Depaneling

Industry

CPC
H05K3/0052

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0052Depaneling

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 12,156,345
- Issue date Nov 26, 2024
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing ceramic substrate and ceramic substrate
- Patent number 11,950,360
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Koki Sai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating asymmetric board
- Patent number 11,917,769
- Issue date Feb 27, 2024
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fold flex circuit for LNOP
- Patent number 11,903,140
- Issue date Feb 13, 2024
- Masimo Corporation
- Benjamin C. Triman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit mother board and detection method thereof
- Patent number 11,871,511
- Issue date Jan 9, 2024
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 11,751,338
- Issue date Sep 5, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Unit unloading system
- Patent number 11,706,875
- Issue date Jul 18, 2023
- Rokko Systems Pte Ltd.
- Yun Suk Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adapter board and method for making adapter board
- Patent number 11,665,820
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 11,658,082
- Issue date May 23, 2023
- NGK Spark Plug Co., Ltd.
- Hirotake Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for manufacturing semiconductor modules
- Patent number 11,652,132
- Issue date May 16, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 11,602,055
- Issue date Mar 7, 2023
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,589,457
- Issue date Feb 21, 2023
- Kyocera Corporation
- Seiichirou Itou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display motherboard, manufacturing and cutting methods thereof
- Patent number 11,416,043
- Issue date Aug 16, 2022
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ming Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package and method of forming an electronic package
- Patent number 11,399,434
- Issue date Jul 26, 2022
- Intel Corporation
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor module and process for producing same
- Patent number 11,378,468
- Issue date Jul 5, 2022
- Brightsentinel Limited
- Robert Keith
- G01 - MEASURING TESTING
Information Patent Grant
Display panel and method of fabricating the same
- Patent number 11,327,372
- Issue date May 10, 2022
- Au Optronics Corporation
- Chih-Yu Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin film, and laminated film including base material film, resin...
- Patent number 11,330,721
- Issue date May 10, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomoaki Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,289,400
- Issue date Mar 29, 2022
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to metallization of ceramic substrates for shieldin...
- Patent number 11,277,901
- Issue date Mar 15, 2022
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board assembly sheet
- Patent number 11,229,116
- Issue date Jan 18, 2022
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing the printed board
- Patent number 11,229,123
- Issue date Jan 18, 2022
- Nichia Corporation
- Masaaki Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of flexible electronic device
- Patent number 11,191,166
- Issue date Nov 30, 2021
- E Ink Holdings Inc.
- Kuo-Feng Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fold flex circuit for LNOP
- Patent number 11,178,776
- Issue date Nov 16, 2021
- Masimo Corporation
- Benjamin C. Triman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded electronic module with an integrated electromagnetic shi...
- Patent number 11,166,399
- Issue date Nov 2, 2021
- Skyworks Solutions, Inc.
- Philip H. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 11,147,166
- Issue date Oct 12, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Tomoaki Shibata
- G01 - MEASURING TESTING
Information Patent Grant
PCB board, manufacturing method of PCB board and electrical device
- Patent number 11,122,681
- Issue date Sep 14, 2021
- ZOPOISE TECHNOLOGY (ZHUZHOU) CO., LTD.
- Bruce Pi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method for manufacturing same
- Patent number 11,075,224
- Issue date Jul 27, 2021
- AU OPTRONICS CORPORATION
- Hao-An Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240290632
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
- Publication number 20240260237
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Wei Hong Tew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...
- Publication number 20240213429
- Publication date Jun 27, 2024
- Nichia Corporation.
- Akiko NAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY SHEET
- Publication number 20240107679
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES
- Publication number 20240107674
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF PROCESSING SUBSTRATE
- Publication number 20240040704
- Publication date Feb 1, 2024
- VIA MECHANICS, LTD.
- Yasushi ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Gripping Plurality of Types of Circuit Boards
- Publication number 20240025669
- Publication date Jan 25, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Yong Wang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...
- Publication number 20230309239
- Publication date Sep 28, 2023
- Canon Kabushiki Kaisha
- Minoru Kambegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20230217599
- Publication date Jul 6, 2023
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS
- Publication number 20230209723
- Publication date Jun 29, 2023
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ASYMMETRIC BOARD
- Publication number 20230164927
- Publication date May 25, 2023
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20220173010
- Publication date Jun 2, 2022
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD
- Publication number 20220087020
- Publication date Mar 17, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT MOTHER BOARD AND DETECTION METHOD THEREOF
- Publication number 20210410289
- Publication date Dec 30, 2021
- Wuhan Tianma Micro-Electronics Co., Ltd.
- Han WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Film Electrostatic Concentration For Radon Detection
- Publication number 20210396895
- Publication date Dec 23, 2021
- National Research Council of Canada
- Ryan Hunter GRIFFIN
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE
- Publication number 20210360777
- Publication date Nov 18, 2021
- Murata Manufacturing Co., Ltd.
- Koki Sai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING SEMICONDUCTOR MODULES
- Publication number 20210305308
- Publication date Sep 30, 2021
- Ningbo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD
- Publication number 20210235581
- Publication date Jul 29, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD HAVING A STIFFENING STRUCTURE
- Publication number 20210204401
- Publication date Jul 1, 2021
- Chipbond Technology Corporation
- Yu-Chen Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL AND METHOD OF FABRICATING THE SAME
- Publication number 20210026182
- Publication date Jan 28, 2021
- AU OPTRONICS CORPORATION
- Chih-Yu Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20210028086
- Publication date Jan 28, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB BOARD, MANUFACTURING METHOD OF PCB BOARD AND ELECTRICAL DEVICE
- Publication number 20200389971
- Publication date Dec 10, 2020
- ZOPOISE TECHNOLOGY (ZHUZHOU) CO., LTD.
- Bruce PI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200365500
- Publication date Nov 19, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEEDTHROUGH FABRICATION METHOD AND METHOD OF FABRICATING ENCAPSULAT...
- Publication number 20200267846
- Publication date Aug 20, 2020
- TODOC CO., LTD.
- Kyou-Sik MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN C...
- Publication number 20200253059
- Publication date Aug 6, 2020
- Hitachi Chemical Company, Ltd.
- Tomoaki SHIBATA
- G01 - MEASURING TESTING
Information Patent Application
PANEL-MOLDED ELECTRONIC ASSEMBLIES
- Publication number 20200253060
- Publication date Aug 6, 2020
- VLT, Inc.
- Patrizio Vinciarelli
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD AND APPARATUS FOR PCB WASHING
- Publication number 20200170119
- Publication date May 28, 2020
- ROKKO SYSTEMS PTE LTD
- Yun Suk SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR END ASSEMBLIES
- Publication number 20200120800
- Publication date Apr 16, 2020
- Intel Corporation
- Florence PON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB PANEL, PCB, AND MANUFACTURING METHOD
- Publication number 20200113062
- Publication date Apr 9, 2020
- LENOVO (SINGAPORE) PTE. LTD
- Hirohide Komiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PIECE WIRING SUBSTRATE, WIRING SUBSTRATE, AND METHOD FOR MANU...
- Publication number 20200107448
- Publication date Apr 2, 2020
- Kyocera Corporation
- Yoshitomo ONITSUKA
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Overmolded components having sub-flush residuals

