Covering only the peripheral area of the surface to be connected

Industry

CPC
H01L2224/17155

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17155Covering only the peripheral area of the surface to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for assembling processor systems
- Patent number 12,033,996
- Issue date Jul 9, 2024
- 1372934 B.C. LTD
- Kelly T. R. Boothby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack packages including a supporting substrate
- Patent number 11,152,335
- Issue date Oct 19, 2021
- SK hynix Inc.
- Seung Yeop Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,867,884
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,867,885
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device, oscillator, electronic device, and vehicle
- Patent number 10,715,082
- Issue date Jul 14, 2020
- Seiko Epson Corporation
- Yasuhiro Sudo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat spreading device and method
- Patent number 10,483,187
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor manufacturing process
- Patent number 9,911,709
- Issue date Mar 6, 2018
- Advanced Semiconductor Engineering, Inc.
- Chun-Jun Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,735,132
- Issue date Aug 15, 2017
- ChipMOS Technologies Inc.
- Cheng-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having unified semiconductor chips
- Patent number 9,165,897
- Issue date Oct 20, 2015
- Samsung Electronics Co., Ltd.
- In Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Wiring board and liquid crystal display device
- Patent number 8,319,932
- Issue date Nov 27, 2012
- Sharp Kabushiki Kaisha
- Takashi Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package equipped with semiconductor chip and method for producing same
- Patent number 7,649,267
- Issue date Jan 19, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE AND FLEXIBLE SUBSTRATE
- Publication number 20240332273
- Publication date Oct 3, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS
- Publication number 20210091062
- Publication date Mar 25, 2021
- D-WAVE SYSTEMS INC.
- Kelly T. R. Boothby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING A SUPPORTING SUBSTRATE
- Publication number 20200395340
- Publication date Dec 17, 2020
- SK HYNIX INC.
- Seung Yeop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE
- Publication number 20200185350
- Publication date Jun 11, 2020
- AZUREWAVE TECHNOLOGIES, INC.
- Chuan Jin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Heat Spreading Device and Method
- Publication number 20200013697
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Spreading Device and Method
- Publication number 20200013698
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Spreading Device and Method
- Publication number 20190006263
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING UNIFIED SEMICONDUCTOR CHIPS
- Publication number 20140124956
- Publication date May 8, 2014
- Samsung Electronics Co., Ltd.
- IN LEE
- G11 - INFORMATION STORAGE
Information Patent Application
WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE
- Publication number 20110199569
- Publication date Aug 18, 2011
- Takashi Matsui
- G02 - OPTICS
Information Patent Application
Package Equipped with Semiconductor Chip and Method for Producing Same
- Publication number 20080265437
- Publication date Oct 30, 2008
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for assembling processor systems

Method of direct bonding semiconductor components

Stack packages including a supporting substrate

Heat spreading device and method

Heat spreading device and method

Integrated circuit device, oscillator, electronic device, and vehicle

Heat spreading device and method

Semiconductor device and semiconductor manufacturing process

Semiconductor package

Semiconductor package having unified semiconductor chips

Wiring board and liquid crystal display device

Package equipped with semiconductor chip and method for producing same

Patents Applicationslast 30 patents

OPTICAL MODULE AND FLEXIBLE SUBSTRATE

METHOD FOR BONDING SEMICONDUCTOR COMPONENTS

SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS

STACK PACKAGES INCLUDING A SUPPORTING SUBSTRATE

IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE

Heat Spreading Device and Method

Heat Spreading Device and Method

Heat Spreading Device and Method

SEMICONDUCTOR PACKAGE HAVING UNIFIED SEMICONDUCTOR CHIPS

WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE

Package Equipped with Semiconductor Chip and Method for Producing Same