Covering only the peripheral area of the surface to be connected

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H01L2224/17135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17135Covering only the peripheral area of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assemblies
- Patent number 12,113,048
- Issue date Oct 8, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,984,405
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 11,825,603
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Tomomi Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,616,047
- Issue date Mar 28, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and interconnect device configured f...
- Patent number 11,562,962
- Issue date Jan 24, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects embedded in a solder resist layer
- Patent number 11,551,939
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for cooling three-dimensional integrated circuits
- Patent number 11,532,613
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,469,206
- Issue date Oct 11, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,456,268
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,424,189
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 11,057,997
- Issue date Jul 6, 2021
- Murata Manufacturing Co., Ltd.
- Tomomi Yasuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for cooling three-dimensional integrated circuits
- Patent number 10,910,365
- Issue date Feb 2, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump structure for semiconductor package assemblies
- Patent number 10,879,203
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for cooling three-dimensional integrated circuits
- Patent number 10,763,253
- Issue date Sep 1, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible display panel and preparation method thereof, flexible dis...
- Patent number 10,622,330
- Issue date Apr 14, 2020
- BOE Technology Group Co., Ltd.
- Tao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 10,510,670
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming package structure
- Patent number 10,141,280
- Issue date Nov 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including an adhesive pattern
- Patent number 10,043,789
- Issue date Aug 7, 2018
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array system
- Patent number 9,867,295
- Issue date Jan 9, 2018
- Dell Products L.P.
- Bhavesh Patel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for cooling three-dimensional integrated circuits
- Patent number 9,748,228
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 9,576,926
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,000,572
- Issue date Apr 7, 2015
- Samsung Electronics Co., Ltd.
- Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element unit and reinforcing adhesive agent
- Patent number 8,686,299
- Issue date Apr 1, 2014
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240057349
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION
- Publication number 20230317662
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20230133235
- Publication date May 4, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20220352080
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASS...
- Publication number 20220181289
- Publication date Jun 9, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VOID FILLING FOR AN INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20220181294
- Publication date Jun 9, 2022
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER
- Publication number 20220068662
- Publication date Mar 3, 2022
- QUALCOMM Incorporated
- Kun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20210298171
- Publication date Sep 23, 2021
- MURATA MANUFACTURING CO., LTD.
- Tomomi YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20210111156
- Publication date Apr 15, 2021
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200235065
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20200091075
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20190385977
- Publication date Dec 19, 2019
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20190320531
- Publication date Oct 17, 2019
- MURATA MANUFACTURING CO., LTD.
- Tomomi YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE DISPLAY PANEL AND PREPARATION METHOD THEREOF, FLEXIBLE DIS...
- Publication number 20190067240
- Publication date Feb 28, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Tao SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20180061816
- Publication date Mar 1, 2018
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Cooling Three-Dimensional Integrated Circuits
- Publication number 20170358572
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170012081
- Publication date Jan 12, 2017
- XINTEC INC.
- Chia-Lun SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING PACKAGE STRUCTURE
- Publication number 20150145129
- Publication date May 28, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150048501
- Publication date Feb 19, 2015
- Samsung Electronics Co., Ltd.
- Jin-Woo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130037964
- Publication date Feb 14, 2013
- Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
- Publication number 20120111617
- Publication date May 10, 2012
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Substrate with built-in semiconductor element, and method of fabric...
- Publication number 20110074012
- Publication date Mar 31, 2011
- Oki Electric Industry Co., Ltd.
- Masanori Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Die Attachment
- Publication number 20080169574
- Publication date Jul 17, 2008
- Nokia Corporation
- Petri Molkkari
- H01 - BASIC ELECTRIC ELEMENTS

Covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic assemblies

Pad structure design in fan-out package

High-frequency module

Microelectronic assemblies

Package comprising a substrate and interconnect device configured f...

Substrate comprising interconnects embedded in a solder resist layer

Structure and method for cooling three-dimensional integrated circuits

Microelectronic assemblies

Semiconductor package and manufacturing method thereof

Pad structure design in fan-out package

High-frequency module

Structure and method for cooling three-dimensional integrated circuits

Stud bump structure for semiconductor package assemblies

Structure and method for cooling three-dimensional integrated circuits

Flexible display panel and preparation method thereof, flexible dis...

Pad structure design in fan-out package

Mechanisms for forming package structure

Semiconductor packages including an adhesive pattern

Ball grid array system

Structure and method for cooling three-dimensional integrated circuits

Pad structure design in fan-out package

Semiconductor package

Electronic element unit and reinforcing adhesive agent

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION

MICROELECTRONIC ASSEMBLIES

Pad Structure Design in Fan-Out Package

THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASS...

THROUGH-SUBSTRATE VOID FILLING FOR AN INTEGRATED CIRCUIT ASSEMBLY

SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER

HIGH-FREQUENCY MODULE

MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Pad Structure Design in Fan-Out Package

MICROELECTRONIC ASSEMBLIES

HIGH-FREQUENCY MODULE

FLEXIBLE DISPLAY PANEL AND PREPARATION METHOD THEREOF, FLEXIBLE DIS...

SEMICONDUCTOR PACKAGES

Structure and Method for Cooling Three-Dimensional Integrated Circuits

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MECHANISMS FOR FORMING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT

Substrate with built-in semiconductor element, and method of fabric...

Direct Die Attachment