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CHEMISTRY METALLURGY
C25
Electrolytic processing
C25D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR
C25D17/00
Constructional parts, or assemblies thereof, of cells for electrolytic coating
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C25D17/008
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Patents Grants
last 30 patents
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Patent Grant
Systems and methods for shielding features of a workpiece during el...
Patent number
11,987,897
Issue date
May 21, 2024
Applied Materials, Inc.
Eric J. Bergman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroplating systems and methods for wear-resistant coatings
Patent number
11,834,752
Issue date
Dec 5, 2023
Honeywell International Inc.
Glenn Sklar
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plate, plating apparatus, and method of manufacturing plate
Patent number
11,725,296
Issue date
Aug 15, 2023
Ebara Corporation
Mitsuhiro Shamoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Regulation plate, anode holder, and substrate holder
Patent number
11,686,009
Issue date
Jun 27, 2023
Ebara Corporation
Naoki Shimomura
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Printed wiring board production method and printed wiring board pro...
Patent number
11,672,082
Issue date
Jun 6, 2023
Sumitomo Electric Industries, Ltd.
Junichi Motomura
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Film formation device and film formation method for metallic coating
Patent number
11,643,745
Issue date
May 9, 2023
Toyota Jidosha Kabushiki Kaisha
Akira Kato
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electrochemical deposition systems
Patent number
11,608,563
Issue date
Mar 21, 2023
ASMPT NEXX, INC.
Arthur Keigler
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
High resistance virtual anode for electroplating cell
Patent number
11,608,566
Issue date
Mar 21, 2023
Taiwan Semiconductor Manufacturing Company Limited
Po-Wei Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Dual wafer plating fixture for a continuous plating line
Patent number
11,598,018
Issue date
Mar 7, 2023
SunPower Corporation
Hung-Ming Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Cross flow conduit for foaming prevention in high convection platin...
Patent number
11,585,007
Issue date
Feb 21, 2023
Lam Research Corporation
Stephen J. Banik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Methods of preparing articles by electrodeposition and additive man...
Patent number
11,560,629
Issue date
Jan 24, 2023
Modumetal, Inc.
John D. Whitaker
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Electroplating apparatus for tailored uniformity profile
Patent number
11,549,192
Issue date
Jan 10, 2023
Novellus Systems, Inc.
Steven T. Mayer
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plating apparatus
Patent number
11,542,624
Issue date
Jan 3, 2023
Ebara Corporation
Kazuhito Tsuji
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Systems and methods for enclosed electroplating chambers
Patent number
11,542,626
Issue date
Jan 3, 2023
Honeywell International Inc.
James Piascik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Conductive external connector structure and method of forming
Patent number
11,527,504
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Fu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Masking and sealing system for multi-step surface treatment
Patent number
11,453,954
Issue date
Sep 27, 2022
Honeywell International Inc.
Joseph William Mintzer
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plating apparatus
Patent number
11,332,838
Issue date
May 17, 2022
Ebara Corporation
Gaku Yamasaki
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Printed wiring board production method and printed wiring board pro...
Patent number
11,330,718
Issue date
May 10, 2022
Sumitomo Electric Industries, Ltd.
Junichi Motomura
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method for determining location of power feeding point in electropl...
Patent number
11,319,642
Issue date
May 3, 2022
Ebara Corporation
Mitsuhiro Shamoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Substrate holder and plating device
Patent number
11,280,020
Issue date
Mar 22, 2022
Ebara Corporation
Naoki Shimomura
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Regulation plate, anode holder, and substrate holder
Patent number
11,268,207
Issue date
Mar 8, 2022
Ebara Corporation
Naoki Shimomura
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plating apparatus and plating method
Patent number
11,098,413
Issue date
Aug 24, 2021
Ebara Corporation
Shao Hua Chang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plating system, a plating system control method, and a storage medi...
Patent number
11,098,414
Issue date
Aug 24, 2021
Ebara Corporation
Takashi Mitsuya
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Plating apparatus and plating method
Patent number
11,047,063
Issue date
Jun 29, 2021
Ebara Corporation
Jumpei Fujikata
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Dynamic modulation of cross flow manifold during elecroplating
Patent number
11,047,059
Issue date
Jun 29, 2021
Lam Research Corporation
Kari Thorkelsson
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Substrate holder, a method for holding a substrate with a substrate...
Patent number
11,037,791
Issue date
Jun 15, 2021
Ebara Corporation
Mizuki Nagai
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Film forming method for metal film and film forming apparatus for m...
Patent number
11,035,049
Issue date
Jun 15, 2021
Toyota Jidosha Kabushiki Kaisha
Hirofumi Iisaka
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Methods and apparatus for flow isolation and focusing during electr...
Patent number
11,001,934
Issue date
May 11, 2021
Lam Research Corporation
Stephen J. Banik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroplating device
Patent number
10,968,530
Issue date
Apr 6, 2021
Ebara Corporation
Mitsuhiro Shamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for determining location of power feeding point in electropl...
Patent number
10,934,630
Issue date
Mar 2, 2021
Ebara Corporation
Mitsuhiro Shamoto
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF ADJUSTING PLATING MODULE
Publication number
20240183059
Publication date
Jun 6, 2024
EBARA CORPORATION
Yasuyuki Masuda
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...
Publication number
20240141541
Publication date
May 2, 2024
LAM RESEARCH CORPORATION
Lee Peng Chua
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING APPARATUS
Publication number
20230366120
Publication date
Nov 16, 2023
EBARA CORPORATION
Masashi SHIMOYAMA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SHIELD BODY SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROL...
Publication number
20230313407
Publication date
Oct 5, 2023
Semsysco GmbH
Herbert ÖTZLINGER
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Distribution System for a Process Fluid for a Chemical and/or Elect...
Publication number
20230250547
Publication date
Aug 10, 2023
Semsysco GmbH
Andreas Gleissner
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
DUAL WAFER PLATING FIXTURE FOR A CONTINUOUS PLATING LINE
Publication number
20230193502
Publication date
Jun 22, 2023
Maxeon Solar Pte. Ltd
Hung-Ming Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
Publication number
20230175162
Publication date
Jun 8, 2023
LAM RESEARCH CORPORATION
Stephen J. Banik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING APPARATUS
Publication number
20230167574
Publication date
Jun 1, 2023
EBARA CORPORATION
Ryosuke Hiwatashi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND ELECTRIC CURRENT FOR CH...
Publication number
20230075605
Publication date
Mar 9, 2023
Semsysco GmbH
Herbert ÖTZLINGER
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTRODE AND APPARATUS FOR ELECTROLYTICALLY TREATING A WORKPIECE,...
Publication number
20230062477
Publication date
Mar 2, 2023
Atotech Deutschland GmbH & Co. KG
Henry KUNZE
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTI...
Publication number
20230056444
Publication date
Feb 23, 2023
Semsysco GmbH
Andreas GLEISSNER
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
WAFER SHIELDING FOR PREVENTION OF LIPSEAL PLATE-OUT
Publication number
20220396894
Publication date
Dec 15, 2022
LAM RESEARCH CORPORATION
Gregory J. Kearns
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROPLATING SYSTEMS AND METHODS FOR WEAR-RESISTANT COATINGS
Publication number
20220349083
Publication date
Nov 3, 2022
Honeywell International Inc.
Glenn Sklar
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
LOW ANGLE MEMBRANE FRAME FOR AN ELECTROPLATING CELL
Publication number
20220298667
Publication date
Sep 22, 2022
LAM RESEARCH CORPORATION
Frederick Dean WILMOT
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PRINTED WIRING BOARD PRODUCTION METHOD AND PRINTED WIRING BOARD PRO...
Publication number
20220240388
Publication date
Jul 28, 2022
Sumitomo Electric Industries, Ltd.
Junichi MOTOMURA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING APPARATUS AND PLATING METHOD
Publication number
20220178046
Publication date
Jun 9, 2022
EBARA CORPORATION
Masaki Tomita
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROPLATING SHIELD DEVICE AND METHODS OF FABRICATING THE SAME
Publication number
20220178045
Publication date
Jun 9, 2022
Honeywell International Inc.
James PIASCIK
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
REGULATION PLATE, ANODE HOLDER, AND SUBSTRATE HOLDER
Publication number
20220154363
Publication date
May 19, 2022
EBARA CORPORATION
Naoki SHIMOMURA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING APPARATUS
Publication number
20220106700
Publication date
Apr 7, 2022
EBARA CORPORATION
Kazuhito Tsuji
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MASKING AND SEALING SYSTEM FOR MULTI-STEP SURFACE TREATMENT
Publication number
20220106699
Publication date
Apr 7, 2022
Honeywell International Inc.
Joseph William Mintzer
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
FILM FORMATION DEVICE AND FILM FORMATION METHOD FOR METALLIC COATING
Publication number
20220081797
Publication date
Mar 17, 2022
Toyota Jidosha Kabushiki Kaisha
Akira Kato
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROLESS PLATING PROCESS
Publication number
20220010452
Publication date
Jan 13, 2022
Intel Corporation
Chandrasekharan NAIR
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
Publication number
20210395913
Publication date
Dec 23, 2021
LAM RESEARCH CORPORATION
Stephen J. Banik
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATE, PLATING APPARATUS, AND METHOD OF MANUFACTURING PLATE
Publication number
20210355596
Publication date
Nov 18, 2021
EBARA CORPORATION
Mitsuhiro Shamoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE
Publication number
20210148001
Publication date
May 20, 2021
Novellus Systems, Inc.
Steven T. Mayer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE HOLDER AND PLATING DEVICE
Publication number
20210054521
Publication date
Feb 25, 2021
EBARA CORPORATION
Naoki SHIMOMURA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Conductive External Connector Structure and Method of Forming
Publication number
20200373267
Publication date
Nov 26, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Meng-Fu Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF PREPARING ARTICLES BY ELECTRODEPOSITION AND ADDITIVE MAN...
Publication number
20200354846
Publication date
Nov 12, 2020
Modumetal, Inc.
John D. WHITAKER
B22 - CASTING POWDER METALLURGY
Information
Patent Application
HIGH RESISTANCE VIRTUAL ANODE FOR ELECTROPLATING CELL
Publication number
20200325592
Publication date
Oct 15, 2020
Taiwan Semiconductor Manufacturing Company Limited
Po-Wei WANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
DUAL WAFER PLATING FIXTURE FOR A CONTINUOUS PLATING LINE
Publication number
20190301047
Publication date
Oct 3, 2019
SunPower Corporation
Hung-Ming Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR