Curing and solidification

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CPC
H01L2224/27515

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27515Curing and solidification

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,804,464
- Issue date Oct 31, 2023
- Kioxia Corporation
- Keiichi Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-cure and cure hybrid film-on-die for embedded controller die
- Patent number 11,699,685
- Issue date Jul 11, 2023
- Western Digital Technologies, Inc.
- Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack arrangement comprising a die-attach-film tape and method...
- Patent number 11,342,298
- Issue date May 24, 2022
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-LED chips and methods for manufacturing the same and display...
- Patent number 11,081,632
- Issue date Aug 3, 2021
- CHENGDU VISTAR OPTOELECTRONICS CO., LTD.
- Feng Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filler particle position and density manipulation with applications...
- Patent number 10,903,184
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Jonathan Fry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack arrangement comprising a die-attach-film tape and method...
- Patent number 10,861,818
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,849,236
- Issue date Nov 24, 2020
- Dexerials Corporation
- Reiji Tsukao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer-level packaging methods using a photolithographic bonding mat...
- Patent number 10,755,979
- Issue date Aug 25, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,749
- Issue date Dec 10, 2019
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,461,054
- Issue date Oct 29, 2019
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Paste material, wiring member formed from the paste material, and e...
- Patent number 10,392,518
- Issue date Aug 27, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 10,199,358
- Issue date Feb 5, 2019
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method for connecting two wafers
- Patent number 10,134,707
- Issue date Nov 20, 2018
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
- Kai Zoschke
- B32 - LAYERED PRODUCTS
Information Patent Grant
Chip mounting structure
- Patent number 9,893,031
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating pillar solder bump
- Patent number 9,508,594
- Issue date Nov 29, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fastening chips with a contact element onto a substrate...
- Patent number 9,245,869
- Issue date Jan 26, 2016
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component placement on flexible and/or stretchable substrates
- Patent number 8,961,725
- Issue date Feb 24, 2015
- Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Marinus Marc Koetse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 8,610,269
- Issue date Dec 17, 2013
- NEC Corporation
- Kenji Nanba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable adhesive composition, semiconductor package using the s...
- Patent number 8,558,388
- Issue date Oct 15, 2013
- Samsung Electronics Co., Ltd.
- Joon-Yong Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for electronic devices
- Patent number 8,278,143
- Issue date Oct 2, 2012
- Renesas Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for electronic devices
- Patent number 7,977,158
- Issue date Jul 12, 2011
- Renesas Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION
- Publication number 20240347367
- Publication date Oct 17, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240203927
- Publication date Jun 20, 2024
- KIOXIA Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...
- Publication number 20240112990
- Publication date Apr 4, 2024
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105664
- Publication date Mar 28, 2024
- Chipbond Technology Corporation
- Yu-Chung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...
- Publication number 20240071975
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Bong Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE
- Publication number 20240021563
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
- Publication number 20230395524
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION, MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY
- Publication number 20230275057
- Publication date Aug 31, 2023
- Mitsui Chemicals, Inc.
- Yuzo NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device and Method of Manufacturing the Same
- Publication number 20230215852
- Publication date Jul 6, 2023
- LG Display Co., Ltd.
- Byonghoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-Cure and Cure Hybrid Film-On-Die for Embedded Controller Die
- Publication number 20230020021
- Publication date Jan 19, 2023
- Western Digital Technologies, Inc.
- Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuits Including Micropatterns and Using Partial Curing to Adhere...
- Publication number 20220352108
- Publication date Nov 3, 2022
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...
- Publication number 20220310547
- Publication date Sep 29, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220189902
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE ATTACH FILM, AND SEMICONDUCTOR PACKAGE USING THE SAME AN...
- Publication number 20220077101
- Publication date Mar 10, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220005779
- Publication date Jan 6, 2022
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE LAYERED BODY AND LAYERED BODY
- Publication number 20210391292
- Publication date Dec 16, 2021
- Mitsui Chemicals, Inc.
- Yasuhisa KAYABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Arrangement Comprising a Die-Attach-Film Tape and Method...
- Publication number 20210005568
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-LED CHIPS AND METHODS FOR MANUFACTURING THE SAME AND DISPLAY...
- Publication number 20200251641
- Publication date Aug 6, 2020
- Kunshan New Flat Panel Display Technology Center Co., Ltd.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...
- Publication number 20200135689
- Publication date Apr 30, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER PARTICLE POSITION AND DENSITY MANIPULATION WITH APPLICATIONS...
- Publication number 20200066669
- Publication date Feb 27, 2020
- International Business Machines Corporation
- Jonathan Fry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACK ARRANGEMENT AND METHOD FOR PRODUCING SAME
- Publication number 20190304945
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE BONDING RESIN LAYER FORMING APPARATUS
- Publication number 20190139928
- Publication date May 9, 2019
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170103959
- Publication date Apr 13, 2017
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURIN...
- Publication number 20170012022
- Publication date Jan 12, 2017
- FUJIFILM CORPORATION
- Kenta YOSHIDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20160345442
- Publication date Nov 24, 2016
- DEXERIALS CORPORATION
- Reiji TSUKAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER LEVEL PACKAGING USING A CATALYTIC ADHESIVE
- Publication number 20160148893
- Publication date May 26, 2016
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PLACEMENT ON FLEXIBLE AND/OR STRETCHABLE SUBSTRATES
- Publication number 20130133822
- Publication date May 30, 2013
- Nederlandse Organisatie voor Toegepastnatuurwetenschappelijk Onderzoek TNO
- Marinus Marc Koetse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE ADHESIVE COMPOSITION, SEMICONDUCTOR PACKAGE USING THE S...
- Publication number 20120181703
- Publication date Jul 19, 2012
- Samsung Electronics Co., Ltd.
- Joon-Yong PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR...
- Publication number 20120181686
- Publication date Jul 19, 2012
- Samsung Electronics Co., Ltd.
- Joon Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS

