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H01L2224/06145

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06145Covering only the peripheral area of the surface to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device and driving circuit structure
- Patent number 12,112,669
- Issue date Oct 8, 2024
- E Ink Holdings Inc.
- Shu-Fen Tsai
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package including stacked semiconductor chips electri...
- Patent number 10,204,885
- Issue date Feb 12, 2019
- Samsung Electronics Co., Ltd.
- Tae Joo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,899,351
- Issue date Feb 20, 2018
- Samsung Electronics Co., Ltd.
- Museob Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterfall wire bonding
- Patent number 9,704,797
- Issue date Jul 11, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with sidewall contacting bonding tape
- Patent number 9,691,691
- Issue date Jun 27, 2017
- Samsung Electronics Co., Ltd.
- Yong-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,455,244
- Issue date Sep 27, 2016
- Samsung Electronics Co., Ltd.
- MuSeob Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-circular under bump metallization (UBM) structure, orientation...
- Patent number 8,847,391
- Issue date Sep 30, 2014
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including multi-chip
- Patent number 8,711,650
- Issue date Apr 29, 2014
- Renesas Electronics Corporation
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,710,637
- Issue date Apr 29, 2014
- Renesas Electronics Corporation
- Yukinori Tashiro
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,525,306
- Issue date Sep 3, 2013
- Renesas Electronics Corporation
- Yukinori Tashiro
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flip-flop semiconductor device packaging using bent leadfingers
- Patent number 8,283,772
- Issue date Oct 9, 2012
- Cypress Semiconductor Corporation
- Carlo Gamboa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including multi-chip
- Patent number 8,223,578
- Issue date Jul 17, 2012
- Renesas Electronics Corporation
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device including multi-chip
- Patent number 7,554,872
- Issue date Jun 30, 2009
- Renesas Technology Corp.
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device including multi-chip
- Patent number 6,847,575
- Issue date Jan 25, 2005
- Renesas Technology Corp.
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device including multi-chip
- Patent number 6,587,393
- Issue date Jul 1, 2003
- Hitachi, Ltd.
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device including multi-chip
- Patent number 6,411,561
- Issue date Jun 25, 2002
- Hitachi, Ltd.
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device including multi-chip
- Patent number 6,392,950
- Issue date May 21, 2002
- Hitachi, Ltd.
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND DRIVING CIRCUIT STRUCTURE
- Publication number 20230352452
- Publication date Nov 2, 2023
- E Ink Holdings Inc.
- Shu-Fen TSAI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190139939
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Tae Joo HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATERFALL WIRE BONDING
- Publication number 20140183727
- Publication date Jul 3, 2014
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION...
- Publication number 20140008788
- Publication date Jan 9, 2014
- QUALCOMM Incorporated
- Zhongping Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-CHIP
- Publication number 20120262992
- Publication date Oct 18, 2012
- RENESAS TECHNOLOGY CORP.
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120018859
- Publication date Jan 26, 2012
- RENESAS ELECTRONICS CORPORATION
- Yukinori TASHIRO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-CHIP
- Publication number 20090245004
- Publication date Oct 1, 2009
- Renesas Technology Corp.
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor device including multi-chip
- Publication number 20050128853
- Publication date Jun 16, 2005
- RENESAS TECHNOLOGY CORP.
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor device including multi-chip
- Publication number 20030206478
- Publication date Nov 6, 2003
- Hitachi, Ltd.
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor device including multi-chip
- Publication number 20020131318
- Publication date Sep 19, 2002
- Kazushige Ayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including multi-chip
- Publication number 20010048616
- Publication date Dec 6, 2001
- Kazushige Ayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including multi-chip
- Publication number 20010046167
- Publication date Nov 29, 2001
- Kazushige Ayukawa
- H01 - BASIC ELECTRIC ELEMENTS

Covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and driving circuit structure

Semiconductor package including stacked semiconductor chips electri...

Semiconductor package

Waterfall wire bonding

Semiconductor package with sidewall contacting bonding tape

Semiconductor package

Non-circular under bump metallization (UBM) structure, orientation...

Semiconductor device including multi-chip

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Flip-flop semiconductor device packaging using bent leadfingers

Semiconductor device including multi-chip

Semiconductor device including multi-chip

Semiconductor device including multi-chip

Semiconductor device including multi-chip

Semiconductor device including multi-chip

Semiconductor device including multi-chip

Patents Applicationslast 30 patents

DISPLAY DEVICE AND DRIVING CIRCUIT STRUCTURE

SEMICONDUCTOR PACKAGE

WATERFALL WIRE BONDING

NON-CIRCULAR UNDER BUMP METALLIZATION (UBM) STRUCTURE, ORIENTATION...

SEMICONDUCTOR DEVICE INCLUDING MULTI-CHIP

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING MULTI-CHIP

Semiconductor device including multi-chip

Semiconductor device including multi-chip

Semiconductor device including multi-chip

Semiconductor device including multi-chip

Semiconductor device including multi-chip