Curtain coating

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2742Curtain coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for repairing a light-emitting device and a method for manuf...
- Patent number 11,916,041
- Issue date Feb 27, 2024
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 11,776,868
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing anisotropic conductive adhesive including...
- Patent number 10,854,572
- Issue date Dec 1, 2020
- NOPION.CO.LTD
- Kyung Sub Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactive hot-melt adhesive for use on electronics
- Patent number 9,659,832
- Issue date May 23, 2017
- H. B. Fuller Company
- Albert M. Giorgini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of making same
- Patent number 9,613,932
- Issue date Apr 4, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a polymer disposed on a carrier
- Patent number 9,318,473
- Issue date Apr 19, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of making same
- Patent number 9,117,813
- Issue date Aug 25, 2015
- General Electric Company
- Paul Alan McConnelee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 9,034,751
- Issue date May 19, 2015
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 8,802,553
- Issue date Aug 12, 2014
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 8,629,041
- Issue date Jan 14, 2014
- Kabushiki Kaisha Toshiba
- Yasuo Tane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable amine, carboxylic acid flux composition and method of solde...
- Patent number 8,430,293
- Issue date Apr 30, 2013
- Rohm and Haas Electronic Materials LLC
- Avin V. Dhoble
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curable flux composition and method of soldering
- Patent number 8,430,295
- Issue date Apr 30, 2013
- Rohm and Haas Electronic Materials LLC
- Michael K. Gallagher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
- Publication date Jul 11, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240131633
- Publication date Apr 25, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES
- Publication number 20230268309
- Publication date Aug 24, 2023
- SUMITOMO CHEMICAL CO., LTD.
- Martin Humphries
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...
- Publication number 20230223315
- Publication date Jul 13, 2023
- Laird Technologies, Inc.
- Jason L. STRADER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...
- Publication number 20220181293
- Publication date Jun 9, 2022
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTIVE ADHESIVE INCLUDING...
- Publication number 20200010740
- Publication date Jan 9, 2020
- NOPION.CO.LTD
- Kyung Sub LEE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for Mounting a Semiconductor Chip on a Carrier
- Publication number 20140329361
- Publication date Nov 6, 2014
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE HOT-MELT ADHESIVE FOR USE ON ELECTRONICS
- Publication number 20140242323
- Publication date Aug 28, 2014
- Albert M. Giorgini
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DEVICE FOR PROPERLY APPLYING CONDUCTIVE GLUE ON PHOTOELECTRIC ELEMENT
- Publication number 20140216338
- Publication date Aug 7, 2014
- CHIH-CHEN LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME
- Publication number 20130334706
- Publication date Dec 19, 2013
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method for Semiconductor Device and Semiconductor Device
- Publication number 20130277824
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Curable Amine, Carboxylic Acid Flux Composition And Method Of Solde...
- Publication number 20130082092
- Publication date Apr 4, 2013
- Rohm and Haas Electronic Materials L.L.C.
- Avin V. Dhoble
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE FLUX COMPOSITION AND METHOD OF SOLDERING
- Publication number 20130082089
- Publication date Apr 4, 2013
- Rohm and Haas Electronic Materials L.L.C.
- Michael K. Gallagher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE
- Publication number 20130068373
- Publication date Mar 21, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Michael SCHÄFER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Mounting a Semiconductor Chip on a Carrier
- Publication number 20120208323
- Publication date Aug 16, 2012
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR...
- Publication number 20120181686
- Publication date Jul 19, 2012
- Samsung Electronics Co., Ltd.
- Joon Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110263078
- Publication date Oct 27, 2011
- Kyocera Chemical Corporation
- Yasuo TANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device mounting method and device transport apparatus
- Publication number 20050196901
- Publication date Sep 8, 2005
- Kazuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Curtain coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for repairing a light-emitting device and a method for manuf...

Methods for establishing thermal joints between heat spreaders or l...

Method for manufacturing anisotropic conductive adhesive including...

Engineered polymer-based electronic materials

Method for manufacturing semiconductor apparatus, method for manufa...

3D packaging method for semiconductor components

Reactive hot-melt adhesive for use on electronics

Integrated circuit package and method of making same

Semiconductor device including a polymer disposed on a carrier

Integrated circuit package and method of making same

Method for mounting a semiconductor chip on a carrier

Method for mounting a semiconductor chip on a carrier

Method for manufacturing semiconductor device

Curable amine, carboxylic acid flux composition and method of solde...

Curable flux composition and method of soldering

Patents Applicationslast 30 patents

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES

METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...

METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...

METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTIVE ADHESIVE INCLUDING...

Method for Mounting a Semiconductor Chip on a Carrier

REACTIVE HOT-MELT ADHESIVE FOR USE ON ELECTRONICS

DEVICE FOR PROPERLY APPLYING CONDUCTIVE GLUE ON PHOTOELECTRIC ELEMENT

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME

Manufacturing Method for Semiconductor Device and Semiconductor Device

Curable Amine, Carboxylic Acid Flux Composition And Method Of Solde...

CURABLE FLUX COMPOSITION AND METHOD OF SOLDERING

PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE

Method for Mounting a Semiconductor Chip on a Carrier

METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Device mounting method and device transport apparatus