Membership
Tour
Register
Log in
Deposited
Follow
Industry
CPC
H01L2224/24011
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/24011
Deposited
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Encapsulated package including device dies connected via interconne...
Patent number
11,978,714
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrodes for light emitting element of a display device
Patent number
11,967,585
Issue date
Apr 23, 2024
Samsung Display Co., Ltd.
Bum Soo Kam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,948,891
Issue date
Apr 2, 2024
NEPES CO., LTD.
Sang Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die and package structure
Patent number
11,948,904
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package and manufacturing method thereof
Patent number
11,894,336
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical interconnect structure using metal bridges to interconne...
Patent number
11,810,895
Issue date
Nov 7, 2023
Honeywell Federal Manufacturing & Technologies, LLC
Barbara Diane Young
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
11,810,883
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and manufacturing method thereof
Patent number
11,798,909
Issue date
Oct 24, 2023
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Che-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
11,791,447
Issue date
Oct 17, 2023
Samsung Display Co., Ltd.
Hyun Wook Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode display with redundancy scheme
Patent number
11,778,842
Issue date
Oct 3, 2023
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Process including a re-etching process for forming a semiconductor...
Patent number
11,742,317
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor structure
Patent number
11,735,555
Issue date
Aug 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic-component-embedded substrate and method of making the same
Patent number
11,735,560
Issue date
Aug 22, 2023
Shinko Electric Industries Co., Ltd.
Yoichi Nishihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device including electrical connections on an encapsulat...
Patent number
11,676,928
Issue date
Jun 13, 2023
STMicroelectronics (Grenoble 2) SAS
Romain Coffy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pixel and display device including the same
Patent number
11,626,428
Issue date
Apr 11, 2023
Samsung Display Co., Ltd.
Hae Ju Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method of forming the same
Patent number
11,587,902
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly and method therefor
Patent number
11,557,565
Issue date
Jan 17, 2023
NXP USA, INC.
Jinbang Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device with different electrodes and light emitting elements
Patent number
11,552,063
Issue date
Jan 10, 2023
Samsung Display Co., Ltd.
Kyung Bae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wireless transmission module and manufacturing method
Patent number
11,538,774
Issue date
Dec 27, 2022
Huawei Technologies Co., Ltd.
Qijing He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor package with connection stru...
Patent number
11,532,587
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package containing device dies and interconnect die and redistribut...
Patent number
11,532,585
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,508,687
Issue date
Nov 22, 2022
Samsung Electronics Co., Ltd.
Minkyeong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and manufacturing method thereof
Patent number
11,476,397
Issue date
Oct 18, 2022
Samsung Display Co., Ltd.
Eui Suk Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and fabricating method for display device
Patent number
11,450,268
Issue date
Sep 20, 2022
Samsung Display Co., Ltd.
Chong Sup Chang
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Method of fabricating package structure
Patent number
11,450,641
Issue date
Sep 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure with landing pads and manufacturing...
Patent number
11,437,336
Issue date
Sep 6, 2022
Powertech Technology Inc.
Jeffrey Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aligning component carrier structure with known-good sections and c...
Patent number
11,430,703
Issue date
Aug 30, 2022
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Marco Gavagnin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printable 3D electronic components and structures
Patent number
11,387,178
Issue date
Jul 12, 2022
X-CELEPRINT LIMITED
Kevin G. Oswalt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode display with redundancy scheme
Patent number
11,380,862
Issue date
Jul 5, 2022
Apple Inc.
Andreas Bibi
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
11,282,804
Issue date
Mar 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240047288
Publication date
Feb 8, 2024
InnoLux Corporation
Sheng-Nan CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240030186
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Der-Chyang Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240006365
Publication date
Jan 4, 2024
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Che-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...
Publication number
20240006366
Publication date
Jan 4, 2024
Intel Corporation
Stephen Morein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20240008298
Publication date
Jan 4, 2024
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230402358
Publication date
Dec 14, 2023
Samsung Electronics Co., Ltd.
CHOONGBIN YIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20230369273
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
Publication number
20230352442
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company Co., Ltd.
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE BOTTLE-SHAPED THROUGH...
Publication number
20230352433
Publication date
Nov 2, 2023
NANYA TECHNOLOGY CORPORATION
SHENG-HUI YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE BOTTLE-SHAPED THROUGH...
Publication number
20230352434
Publication date
Nov 2, 2023
NANYA TECHNOLOGY CORPORATION
SHENG-HUI YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
Publication number
20230343668
Publication date
Oct 26, 2023
UTAC Headquarters Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME
Publication number
20230245992
Publication date
Aug 3, 2023
STMicroelectronics Pte Ltd
Jing-En LUAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230187402
Publication date
Jun 15, 2023
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Wen-Chang CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
Publication number
20230178508
Publication date
Jun 8, 2023
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Manufacturing Semiconductor Package with Connection Stru...
Publication number
20230122816
Publication date
Apr 20, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
Publication number
20230121991
Publication date
Apr 20, 2023
HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
Barbara Diane Young
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER INTERCONNECTS WITH SELF-ALIGNED HOURGLASS-SHAPED METAL CAP
Publication number
20230110587
Publication date
Apr 13, 2023
International Business Machines Corporation
Koichi Motoyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGES WITH EMBEDDED INTERPOSERS
Publication number
20230094820
Publication date
Mar 30, 2023
Rahul N. Manepalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
Publication number
20230092505
Publication date
Mar 23, 2023
Apple Inc.
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20230014450
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Jui Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20220392922
Publication date
Dec 8, 2022
SAMSUNG DISPLAY CO., LTD.
Se Hyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220367768
Publication date
Nov 17, 2022
SAMSUNG DISPLAY CO., LTD.
Sung Geun BAE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME
Publication number
20220367409
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20220293876
Publication date
Sep 15, 2022
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING TH...
Publication number
20220238474
Publication date
Jul 28, 2022
TDK Corporation
Toshiyuki ABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE AND PACKAGE STRUCTURE
Publication number
20220208711
Publication date
Jun 30, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR
Publication number
20220108973
Publication date
Apr 7, 2022
NXP USA, Inc.
Jinbang Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
Publication number
20220077097
Publication date
Mar 10, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20220045025
Publication date
Feb 10, 2022
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Che-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20210398942
Publication date
Dec 23, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS