Covering only the peripheral area of the surface to be connected

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CPC
H01L2224/30155

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/30155Covering only the peripheral area of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting method
- Patent number 9,609,760
- Issue date Mar 28, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 9,054,114
- Issue date Jun 9, 2015
- Xintec Inc.
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 8,779,558
- Issue date Jul 15, 2014
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 8,673,686
- Issue date Mar 18, 2014
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure of semiconductor package component and manufactu...
- Patent number 8,664,773
- Issue date Mar 4, 2014
- Panasonic Corporation
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 8,409,925
- Issue date Apr 2, 2013
- Hung-Jen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a buffer structure and method o...
- Patent number 8,274,149
- Issue date Sep 25, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structures and methods of fabricating stacked structures
- Patent number 7,956,448
- Issue date Jun 7, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked structures and methods of fabricating stacked structures
- Patent number 7,879,711
- Issue date Feb 1, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
- Patent number 7,375,427
- Issue date May 20, 2008
- Seiko Epson Corporation
- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill film for printed wiring assemblies
- Patent number 7,265,994
- Issue date Sep 4, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Janice Danvir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flipchip packaging having a perimeter wall
- Patent number 5,448,114
- Issue date Sep 5, 1995
- Kabushiki Kaisha Toshiba
- You Kondoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20220052022
- Publication date Feb 17, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Quanpeng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140264771
- Publication date Sep 18, 2014
- Xintec Inc.
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140096379
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130207240
- Publication date Aug 15, 2013
- Xintec Inc.
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120313222
- Publication date Dec 13, 2012
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120313261
- Publication date Dec 13, 2012
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...
- Publication number 20120299202
- Publication date Nov 29, 2012
- PANASONIC CORPORATION
- Atsushi YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20110233764
- Publication date Sep 29, 2011
- Hsiao-Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES
- Publication number 20100327463
- Publication date Dec 30, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS
Information Patent Application
STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES
- Publication number 20080124845
- Publication date May 29, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, circuit board, electro-optic device, electron...
- Publication number 20060091539
- Publication date May 4, 2006
- Seiko Epson Corporation
- Shuichi Tanaka
- G02 - OPTICS
Information Patent Application
Flip chip device having supportable bar and mounting structure thereof
- Publication number 20050104222
- Publication date May 19, 2005
- Se-Young Jeong
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Underfill film for printed wiring assemblies
- Publication number 20040150967
- Publication date Aug 5, 2004
- Janice Danvir
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display panel, preparation method thereof, and display device

Method for coating conductive substrate with adhesive

Electronic component mounting method

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Mounting structure of semiconductor package component and manufactu...

Electronic component mounting structure

Chip package structure and manufacturing method thereof

Semiconductor device package having a buffer structure and method o...

Stacked structures and methods of fabricating stacked structures

Stacked structures and methods of fabricating stacked structures

Semiconductor device, circuit board, electro-optic device, electron...

Underfill film for printed wiring assemblies

Semiconductor flipchip packaging having a perimeter wall

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES

ELECTRONIC COMPONENT MOUNTING STRUCTURE

STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES

Semiconductor device, circuit board, electro-optic device, electron...

Flip chip device having supportable bar and mounting structure thereof

Underfill film for printed wiring assemblies