Crossover interconnections

Industry

CPC
H01L23/5221

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5221Crossover interconnections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Array substrate and display panel
- Patent number 12,148,762
- Issue date Nov 19, 2024
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Xingfeng Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 12,131,993
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- To-Wen Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor device and method for manufacturing the...
- Patent number 12,125,847
- Issue date Oct 22, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Qingyuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device with V2V rail
- Patent number 12,125,792
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 12,114,506
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Feng Young
- G11 - INFORMATION STORAGE
Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 12,087,700
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device interconnects and methods of formation
- Patent number 12,087,832
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D memory with graphite conductive strips
- Patent number 12,041,776
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on multichip package using interconnection bridge
- Patent number 12,027,491
- Issue date Jul 2, 2024
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency crossover with high isolation in microelectronics H...
- Patent number 12,022,608
- Issue date Jun 25, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Butted contacts and methods of fabricating the same in semiconducto...
- Patent number 12,002,756
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Digital blocks with electrically insulated and orthogonal polysilic...
- Patent number 11,978,738
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Rakesh Dimri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for logic circuit
- Patent number 11,955,425
- Issue date Apr 9, 2024
- Taiwan Semiconducotr Manufacturing Co., Ltd.
- Fang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact structure, method, layout, and system
- Patent number 11,935,825
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,923,301
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fin structure
- Patent number 11,908,851
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shun-Li Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with air-gaps
- Patent number 11,842,962
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D memory with graphite conductive strips
- Patent number 11,839,080
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including power connection lines
- Patent number 11,830,813
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Jisoo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 11,770,934
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Feng Young
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,744,076
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Vinayak Shamanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low-cost, high-bandwidth monolithic system integration b...
- Patent number 11,735,515
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Murat Kerem Akarvardar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and manufacturing method thereof
- Patent number 11,728,212
- Issue date Aug 15, 2023
- TAIWAN SEMICONDCUTOR MANUFACTURING COMPANY, LTD.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the same and electron...
- Patent number 11,695,074
- Issue date Jul 4, 2023
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory layout for reduced line loading
- Patent number 11,678,494
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common rail contact
- Patent number 11,652,149
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with V2V rail and methods of making same
- Patent number 11,637,069
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airbridge for making connections on superconducting chip, and metho...
- Patent number 11,605,586
- Issue date Mar 14, 2023
- IQM Finland Oy
- Kok Wai Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for logic circuit
- Patent number 11,581,256
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,569,167
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMMON RAIL CONTACT
- Publication number 20240387655
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION
- Publication number 20240387656
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW-COST, HIGH-BANDWIDTH MONOLITHIC SYSTEM INTEGRATION B...
- Publication number 20240387351
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Murat Kerem AKARVARDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240389332
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Feng Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...
- Publication number 20240321746
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY WITH GRAPHITE CONDUCTIVE STRIPS
- Publication number 20240315033
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON MULTICHIP PACKAGE USING INTERCONNECTION BRIDGE
- Publication number 20240266322
- Publication date Aug 8, 2024
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME
- Publication number 20240170389
- Publication date May 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jiajia Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240162150
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE
- Publication number 20240153940
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUN-LI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL VIA MULTI-LEVELS
- Publication number 20240153865
- Publication date May 9, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145412
- Publication date May 2, 2024
- UNITED MICROELECTRONICS CORP.
- Shih-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING CAPACITOR ARCHITECTURE
- Publication number 20240088014
- Publication date Mar 14, 2024
- QUALCOMM Incorporated
- Keyurkumar Karsanbhai KANSAGRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20240063218
- Publication date Feb 22, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Qingyuan HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices with a structure capable of suppressing coupl...
- Publication number 20240038690
- Publication date Feb 1, 2024
- MEDIATEK INC.
- Po-Jui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20230411379
- Publication date Dec 21, 2023
- SOCIONEXT INC.
- Hideyuki KOMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION
- Publication number 20230387227
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230371267
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Feng Young
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND ELECTRON...
- Publication number 20230369489
- Publication date Nov 16, 2023
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY WITH GRAPHITE CONDUCTIVE STRIPS
- Publication number 20230371257
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW-COST, HIGH-BANDWIDTH MONOLITHIC SYSTEM INTEGRATION B...
- Publication number 20230352393
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Murat Kerem AKARVARDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335435
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20230307350
- Publication date Sep 28, 2023
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON RAIL CONTACT
- Publication number 20230290842
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH V2V RAIL
- Publication number 20230253328
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20230238321
- Publication date Jul 27, 2023
- United Microelectronics Corp.
- To-Wen Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure for Logic Circuit
- Publication number 20230197605
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Fang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115672
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure And Method For Finfet Device With Contact Over Dielectric...
- Publication number 20230115015
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DOPED SEMICONDUCTOR BRIDGE STR...
- Publication number 20230057885
- Publication date Feb 23, 2023
- SANDISK TECHNOLOGIES LLC
- Ryousuke ITOU
- H01 - BASIC ELECTRIC ELEMENTS

Crossover interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Array substrate and display panel

Interconnect structure

Nitride-based semiconductor device and method for manufacturing the...

Method of making a semiconductor device with V2V rail

Semiconductor structure and method of fabricating the same

Embedded die microelectronic device with molded component

Semiconductor device interconnects and methods of formation

3D memory with graphite conductive strips

Logic drive based on multichip package using interconnection bridge

Radio frequency crossover with high isolation in microelectronics H...

Butted contacts and methods of fabricating the same in semiconducto...

Digital blocks with electrically insulated and orthogonal polysilic...

Interconnect structure for logic circuit

Contact structure, method, layout, and system

Method of manufacturing semiconductor device

Semiconductor device having fin structure

Interconnect structure with air-gaps

3D memory with graphite conductive strips

Semiconductor devices including power connection lines

Semiconductor structure and method of fabricating the same

Integrated assemblies, and methods of forming integrated assemblies

Method for low-cost, high-bandwidth monolithic system integration b...

Integrated circuit structure and manufacturing method thereof

Semiconductor device, method of manufacturing the same and electron...

Memory layout for reduced line loading

Common rail contact

Semiconductor device with V2V rail and methods of making same

Airbridge for making connections on superconducting chip, and metho...

Interconnect structure for logic circuit

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

COMMON RAIL CONTACT

SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION

METHOD FOR LOW-COST, HIGH-BANDWIDTH MONOLITHIC SYSTEM INTEGRATION B...

SEMICONDUCTOR STRUCTURE

BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...

3D MEMORY WITH GRAPHITE CONDUCTIVE STRIPS

LOGIC DRIVE BASED ON MULTICHIP PACKAGE USING INTERCONNECTION BRIDGE

THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE

METAL VIA MULTI-LEVELS

SEMICONDUCTOR DEVICE

DECOUPLING CAPACITOR ARCHITECTURE

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

Semiconductor devices with a structure capable of suppressing coupl...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND ELECTRON...

3D MEMORY WITH GRAPHITE CONDUCTIVE STRIPS

METHOD FOR LOW-COST, HIGH-BANDWIDTH MONOLITHIC SYSTEM INTEGRATION B...

INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

COMMON RAIL CONTACT

METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH V2V RAIL

INTERCONNECT STRUCTURE

Interconnect Structure for Logic Circuit

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Structure And Method For Finfet Device With Contact Over Dielectric...

THREE-DIMENSIONAL MEMORY DEVICE WITH DOPED SEMICONDUCTOR BRIDGE STR...