Current distribution within the bath

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S204/00Chemistry: electrical and wave energy

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Y10S204/07Current distribution within the bath

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Device and method to conduct an electrochemical reaction on a surfa...
- Patent number 8,795,503
- Issue date Aug 5, 2014
- Alchimer
- Said Zahraoui
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus for an enhanced magnetic plating method
- Patent number 8,168,045
- Issue date May 1, 2012
- International Business Corporation
- Matteo Flotta
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductive counter electrode for electrolytic current distribut...
- Patent number 8,147,660
- Issue date Apr 3, 2012
- Novellus Systems, Inc.
- Steven T. Mayer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of electroplating using a high resistance ionic current source
- Patent number 7,967,969
- Issue date Jun 28, 2011
- Novellus Systems, Inc.
- Steven T. Mayer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Enhanced magnetic plating method
- Patent number 7,964,081
- Issue date Jun 21, 2011
- International Business Machines Corporation
- Matteo Flotta
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electroplating apparatus and method based on an array of anodes
- Patent number 7,935,240
- Issue date May 3, 2011
- Applied Materials, Inc.
- Saravjeet Singh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metal plating process
- Patent number 7,704,365
- Issue date Apr 27, 2010
- International Business Machines Corporation
- Johji Nakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic apparatus for use in oxide electrowinning method
- Patent number 7,635,421
- Issue date Dec 22, 2009
- Japan Nuclear Cycle Development Institute
- Kenji Koizumi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High resistance ionic current source
- Patent number 7,622,024
- Issue date Nov 24, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anodic oxidation apparatus
- Patent number 7,569,124
- Issue date Aug 4, 2009
- Tokyo Electron Limited and Matsushita Electric Works, Ltd.
- Yasushi Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for electrochemically processing a workpiece
- Patent number 7,566,386
- Issue date Jul 28, 2009
- Semitool, Inc.
- Gregory J. Wilson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for airfoil electroplating
- Patent number 7,560,014
- Issue date Jul 14, 2009
- General Electric Company
- Michael Rucker
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for controlling thickness uniformity of electroplated layers
- Patent number 7,435,323
- Issue date Oct 14, 2008
- Novellus Systems, Inc.
- Bulent M. Basol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective shield/material flow mechanism
- Patent number 7,425,256
- Issue date Sep 16, 2008
- International Business Machines Corporation
- Ralph A. Barrese
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus and method for electrochemically depositing metal on a se...
- Patent number 7,332,066
- Issue date Feb 19, 2008
- Semitool, Inc.
- Linlin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for depositing a layer of material on a substrate
- Patent number 7,323,094
- Issue date Jan 29, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective shield/material flow mechanism
- Patent number 7,288,177
- Issue date Oct 30, 2007
- International Business Machines Corporation
- Ralph A. Barrese
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Workpiece processor having processing chamber with improved process...
- Patent number 7,267,749
- Issue date Sep 11, 2007
- Semitool, Inc.
- Gregory J. Wilson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dual contact ring and method for metal ECP process
- Patent number 7,252,750
- Issue date Aug 7, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Wen Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Anodization device and anodization method
- Patent number 7,169,283
- Issue date Jan 30, 2007
- Tokyo Electron Limited
- Yasushi Yagi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Turning electrodes used in a reactor for electrochemically processi...
- Patent number 7,160,421
- Issue date Jan 9, 2007
- Semitool, Inc.
- Gregory J. Wilson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus and method for electrochemically depositing metal on a se...
- Patent number 7,115,196
- Issue date Oct 3, 2006
- Semitool, Inc.
- Linlin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and system for eliminating gas bubbles during electrochemic...
- Patent number 7,045,040
- Issue date May 16, 2006
- ASM NuTool, Inc.
- Bulent M. Basol
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Cup type plating apparatus
- Patent number 6,991,711
- Issue date Jan 31, 2006
- Electroplating Engineers of Japan Limited
- Yasuhiko Sakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for controlling ion distribution during plating o...
- Patent number 6,974,530
- Issue date Dec 13, 2005
- Advanced Micro Devices, Inc.
- Matthias Bonkass
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electroplating panel with plating thickness-compensation structures
- Patent number 6,966,976
- Issue date Nov 22, 2005
- Hutchinson Technology Incorporated
- Colin M. Mcgraw
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Liquid treatment method using alternating electrical contacts
- Patent number 6,953,522
- Issue date Oct 11, 2005
- Tokyo Electron Limited
- Kyungho Park
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Diffuser with spiral opening pattern for electroplating reactor vessel
- Patent number 6,881,309
- Issue date Apr 19, 2005
- Semitool, Inc.
- Kyle M. Hanson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metal plating apparatus and process
- Patent number 6,827,827
- Issue date Dec 7, 2004
- International Business Machines Corporation
- Johji Nakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for improved current density and feature fill...
- Patent number 6,811,669
- Issue date Nov 2, 2004
- Texas Instruments Incorporated
- David Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD TO CONDUCT AN ELECTROCHEMICAL REACTION ON A SURFA...
- Publication number 20120000785
- Publication date Jan 5, 2012
- ALCHIMER
- Said Zahraoui
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENHANCED MAGNETIC PLATING METHOD
- Publication number 20110220020
- Publication date Sep 15, 2011
- International Business Machines Corporation
- MATTEO FLOTA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS BASED ON AN ARRAY OF ANODES
- Publication number 20110198229
- Publication date Aug 18, 2011
- APPLIED MATERIALS, INC.
- SARAVJEET SINGH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for electrochemically depositing metal on a se...
- Publication number 20100116671
- Publication date May 13, 2010
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
High Resistance Ionic Current Source
- Publication number 20100032304
- Publication date Feb 11, 2010
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Enhanced Magnetic Plating Method and Apparatus
- Publication number 20090050486
- Publication date Feb 26, 2009
- International Business Machines Corporation
- Matteo Flotta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR AIRFOIL ELECTROPLATING, AND AIRFOIL
- Publication number 20080302667
- Publication date Dec 11, 2008
- GENERAL ELECTRIC COMPANY
- Michael Rucker
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL PLATING APPARATUS AND PROCESS
- Publication number 20080041726
- Publication date Feb 21, 2008
- Johji Nakamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELECTIVE SHIELD/MATERIAL FLOW MECHANISM
- Publication number 20080000777
- Publication date Jan 3, 2008
- International Business Machines Corporation
- Ralph A. Barrese
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating apparatus based on an array of anodes
- Publication number 20070068819
- Publication date Mar 29, 2007
- Saravjeet Singh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for airfoil electroplating, and airfoil
- Publication number 20060275624
- Publication date Dec 7, 2006
- GENERAL ELECTRIC COMPANY
- Michael Rucker
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic apparatus for use in oxide electrowinning method
- Publication number 20060151326
- Publication date Jul 13, 2006
- Kenji Koizumi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Tuning electrodes used in a reactor for electrochemically processin...
- Publication number 20060000716
- Publication date Jan 5, 2006
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for electrochemically depositing metal on a se...
- Publication number 20050245083
- Publication date Nov 3, 2005
- Semitool, Inc.
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System for electrochemically processing a workpiece
- Publication number 20050224340
- Publication date Oct 13, 2005
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Selective shield/material flow mechanism
- Publication number 20050218002
- Publication date Oct 6, 2005
- International Business Machines Corporation
- Ralph A. Barrese
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System for electrochemically processing a workpiece
- Publication number 20050167265
- Publication date Aug 4, 2005
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System for electrochemically processing a workpiece
- Publication number 20050109625
- Publication date May 26, 2005
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System for electrochemically processing a workpiece
- Publication number 20050109629
- Publication date May 26, 2005
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System for electrochemically processing a workpiece
- Publication number 20050109633
- Publication date May 26, 2005
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System for electrochemically processing a workpiece
- Publication number 20050109628
- Publication date May 26, 2005
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Anodic oxidation apparatus, anodic oxidation method, and panel for...
- Publication number 20050077183
- Publication date Apr 14, 2005
- Yasushi Yagi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Dual contact ring and method for metal ECP process
- Publication number 20050056544
- Publication date Mar 17, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Wen Liu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for controlling thickness uniformity of electr...
- Publication number 20040231994
- Publication date Nov 25, 2004
- NuTool Inc.
- Bulent M. Basol
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process and system for eliminating gas bubbles during electrochemic...
- Publication number 20040182712
- Publication date Sep 23, 2004
- Bulent M. Basol
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System for electrochemically processing a workpiece
- Publication number 20040099533
- Publication date May 27, 2004
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Anodization device and anodization method
- Publication number 20040089552
- Publication date May 13, 2004
- Yasushi Yagi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal plating apparatus and process
- Publication number 20040079644
- Publication date Apr 29, 2004
- International Business Machines Corporation
- Johji Nakamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Workpiece processor having processing chamber with improved process...
- Publication number 20040055877
- Publication date Mar 25, 2004
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for electrochemically depositing metal on a se...
- Publication number 20040031693
- Publication date Feb 19, 2004
- Linlin Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Current distribution within the bath