Curing and solidification

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Non-conductive film sheet and semiconductor package including the same

Multilayer substrate

Semiconductor device and manufacturing method thereof

Non-cure and cure hybrid film-on-die for embedded controller die

Die stack arrangement comprising a die-attach-film tape and method...

Micro-LED chips and methods for manufacturing the same and display...

Inkjet adhesive, manufacturing method for semiconductor device, and...

Bump-forming film, semiconductor device and manufacturing method th...

Filler particle position and density manipulation with applications...

Die stack arrangement comprising a die-attach-film tape and method...

Anisotropic conductive film and production method of the same

Wafer-level packaging methods using a photolithographic bonding mat...

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Semiconductor device

Anisotropic conductive film and production method of the same

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Paste material, wiring member formed from the paste material, and e...

Multilayer substrate

Chip mounting structure

Bonding method for connecting two wafers

Chip mounting structure

Method and apparatus for chip-to-wafer integration

Fabricating pillar solder bump

Method for fastening chips with a contact element onto a substrate...

Component placement on flexible and/or stretchable substrates

Semiconductor device, method for manufacturing semiconductor device...

Patternable adhesive composition, semiconductor package using the s...

Electronic component mounting structure

Manufacturing method for electronic devices

Manufacturing method for electronic devices

Patents Applicationslast 30 patents

INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...

METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE

EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT

COMPOSITION, MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY

Display Device and Method of Manufacturing the Same

Non-Cure and Cure Hybrid Film-On-Die for Embedded Controller Die

Circuits Including Micropatterns and Using Partial Curing to Adhere...

DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...

NON-CONDUCTIVE FILM SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

DICING DIE ATTACH FILM, AND SEMICONDUCTOR PACKAGE USING THE SAME AN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SUBSTRATE LAYERED BODY AND LAYERED BODY

Die Stack Arrangement Comprising a Die-Attach-Film Tape and Method...

MICRO-LED CHIPS AND METHODS FOR MANUFACTURING THE SAME AND DISPLAY...

WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...

FILLER PARTICLE POSITION AND DENSITY MANIPULATION WITH APPLICATIONS...

DIE STACK ARRANGEMENT AND METHOD FOR PRODUCING SAME

DIE BONDING RESIN LAYER FORMING APPARATUS

CHIP MOUNTING STRUCTURE

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURIN...

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

WAFER LEVEL PACKAGING USING A CATALYTIC ADHESIVE

COMPONENT PLACEMENT ON FLEXIBLE AND/OR STRETCHABLE SUBSTRATES

PATTERNABLE ADHESIVE COMPOSITION, SEMICONDUCTOR PACKAGE USING THE S...

METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR...