deposition by cyclic CVD

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H01L21/0228

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/0228deposition by cyclic CVD

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor test sample and manufacturing method thereof
- Patent number 12,368,051
- Issue date Jul 22, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Rui Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
- Patent number 12,368,074
- Issue date Jul 22, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,365,987
- Issue date Jul 22, 2025
- Kokusai Electric Corporation
- Hiroaki Hiramatsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus, processing method, and non-transito...
- Patent number 12,368,043
- Issue date Jul 22, 2025
- Kokusai Electric Corporation
- Akinori Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Precursors and processes for deposition of Si-containing films usin...
- Patent number 12,368,042
- Issue date Jul 22, 2025
- L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
- Naoto Noda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,368,076
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming dielectric layers through deposition and anneal...
- Patent number 12,368,044
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device including passivation...
- Patent number 12,368,090
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor device and fabrication method therefor
- Patent number 12,369,346
- Issue date Jul 22, 2025
- Rohm Co., Ltd.
- Kenji Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solvent annealing of an organic planarization layer
- Patent number 12,362,168
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Jing Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,363,961
- Issue date Jul 15, 2025
- Infineon Technologies AG
- Carsten Schaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,362,224
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for forming a layer comprising aluminum, titani...
- Patent number 12,362,171
- Issue date Jul 15, 2025
- ASM IP Holding B.V.
- Lifu Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Field effect transistor with negative capacitance dielectric struct...
- Patent number 12,363,978
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chansyun David Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,362,156
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Atsushi Kubo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of oxides and nitrides
- Patent number 12,359,315
- Issue date Jul 15, 2025
- ASM IP Holding B.V.
- Henri Jussila
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for low temperature silicon nitride films
- Patent number 12,362,169
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Wenbo Yan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method, recording medium, and substrate proces...
- Patent number 12,351,908
- Issue date Jul 8, 2025
- Kokusai Electric Corporation
- Takeo Hanashima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gap fill methods using catalyzed deposition
- Patent number 12,351,909
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming doped metal oxide films on a substrate by cyclic...
- Patent number 12,354,872
- Issue date Jul 8, 2025
- ASM IP Holding B.V.
- Tom Blomberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of films using molybdenum precursors
- Patent number 12,351,914
- Issue date Jul 8, 2025
- Lam Research Corporation
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ultrathin atomic layer deposition film accuracy thickness control
- Patent number 12,354,871
- Issue date Jul 8, 2025
- Lam Research Corporation
- Jun Qian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microelectronics package comprising a package-on-package (PoP) arch...
- Patent number 12,347,743
- Issue date Jul 1, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for topography-selective depositions
- Patent number 12,347,675
- Issue date Jul 1, 2025
- ASM IP Holding B.V.
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Scandium precursor for SC2O3 or SC2S3 atomic layer deposition
- Patent number 12,344,627
- Issue date Jul 1, 2025
- Intel Corporation
- Patricio E. Romero
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for controlling contact resistance in cobalt-titanium struc...
- Patent number 12,347,695
- Issue date Jul 1, 2025
- Applied Materials, Inc.
- Takashi Kuratomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Treatment of spin on organic material to improve wet resistance
- Patent number 12,347,727
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Yang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon precursor compounds and method for forming silicon-containi...
- Patent number 12,347,672
- Issue date Jul 1, 2025
- Entegris, Inc.
- Sungsil Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bottom-up fill dielectric materials for semiconductor structure fab...
- Patent number 12,341,061
- Issue date Jun 24, 2025
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of SiCN thin films
- Patent number 12,341,005
- Issue date Jun 24, 2025
- ASM IP Holding B.V.
- Varun Sharma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES
- Publication number 20250239482
- Publication date Jul 24, 2025
- Intel Corporation
- Ebony L. Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPERATING A SPATIAL DEPOSITION TOOL
- Publication number 20250239479
- Publication date Jul 24, 2025
- Applied Materials, Inc.
- Joseph AuBuchon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME
- Publication number 20250239444
- Publication date Jul 24, 2025
- ASM IP HOLDING B.V.
- YoungChol Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR SELECTIVE DEPOSITION OF DIELECTRIC FILMS
- Publication number 20250239445
- Publication date Jul 24, 2025
- Applied Materials, Inc.
- Ning Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250234594
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gapfill Process Using Pulsed High-Frequency Radio-Frequency (HFRF)...
- Publication number 20250230541
- Publication date Jul 17, 2025
- Applied Materials, Inc.
- Rui Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF SELECTIVE ATOMIC LAYER DEPOSITION
- Publication number 20250230545
- Publication date Jul 17, 2025
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FILLING A GAP
- Publication number 20250232974
- Publication date Jul 17, 2025
- ASM IP HOLDING B.V.
- Sungdae Woo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING MODIFIED SUBSTRATE AND METHOD FOR MANUFACT...
- Publication number 20250230539
- Publication date Jul 17, 2025
- FUJIFILM CORPORATION
- Akihiro Hakamata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250232975
- Publication date Jul 17, 2025
- Kokusai Electric Corporation
- Kimihiko NAKATANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE PROCESSING COMPOSITION, COMPOUND, METHOD FOR P...
- Publication number 20250230321
- Publication date Jul 17, 2025
- FUJIFILM CORPORATION
- Naoya Shimoju
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEAM PERFORMANCE IMPROVEMENT FOR LARGE AREA GAPFILL
- Publication number 20250230540
- Publication date Jul 17, 2025
- Applied Materials, Inc.
- Supriya Ghosh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR SELECTIVE DEPOSITION ON DIELECTRIC MATERIALS
- Publication number 20250226205
- Publication date Jul 10, 2025
- Entegris, Inc.
- SungHae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250226206
- Publication date Jul 10, 2025
- Kokusai Electric Corporation
- Daigo YAMAGUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR PROTECTING A PERIPHERAL EDGE AND BACKSIDE OF A SEMICOND...
- Publication number 20250226208
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
- Publication number 20250226177
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Kazuhide HASEBE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250226207
- Publication date Jul 10, 2025
- Kokusai Electric Corporation
- Yasunobu KOSHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD OF MANUFACTURING DEVICE ISOLATION LAYER AND METHOD OF MANUFA...
- Publication number 20250218862
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Yunboo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED FLEXIBLE ELECTRONICS FOR LONG-TERM IMPLANTATION
- Publication number 20250213162
- Publication date Jul 3, 2025
- Northwestern University
- John A. ROGERS
- H01 - BASIC ELECTRIC ELEMENTS
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THIN FILM MODIFICATION COMPOSITION, METHOD OF FORMING THIN FILM USI...
- Publication number 20250218767
- Publication date Jul 3, 2025
- Soulbrain Co., LTD
- Seung Hyun LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING...
- Publication number 20250218790
- Publication date Jul 3, 2025
- Kokusai Electric Corporation
- Kimihiko NAKATANI
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THIN FILM MODIFICATION COMPOSITION, METHOD OF FORMING THIN FILM USI...
- Publication number 20250214919
- Publication date Jul 3, 2025
- Soulbrain Co., LTD
- Seung Hyun LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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STRUCTURES COMPRISING DIPOLE-LINED CONDUCTIVE WIRES AND RELATED SYS...
- Publication number 20250218766
- Publication date Jul 3, 2025
- ASM IP HOLDING B.V.
- Giuseppe Alessio Verni
- H01 - BASIC ELECTRIC ELEMENTS
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FILLING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250218769
- Publication date Jul 3, 2025
- Tokyo Electron Limited
- Hiroki MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM SHIELDING AGENT, METHOD OF FORMING THIN FILM USING THIN F...
- Publication number 20250214959
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- Soulbrain Co., LTD
- Seung Hyun LEE
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REDUCING CAPACITANCE IN SEMICONDUCTOR DEVICES
- Publication number 20250207246
- Publication date Jun 26, 2025
- LAM RESEARCH CORPORATION
- Ian John CURTIN
- H01 - BASIC ELECTRIC ELEMENTS
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VACUUM-BASED THIN FILM MODIFIER, THIN FILM MODIFICATION COMPOSITION...
- Publication number 20250207251
- Publication date Jun 26, 2025
- Soulbrain Co., LTD
- Chang Bong YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...
- Publication number 20250212505
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Structure
- Publication number 20250212494
- Publication date Jun 26, 2025
- IMEC vzw
- Serge Biesemans
- H01 - BASIC ELECTRIC ELEMENTS
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TEMPERATURE CONTROL MODULE FOR A FURNACE REACTOR AND METHOD OF CONT...
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- ASM IP HOLDING B.V.
- Marina Mariano
- H01 - BASIC ELECTRIC ELEMENTS

deposition by cyclic CVD

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor test sample and manufacturing method thereof

Manufacturing method of semiconductor structure comprising a gap an...

Method of processing substrate, method of manufacturing semiconduct...

Substrate processing apparatus, processing method, and non-transito...

Precursors and processes for deposition of Si-containing films usin...

Interconnect structure and methods of forming the same

Methods of forming dielectric layers through deposition and anneal...

Method of manufacturing semiconductor device including passivation...

Nitride semiconductor device and fabrication method therefor

Solvent annealing of an organic planarization layer

Semiconductor device

Semiconductor device and manufacturing method thereof

Methods and systems for forming a layer comprising aluminum, titani...

Field effect transistor with negative capacitance dielectric struct...

Substrate processing method and substrate processing apparatus

Deposition of oxides and nitrides

Methods and apparatus for low temperature silicon nitride films

Substrate processing method, recording medium, and substrate proces...

Gap fill methods using catalyzed deposition

Method for forming doped metal oxide films on a substrate by cyclic...

Deposition of films using molybdenum precursors

Ultrathin atomic layer deposition film accuracy thickness control

Microelectronics package comprising a package-on-package (PoP) arch...

Methods and systems for topography-selective depositions

Scandium precursor for SC2O3 or SC2S3 atomic layer deposition

Methods for controlling contact resistance in cobalt-titanium struc...

Treatment of spin on organic material to improve wet resistance

Silicon precursor compounds and method for forming silicon-containi...

Bottom-up fill dielectric materials for semiconductor structure fab...

Formation of SiCN thin films

Patents Applicationslast 30 patents

FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES

METHODS OF OPERATING A SPATIAL DEPOSITION TOOL

STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME

METHOD AND APPARATUS FOR SELECTIVE DEPOSITION OF DIELECTRIC FILMS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

Gapfill Process Using Pulsed High-Frequency Radio-Frequency (HFRF)...

METHODS OF SELECTIVE ATOMIC LAYER DEPOSITION

METHOD OF FILLING A GAP

METHOD FOR MANUFACTURING MODIFIED SUBSTRATE AND METHOD FOR MANUFACT...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

SEMICONDUCTOR DEVICE PROCESSING COMPOSITION, COMPOUND, METHOD FOR P...

SEAM PERFORMANCE IMPROVEMENT FOR LARGE AREA GAPFILL

METHOD FOR SELECTIVE DEPOSITION ON DIELECTRIC MATERIALS

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHODS FOR PROTECTING A PERIPHERAL EDGE AND BACKSIDE OF A SEMICOND...

FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

METHOD OF MANUFACTURING DEVICE ISOLATION LAYER AND METHOD OF MANUFA...

ENCAPSULATED FLEXIBLE ELECTRONICS FOR LONG-TERM IMPLANTATION

THIN FILM MODIFICATION COMPOSITION, METHOD OF FORMING THIN FILM USI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING...

THIN FILM MODIFICATION COMPOSITION, METHOD OF FORMING THIN FILM USI...

STRUCTURES COMPRISING DIPOLE-LINED CONDUCTIVE WIRES AND RELATED SYS...

FILLING METHOD AND SUBSTRATE PROCESSING SYSTEM

THIN FILM SHIELDING AGENT, METHOD OF FORMING THIN FILM USING THIN F...

REDUCING CAPACITANCE IN SEMICONDUCTOR DEVICES

VACUUM-BASED THIN FILM MODIFIER, THIN FILM MODIFICATION COMPOSITION...

SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...

Method for Forming a Semiconductor Structure

TEMPERATURE CONTROL MODULE FOR A FURNACE REACTOR AND METHOD OF CONT...