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  • H05K2201/0939
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/0939Curved pads
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240431030
    • Publication date Dec 26, 2024
    • SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    • Michi OGATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMPLANTABLE ELECTRONIC DEVICES
    • Publication number 20240416134
    • Publication date Dec 19, 2024
    • CURONIX LLC
    • Laura Tyler Perryman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD DEVICE
    • Publication number 20240397621
    • Publication date Nov 28, 2024
    • Unimicron Technology Corp.
    • Chin-Hsun WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20240334603
    • Publication date Oct 3, 2024
    • Chengdu BOE Optoelectronics Technology Co., Ltd.
    • Ren XIONG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SEMICONDUCTOR STORAGE DEVICE
    • Publication number 20240314929
    • Publication date Sep 19, 2024
    • KIOXIA Corporation
    • Kiyokazu ISHIZAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC SYSTEM
    • Publication number 20240314920
    • Publication date Sep 19, 2024
    • MEDIATEK INC.
    • Tso-Ju YI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240234326
    • Publication date Jul 11, 2024
    • IBIDEN CO., LTD.
    • Ikuya TERAUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240215159
    • Publication date Jun 27, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang-min Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERPOSER AND ELECTRONIC DEVICE COMPRISING SAME
    • Publication number 20240196517
    • Publication date Jun 13, 2024
    • Samsung Electronics Co., Ltd.
    • Youngsun JO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
    • Publication number 20240147621
    • Publication date May 2, 2024
    • Hitachi Astemo, Ltd.
    • Narutoshi YAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240136294
    • Publication date Apr 25, 2024
    • IBIDEN CO., LTD.
    • Ikuya TERAUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240114620
    • Publication date Apr 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Min LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BOND PAD CONNECTOR FOR SECURING AN ELECTRONIC COMPONENT THEREON
    • Publication number 20240098895
    • Publication date Mar 21, 2024
    • Jabil Inc.
    • Lun Hao Tung
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240098896
    • Publication date Mar 21, 2024
    • PanelSemi Corporation
    • Chin-Tang LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20240090128
    • Publication date Mar 14, 2024
    • Nitto Denko Corporation
    • Yusaku TAMAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE HAVING PAD STRUCTURE
    • Publication number 20240049387
    • Publication date Feb 8, 2024
    • Samsung Electronics Co., Ltd.
    • Hansu CHEON
    • G04 - HOROLOGY
  • Information Patent Application

    Overlap Joint Flex Circuit Board Interconnection
    • Publication number 20240049392
    • Publication date Feb 8, 2024
    • Google LLC
    • John Martinis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE...
    • Publication number 20230422398
    • Publication date Dec 28, 2023
    • Global Unichip Corporation
    • Chih-Chieh LIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD FOR GALVANIC EFFECT REDUCTION
    • Publication number 20230328873
    • Publication date Oct 12, 2023
    • Western Digital Technologies, Inc.
    • Lin Hui Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PAD ARRANGING METHOD AND PAD ARRANGEMENT STRUCTURE
    • Publication number 20230209713
    • Publication date Jun 29, 2023
    • KINPO ELECTRONICS, INC.
    • Chuan-Wang CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230171882
    • Publication date Jun 1, 2023
    • LG Innotek Co., Ltd.
    • Hae Sik KIM
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    • Publication number 20220353987
    • Publication date Nov 3, 2022
    • KYOCERA CORPORATION
    • Seiichirou ITOU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20220304152
    • Publication date Sep 22, 2022
    • ZTE Corporation
    • Changgang YIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIGHT EMITTING DIODE (LED) PACKAGE AND ILLUMINATING DEVICE INCLUDIN...
    • Publication number 20220223774
    • Publication date Jul 14, 2022
    • Samsung Electronics Co.,Ltd.
    • Jongho LIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE BONDING STRUCTURE FOR SUBSTRATES AND DISPLAY DEVICE INCL...
    • Publication number 20220137739
    • Publication date May 5, 2022
    • SAMSUNG DISPLAY CO., LTD.
    • SEONG-SIK PARK
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20220095453
    • Publication date Mar 24, 2022
    • Samsung Electro-Mechanics CO., LTD.
    • Seong Ho CHOI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Overlap Joint Flex Circuit Board Mating
    • Publication number 20220087022
    • Publication date Mar 17, 2022
    • Google LLC
    • John Martinis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    IMAGING MODULE AND IMAGING DEVICE
    • Publication number 20220030715
    • Publication date Jan 27, 2022
    • Canon Kabushiki Kaisha
    • Takahiro Furuya
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Application

    PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
    • Publication number 20220022316
    • Publication date Jan 20, 2022
    • Unimicron Technology Corp.
    • Po-Wei Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Printed Circuit Board and Terminal
    • Publication number 20210352803
    • Publication date Nov 11, 2021
    • Huawei Technologies Co., Ltd
    • Liping Liu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR