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Covering only the peripheral area of the surface to be connected
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CPC
H01L2224/30145
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/30145
Covering only the peripheral area of the surface to be connected
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Patent Grant
Sealing structure for a bonded wafer and method of forming the seal...
Patent number
9,653,312
Issue date
May 16, 2017
Semiconductor Manufacturing International (Shanghai) Corporation
Yuankun Hou
H01 - BASIC ELECTRIC ELEMENTS