Covering only the peripheral area of the surface to be connected

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H01L2224/17165

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/17165Covering only the peripheral area of the surface to be connected

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Patents Grantslast 30 patents

Information Patent Grant
Multi-die packages incorporating flip chip dies and associated pack...
- Patent number 8,604,597
- Issue date Dec 10, 2013
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-DIE PACKAGES INCORPORATING FLIP CHIP DIES AND ASSOCIATED PACK...
- Publication number 20120273929
- Publication date Nov 1, 2012
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS