb 14, 2013
    • Hoon Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package Equipped with Semiconductor Chip and Method for Producing Same
    • Publication number 20080265437
    • Publication date Oct 30, 2008
    • Tsukasa Shiraishi
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...