Covering only the peripheral area of the surface to be connected

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CPC
H01L2224/30135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/30135Covering only the peripheral area of the surface to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating an electronic device comprising forming an i...
- Patent number 11,244,910
- Issue date Feb 8, 2022
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,672,721
- Issue date Jun 2, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,177,098
- Issue date Jan 8, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic device including a protective wafer bonded to a...
- Patent number 9,773,740
- Issue date Sep 26, 2017
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical method and corresponding assembly for bonding semic...
- Patent number 8,638,000
- Issue date Jan 28, 2014
- Robert Bosch GmbH
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of stack-type semiconductor device
- Patent number 7,405,138
- Issue date Jul 29, 2008
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method of semiconductor device,...
- Patent number 7,019,397
- Issue date Mar 28, 2006
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...
- Publication number 20190103368
- Publication date Apr 4, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Method and Corresponding Assembly for Bonding Semic...
- Publication number 20120280409
- Publication date Nov 8, 2012
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Manufacturing method of stack-type semiconductor device
- Publication number 20060046436
- Publication date Mar 2, 2006
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method of semiconductor device,...
- Publication number 20020047199
- Publication date Apr 25, 2002
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS

Covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating an electronic device comprising forming an i...

Method for fabricating an electronic device and a stacked electroni...

Method for fabricating an electronic device and a stacked electroni...

Method for coating conductive substrate with adhesive

Stacked electronic device including a protective wafer bonded to a...

Micromechanical method and corresponding assembly for bonding semic...

Manufacturing method of stack-type semiconductor device

Semiconductor device, manufacturing method of semiconductor device,...

Patents Applicationslast 30 patents

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

Micromechanical Method and Corresponding Assembly for Bonding Semic...

Manufacturing method of stack-type semiconductor device

Semiconductor device, manufacturing method of semiconductor device,...