Curing and solidification

Industry

CPC
H01L2224/11515

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11515Curing and solidification

Industries

Patents Grantslast 30 patents

Information Patent Grant
Conductive terminal for side facing packages
- Patent number 12,080,667
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming first protective film
- Patent number 11,781,033
- Issue date Oct 10, 2023
- Lintec Corporation
- Masanori Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed repassivation for wafer chip scale packaging
- Patent number 10,541,220
- Issue date Jan 21, 2020
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 10,177,108
- Issue date Jan 8, 2019
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Formation of connectors without UBM
- Patent number 9,673,158
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 9,532,495
- Issue date Dec 27, 2016
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridisation of two microelectronic components using a U...
- Patent number 9,318,453
- Issue date Apr 19, 2016
- Commissariat a l'Energie Atomique et aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of connectors without UBM
- Patent number 8,987,605
- Issue date Mar 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,378,486
- Issue date Feb 19, 2013
- Renesas Electronics Corporation
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive structure on a semiconductor substrate form...
- Patent number 8,067,305
- Issue date Nov 29, 2011
- Ultratech, Inc.
- Arthur W. Zafiropoulo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 8,008,182
- Issue date Aug 30, 2011
- Seiko Epson Corporation
- Tatsuhiko Asakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of contact structure
- Patent number 7,871,918
- Issue date Jan 18, 2011
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 7,871,917
- Issue date Jan 18, 2011
- Fujitsu Semiconductor Limited
- Joji Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure having a compliant bump and a test pad
- Patent number 7,834,453
- Issue date Nov 16, 2010
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,750,468
- Issue date Jul 6, 2010
- Seiko Epson Corporation
- Tatsuhiko Asakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device in which a plurality of electronic components...
- Patent number 6,940,175
- Issue date Sep 6, 2005
- Sharp Kabushiki Kaisha
- Yoshihide Iwazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20240413113
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND Manufacturing METHOD THEREOF
- Publication number 20240203920
- Publication date Jun 20, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20230268302
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230089483
- Publication date Mar 23, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOKAZU ITOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL AND CONNECTION METHOD
- Publication number 20230075929
- Publication date Mar 9, 2023
- SONY GROUP CORPORATION
- JO UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING
- Publication number 20200043878
- Publication date Feb 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN FILM AND FIRST PROTECTIVE FILM FORMING SHEET
- Publication number 20180320029
- Publication date Nov 8, 2018
- LINTEC CORPORATION
- Masanori YAMAGISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...
- Publication number 20180315731
- Publication date Nov 1, 2018
- Intel Corporation
- Kosuke Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Manufacturing Method
- Publication number 20160233184
- Publication date Aug 11, 2016
- Nitto Denko Corporation
- Hiroyuki Hanazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150054124
- Publication date Feb 26, 2015
- XINTEC INC.
- Wei-Ming LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...
- Publication number 20150021764
- Publication date Jan 22, 2015
- Amkor Technology, Inc.
- JongSik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...
- Publication number 20140049922
- Publication date Feb 20, 2014
- MURATA MANUFACTURING CO., LTD.
- Shinya KIYONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of Connectors without UBM
- Publication number 20130075139
- Publication date Mar 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20110140269
- Publication date Jun 16, 2011
- Renesas Electronics Corporation
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20110095420
- Publication date Apr 28, 2011
- RENESAS ELECTRONICS CORPORATION
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100201001
- Publication date Aug 12, 2010
- SEIKO EPSON CORPORATION
- Tatsuhiko ASAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...
- Publication number 20100159644
- Publication date Jun 24, 2010
- Rajiv Carl Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically conductive structure on a semiconductor substrate form...
- Publication number 20100055895
- Publication date Mar 4, 2010
- Arthur W. Zafiropoulo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CONTACT STRUCTURE
- Publication number 20090149015
- Publication date Jun 11, 2009
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080197505
- Publication date Aug 21, 2008
- SEIKO EPSON CORPORATION
- Tatsuhiko ASAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20080023832
- Publication date Jan 31, 2008
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20070197016
- Publication date Aug 23, 2007
- FUJITSU LIMITED
- Joji Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020190392
- Publication date Dec 19, 2002
- YOSHIHIDE IWAZAKI
- H01 - BASIC ELECTRIC ELEMENTS

Curing and solidification

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive terminal for side facing packages

Method of forming first protective film

Printed repassivation for wafer chip scale packaging

Method of manufacturing electronic component module and electronic...

Formation of connectors without UBM

Method of manufacturing electronic component module and electronic...

Flip-chip hybridisation of two microelectronic components using a U...

Formation of connectors without UBM

Semiconductor device and method of manufacturing semiconductor device

Electrically conductive structure on a semiconductor substrate form...

Semiconductor device and method for manufacturing semiconductor device

Manufacturing method of contact structure

Semiconductor device and manufacturing method for the same

Contact structure having a compliant bump and a test pad

Semiconductor device and method for manufacturing the same

Semiconductor device in which a plurality of electronic components...

Patents Applicationslast 30 patents

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

SEMICONDUCTOR DEVICE AND Manufacturing METHOD THEREOF

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

TERMINAL AND CONNECTION METHOD

PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING

CURABLE RESIN FILM AND FIRST PROTECTIVE FILM FORMING SHEET

INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...

Semiconductor Device Manufacturing Method

INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...

METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...

Formation of Connectors without UBM

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...

Electrically conductive structure on a semiconductor substrate form...

MANUFACTURING METHOD OF CONTACT STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor device and manufacturing method for the same

Semiconductor device and manufacturing method thereof