Devices and methods related to metallization of ceramic substrates...

Method for manufacturing ceramic substrate and ceramic substrate

Method for fabricating asymmetric board

Method of manufacturing bonded body for insulation circuit substrat...

Fold flex circuit for LNOP

Flexible circuit mother board and detection method thereof

Multilayer coil circuit substrate

Panel-molded electronic assemblies

Unit unloading system

Adapter board and method for making adapter board

Wiring substrate and method of manufacturing the same

Systems and methods for manufacturing semiconductor modules

Overmolded components having sub-flush residuals

Wiring substrate

Display motherboard, manufacturing and cutting methods thereof

Electronic package and method of forming an electronic package

Sensor module and process for producing same

Display panel and method of fabricating the same

Resin film, and laminated film including base material film, resin...

Method of manufacturing bonded body for insulation circuit substrat...

Methods related to metallization of ceramic substrates for shieldin...

Board assembly sheet

Method of manufacturing the printed board

Fabrication method of flexible electronic device

Fold flex circuit for LNOP

Overmolded electronic module with an integrated electromagnetic shi...

Method for producing semiconductor device

PCB board, manufacturing method of PCB board and electrical device

Display device and method for manufacturing same

Patents Applicationslast 30 patents

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION

CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...

ASSEMBLY SHEET

CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES

METHOD OF PROCESSING SUBSTRATE

Method and Apparatus for Gripping Plurality of Types of Circuit Boards

MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...

OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS

METHOD FOR FABRICATING ASYMMETRIC BOARD

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD

FLEXIBLE CIRCUIT MOTHER BOARD AND DETECTION METHOD THEREOF

Printed Film Electrostatic Concentration For Radon Detection

METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE

SYSTEMS AND METHODS FOR MANUFACTURING SEMICONDUCTOR MODULES

ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD

FLEXIBLE CIRCUIT BOARD HAVING A STIFFENING STRUCTURE

DISPLAY PANEL AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

PCB BOARD, MANUFACTURING METHOD OF PCB BOARD AND ELECTRICAL DEVICE

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

FEEDTHROUGH FABRICATION METHOD AND METHOD OF FABRICATING ENCAPSULAT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN C...

PANEL-MOLDED ELECTRONIC ASSEMBLIES

METHOD AND APPARATUS FOR PCB WASHING

CONNECTOR END ASSEMBLIES

PCB PANEL, PCB, AND MANUFACTURING METHOD

MULTI-PIECE WIRING SUBSTRATE, WIRING SUBSTRATE, AND METHOD FOR MANU...