deposition by cyclic CVD

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H01L21/0228

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/0228deposition by cyclic CVD

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,191,144
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yi Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and method for manufacturing the same
- Patent number 12,191,150
- Issue date Jan 7, 2025
- Denso Corporation
- Hidemoto Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective molecular layer deposition of organic and hybrid organic-...
- Patent number 12,191,139
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Tapash Chakraborty
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Lithography process and material for negative tone development
- Patent number 12,189,296
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF switch device with a sidewall spacer having a low dielectric con...
- Patent number 12,183,804
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation method and film formation device
- Patent number 12,183,572
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Yumiko Kawano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Varying temperature anneal for film and structures formed thereby
- Patent number 12,176,206
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive process for circular printing
- Patent number 12,172,374
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing semiconductor device, and film-forming device
- Patent number 12,173,401
- Issue date Dec 24, 2024
- Tokyo Electron Limited
- Zeyuan Ni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
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- Issue date Dec 17, 2024
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- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Selective passivation and selective deposition
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- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method and plasma processing apparatus
- Patent number 12,170,198
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Hiroyuki Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cerium-doped ferroelectric materials and related devices and methods
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- Issue date Dec 10, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Paul C. McIntyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck assembly, planarization process, apparatus and method of manu...
- Patent number 12,165,903
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Deposition method and deposition apparatus
- Patent number 12,163,220
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Yu Komai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System for continuous atomic layer deposition
- Patent number 12,163,221
- Issue date Dec 10, 2024
- UChicago Argonne, LLC
- Jeffrey W. Elam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming a semiconductor device structure and related se...
- Patent number 12,166,099
- Issue date Dec 10, 2024
- ASM IP Holding B.V.
- Chiyu Zhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for etching a material layer for semiconductor applications
- Patent number 12,165,877
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Zhigang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of oxide thin films
- Patent number 12,154,785
- Issue date Nov 26, 2024
- ASM IP Holding B.V.
- Suvi P. Haukka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned patterning with colored blocking and structures result...
- Patent number 12,154,855
- Issue date Nov 26, 2024
- Intel Corporation
- Mohit K. Haran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial oxide materials, structures, and devices
- Patent number 12,155,009
- Issue date Nov 26, 2024
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide deposition method
- Patent number 12,148,609
- Issue date Nov 19, 2024
- ASM IP Holding B.V.
- Varun Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide layer for oxidation resistance and method forming same
- Patent number 12,148,652
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sequential plasma and thermal treatment
- Patent number 12,142,475
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Ning Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of SiOCN thin films
- Patent number 12,142,479
- Issue date Nov 12, 2024
- ASM IP Holding B.V.
- Varun Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chalcogen precursors for deposition of silicon nitride
- Patent number 12,142,477
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Chandan Kr Barik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vapor phase deposition of organic films
- Patent number 12,138,654
- Issue date Nov 12, 2024
- ASM IP Holding B.V.
- Viljami J. Pore
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,142,476
- Issue date Nov 12, 2024
- Kokusai Electric Corporation
- Masayuki Asai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 12,142,682
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
- Publication number 20250014908
- Publication date Jan 9, 2025
- ASM IP HOLDING, B.V.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION SEAM REDUCTION
- Publication number 20250014893
- Publication date Jan 9, 2025
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SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
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- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF
- Publication number 20250014890
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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USING PLASMA ENHANCED PROCESS TO DO PERIODIC MAINTENANCE
- Publication number 20250014876
- Publication date Jan 9, 2025
- SKY TECH INC.
- JUNG-HUA CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20250003068
- Publication date Jan 2, 2025
- Kokusai Electric Corporation
- Kazuyuki OKUDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON CARBIDE DEVICE
- Publication number 20250006814
- Publication date Jan 2, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang LEHNERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250006500
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Lan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250003071
- Publication date Jan 2, 2025
- Kokusai Electric Corporation
- Takeo HANASHIMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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DEPOSITION DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTU...
- Publication number 20250006488
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- Chao-Hsiu LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20250006490
- Publication date Jan 2, 2025
- Kokusai Electric Corporation
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SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240429317
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Po-Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...
- Publication number 20240429040
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- LAM RESEARCH CORPORATION
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
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ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...
- Publication number 20240429045
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION SYSTEM, PLANARIZING METHOD, AND METHOD OF MANUFACTURI...
- Publication number 20240429060
- Publication date Dec 26, 2024
- Canon Kabushiki Kaisha
- Steven C. Shackleton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INSULATING FILM BY USING ATOMIC LAYER DEPOSITION
- Publication number 20240429043
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jeonggyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240425972
- Publication date Dec 26, 2024
- Kokusai Electric Corporation
- Tomoya NAGAHASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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SUBSTRATE PROCESSING METHOD
- Publication number 20240429044
- Publication date Dec 26, 2024
- ASM IP HOLDING B.V.
- Yan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE AIR GAPS
- Publication number 20240429091
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
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NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240420954
- Publication date Dec 19, 2024
- SK HYNIX INC.
- Se-Hun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE CONTAINING PINHOLE MASKING LAYER AND METHOD OF...
- Publication number 20240421246
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Saket CHADDA
- H01 - BASIC ELECTRIC ELEMENTS
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IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION
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- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
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- Publication date Dec 12, 2024
- SK HYNIX INC.
- Se-Hun KANG
- H01 - BASIC ELECTRIC ELEMENTS
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MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS
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- Publication date Dec 12, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
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FUNCTIONALIZED CYCLOSILAZANES AS PRECURSORS FOR HIGH GROWTH RATE SI...
- Publication number 20240395541
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- Publication number 20240395911
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HANDLING ASSEMBLY
- Publication number 20240395586
- Publication date Nov 28, 2024
- ASM IP HOLDING B.V.
- Adriaan Garssen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET WITH DUMMY FINS AND METHODS OF MAKING THE SAME
- Publication number 20240395910
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS

deposition by cyclic CVD

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Switching device and method for manufacturing the same

Selective molecular layer deposition of organic and hybrid organic-...

Lithography process and material for negative tone development

RF switch device with a sidewall spacer having a low dielectric con...

Film formation method and film formation device

Varying temperature anneal for film and structures formed thereby

Metal oxide composite as etch stop layer

Additive process for circular printing

Method for manufacturing semiconductor device, and film-forming device

Cyclic spin-on coating process for forming dielectric material

Selective passivation and selective deposition

Deposition method and plasma processing apparatus

Cerium-doped ferroelectric materials and related devices and methods

Chuck assembly, planarization process, apparatus and method of manu...

Deposition method and deposition apparatus

System for continuous atomic layer deposition

Methods for forming a semiconductor device structure and related se...

Methods for etching a material layer for semiconductor applications

Deposition of oxide thin films

Self-aligned patterning with colored blocking and structures result...

Epitaxial oxide materials, structures, and devices

Silicon oxide deposition method

Silicon oxide layer for oxidation resistance and method forming same

Sequential plasma and thermal treatment

Formation of SiOCN thin films

Chalcogen precursors for deposition of silicon nitride

Vapor phase deposition of organic films

Method of processing substrate, method of manufacturing semiconduct...

Method of manufacturing semiconductor devices and semiconductor dev...

Patents Applicationslast 30 patents

METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS

ATOMIC LAYER DEPOSITION SEAM REDUCTION

SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS

CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF

USING PLASMA ENHANCED PROCESS TO DO PERIODIC MAINTENANCE

SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...

SILICON CARBIDE DEVICE

SEMICONDUCTOR DEVICE AND METHOD

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

DEPOSITION DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTU...

SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...

ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...

PLANARIZATION SYSTEM, PLANARIZING METHOD, AND METHOD OF MANUFACTURI...

METHOD OF FORMING INSULATING FILM BY USING ATOMIC LAYER DEPOSITION

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE PROCESSING METHOD

METHOD TO CREATE AIR GAPS

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

LIGHT EMITTING DIODE CONTAINING PINHOLE MASKING LAYER AND METHOD OF...

IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF FORMING FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...

MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS

FUNCTIONALIZED CYCLOSILAZANES AS PRECURSORS FOR HIGH GROWTH RATE SI...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

WAFER HANDLING ASSEMBLY

FINFET WITH DUMMY FINS AND METHODS OF MAKING THE SAME