TREA

Covering only the peripheral area of the surface to be connected

Follow

Industry

  • CPC
  • H01L2224/33155
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/33155Covering only the peripheral area of the surface to be connected
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Underfill pattern with gap
    • Patent number 9,627,346
    • Issue date Apr 18, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Feng-Cheng Hsu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents