Covering only the peripheral area of the surface to be connected

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H01L2224/09135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/09135Covering only the peripheral area of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for electrical overstress protection
- Patent number 10,770,452
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Leslie Paul Wallis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 10,748,871
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Seong Hwan Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on file display device including the same
- Patent number 10,546,807
- Issue date Jan 28, 2020
- LG Display Co., Ltd.
- Soon-Dong Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,438,927
- Issue date Oct 8, 2019
- Samsung Electronics Co, Ltd.
- Ha Yong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pad layout for flipchip...
- Patent number 9,780,057
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge side connection
- Patent number 9,209,143
- Issue date Dec 8, 2015
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20190295986
- Publication date Sep 26, 2019
- Samsung Electronics Co., Ltd.
- SEONG HWAN OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190189589
- Publication date Jun 20, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ha Yong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILE DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20190164877
- Publication date May 30, 2019
- LG Display Co., Ltd.
- Soon-Dong Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR ELECTRICAL OVERSTRESS PROTECTION
- Publication number 20170194317
- Publication date Jul 6, 2017
- SKYWORKS SOLUTIONS, INC.
- Leslie Paul WALLIS
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20150054167
- Publication date Feb 26, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20120241984
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20110074047
- Publication date Mar 31, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS

Covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and methods for electrical overstress protection

Semiconductor chip and semiconductor package including the same

Chip on file display device including the same

Fan-out semiconductor package

Semiconductor device and method of forming pad layout for flipchip...

Die edge side connection

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

FAN-OUT SEMICONDUCTOR PACKAGE

CHIP ON FILE DISPLAY DEVICE INCLUDING THE SAME

APPARATUS AND METHODS FOR ELECTRICAL OVERSTRESS PROTECTION

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Semiconductor Device and Method of Forming Pad Layout for Flipchip...