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device and method to conduct an electrochemical reaction on a surfa...

Apparatus for an enhanced magnetic plating method

Semiconductive counter electrode for electrolytic current distribut...

Method of electroplating using a high resistance ionic current source

Enhanced magnetic plating method

Electroplating apparatus and method based on an array of anodes

Metal plating process

Electrolytic apparatus for use in oxide electrowinning method

High resistance ionic current source

Anodic oxidation apparatus

System for electrochemically processing a workpiece

Method for airfoil electroplating

Method for controlling thickness uniformity of electroplated layers

Selective shield/material flow mechanism

Apparatus and method for electrochemically depositing metal on a se...

Process for depositing a layer of material on a substrate

Selective shield/material flow mechanism

Workpiece processor having processing chamber with improved process...

Dual contact ring and method for metal ECP process

Anodization device and anodization method

Turning electrodes used in a reactor for electrochemically processi...

Apparatus and method for electrochemically depositing metal on a se...

Process and system for eliminating gas bubbles during electrochemic...

Cup type plating apparatus

Method and system for controlling ion distribution during plating o...

Electroplating panel with plating thickness-compensation structures

Liquid treatment method using alternating electrical contacts

Diffuser with spiral opening pattern for electroplating reactor vessel

Metal plating apparatus and process

Methods and apparatus for improved current density and feature fill...

Patents Applicationslast 30 patents

DEVICE AND METHOD TO CONDUCT AN ELECTROCHEMICAL REACTION ON A SURFA...

ENHANCED MAGNETIC PLATING METHOD

ELECTROPLATING APPARATUS BASED ON AN ARRAY OF ANODES

Apparatus and method for electrochemically depositing metal on a se...

High Resistance Ionic Current Source

Enhanced Magnetic Plating Method and Apparatus

METHOD AND APPARATUS FOR AIRFOIL ELECTROPLATING, AND AIRFOIL

METAL PLATING APPARATUS AND PROCESS

SELECTIVE SHIELD/MATERIAL FLOW MECHANISM

Electroplating apparatus based on an array of anodes

Method and apparatus for airfoil electroplating, and airfoil

Electrolytic apparatus for use in oxide electrowinning method

Tuning electrodes used in a reactor for electrochemically processin...

Apparatus and method for electrochemically depositing metal on a se...

System for electrochemically processing a workpiece

Selective shield/material flow mechanism

System for electrochemically processing a workpiece

System for electrochemically processing a workpiece

System for electrochemically processing a workpiece

System for electrochemically processing a workpiece

System for electrochemically processing a workpiece

Anodic oxidation apparatus, anodic oxidation method, and panel for...

Dual contact ring and method for metal ECP process

Method and apparatus for controlling thickness uniformity of electr...

Process and system for eliminating gas bubbles during electrochemic...

System for electrochemically processing a workpiece

Anodization device and anodization method

Metal plating apparatus and process

Workpiece processor having processing chamber with improved process...

Apparatus and method for electrochemically depositing metal on a se...