Covering only the central area of the surface to be connected

Follow

Industry

CPC
H01L2224/30156

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/30156Covering only the central area of the surface to be connected

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,687,319
- Issue date Mar 30, 2010
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080188058
- Publication date Aug 7, 2008
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip device having supportable bar and mounting structure thereof
- Publication number 20050104222
- Publication date May 19, 2005
- Se-Young Jeong
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...