deposition by cyclic CVD

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CPC
H01L21/0228

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0228deposition by cyclic CVD

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for depositing film and film deposition system
- Patent number 12,205,817
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Hitoshi Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Epitaxial oxide materials, structures, and devices
- Patent number 12,206,048
- Issue date Jan 21, 2025
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and forming method thereof
- Patent number 12,205,981
- Issue date Jan 21, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Changzhou Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing K values of dielectric films through anneal
- Patent number 12,206,012
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of organic films
- Patent number 12,205,820
- Issue date Jan 21, 2025
- ASM IP Holding B.V.
- Eva E. Tois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Batch curing chamber with gas distribution and individual pumping
- Patent number 12,203,171
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Adib Khan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seam free isolation structures and method for making the same
- Patent number 12,199,097
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Ruei Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,198,929
- Issue date Jan 14, 2025
- Kokusai Electric Corporation
- Hiroshi Ashihara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defect free germanium oxide gap fill
- Patent number 12,198,936
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for depositing low-k dielectric films
- Patent number 12,198,925
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Shaunak Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organometallic compounds and thin film using same
- Patent number 12,195,488
- Issue date Jan 14, 2025
- Merck Patent GmbH
- Seung Won Ha
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Compact high density plasma source
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- Issue date Jan 14, 2025
- Lam Research Corporation
- Roger Patrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric gap-filling process for semiconductor device
- Patent number 12,198,974
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-I Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multi-layer etch stop structure
- Patent number 12,198,979
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,191,144
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yi Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and method for manufacturing the same
- Patent number 12,191,150
- Issue date Jan 7, 2025
- Denso Corporation
- Hidemoto Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective molecular layer deposition of organic and hybrid organic-...
- Patent number 12,191,139
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Tapash Chakraborty
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Lithography process and material for negative tone development
- Patent number 12,189,296
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF switch device with a sidewall spacer having a low dielectric con...
- Patent number 12,183,804
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation method and film formation device
- Patent number 12,183,572
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Yumiko Kawano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Varying temperature anneal for film and structures formed thereby
- Patent number 12,176,206
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive process for circular printing
- Patent number 12,172,374
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing semiconductor device, and film-forming device
- Patent number 12,173,401
- Issue date Dec 24, 2024
- Tokyo Electron Limited
- Zeyuan Ni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 12,170,199
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method and plasma processing apparatus
- Patent number 12,170,198
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Hiroyuki Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cerium-doped ferroelectric materials and related devices and methods
- Patent number 12,166,098
- Issue date Dec 10, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Paul C. McIntyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck assembly, planarization process, apparatus and method of manu...
- Patent number 12,165,903
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

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- Publication date Jan 23, 2025
- Intel Corporation
- Walid M. HAFEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING A MOLYBDENUM METAL FILM ON A DIELECTRIC SURF...
- Publication number 20250029834
- Publication date Jan 23, 2025
- ASM IP HOLDING B.V.
- Bhushan Zope
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of SiOCN Thin Films
- Publication number 20250029832
- Publication date Jan 23, 2025
- ASM IP HOLDING B.V.
- Varun Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR PHASE DEPOSITION OF ORGANIC FILMS
- Publication number 20250025911
- Publication date Jan 23, 2025
- ASM IP HOLDING B.V.
- Viljami J. Pore
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS AND APPARATUS FOR RADICAL ENHANCED VAPOR DEPOSITION
- Publication number 20250029831
- Publication date Jan 23, 2025
- ASM IP HOLDING B.V.
- Tommi Tynell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250022702
- Publication date Jan 16, 2025
- Kokusai Electric Corporation
- Masayuki ASAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250022706
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Tomohiko NIIZEKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM-FORMING METHOD AND FILM-FORMING APPARATUS
- Publication number 20250019815
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Shimon OTSUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS
- Publication number 20250022704
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Qiang Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250022705
- Publication date Jan 16, 2025
- Kokusai Electric Corporation
- Takashi YAHATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
- Publication number 20250014908
- Publication date Jan 9, 2025
- ASM IP HOLDING, B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
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ATOMIC LAYER DEPOSITION SEAM REDUCTION
- Publication number 20250014893
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
- Publication number 20250014904
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF
- Publication number 20250014890
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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USING PLASMA ENHANCED PROCESS TO DO PERIODIC MAINTENANCE
- Publication number 20250014876
- Publication date Jan 9, 2025
- SKY TECH INC.
- JUNG-HUA CHANG
- H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20250003068
- Publication date Jan 2, 2025
- Kokusai Electric Corporation
- Kazuyuki OKUDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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SILICON CARBIDE DEVICE
- Publication number 20250006814
- Publication date Jan 2, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang LEHNERT
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250006500
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Lan Chang
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250003071
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- Kokusai Electric Corporation
- Takeo HANASHIMA
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- Publication number 20250006488
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- Chao-Hsiu LI
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- Kokusai Electric Corporation
- Yoshimasa NAGATOMI
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SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240429317
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Po-Kai
- H01 - BASIC ELECTRIC ELEMENTS
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SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...
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ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...
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- Publication date Dec 26, 2024
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- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20240429060
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- Canon Kabushiki Kaisha
- Steven C. Shackleton
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- Publication number 20240429043
- Publication date Dec 26, 2024
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- Jeonggyu SONG
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
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- Publication number 20240429044
- Publication date Dec 26, 2024
- ASM IP HOLDING B.V.
- Yan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE AIR GAPS
- Publication number 20240429091
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- LAM RESEARCH CORPORATION
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
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NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
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- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS

deposition by cyclic CVD

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for depositing film and film deposition system

Epitaxial oxide materials, structures, and devices

Capacitor structure and forming method thereof

Reducing K values of dielectric films through anneal

Deposition of organic films

Batch curing chamber with gas distribution and individual pumping

Semiconductor device and a manufacturing method thereof

Seam free isolation structures and method for making the same

Method of manufacturing semiconductor device, substrate processing...

Defect free germanium oxide gap fill

Systems and methods for depositing low-k dielectric films

Organometallic compounds and thin film using same

Compact high density plasma source

Dielectric gap-filling process for semiconductor device

Semiconductor device with multi-layer etch stop structure

Semiconductor device and manufacturing method thereof

Switching device and method for manufacturing the same

Selective molecular layer deposition of organic and hybrid organic-...

Lithography process and material for negative tone development

RF switch device with a sidewall spacer having a low dielectric con...

Film formation method and film formation device

Varying temperature anneal for film and structures formed thereby

Metal oxide composite as etch stop layer

Additive process for circular printing

Method for manufacturing semiconductor device, and film-forming device

Cyclic spin-on coating process for forming dielectric material

Selective passivation and selective deposition

Deposition method and plasma processing apparatus

Cerium-doped ferroelectric materials and related devices and methods

Chuck assembly, planarization process, apparatus and method of manu...

Patents Applicationslast 30 patents

HIGH VOLTAGE THREE-DIMENSIONAL DEVICES HAVING DIELECTRIC LINERS

METHODS FOR DEPOSITING A MOLYBDENUM METAL FILM ON A DIELECTRIC SURF...

Formation of SiOCN Thin Films

VAPOR PHASE DEPOSITION OF ORGANIC FILMS

PROCESS AND APPARATUS FOR RADICAL ENHANCED VAPOR DEPOSITION

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

FILM-FORMING METHOD AND FILM-FORMING APPARATUS

DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS

ATOMIC LAYER DEPOSITION SEAM REDUCTION

SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS

CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF

USING PLASMA ENHANCED PROCESS TO DO PERIODIC MAINTENANCE

SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...

SILICON CARBIDE DEVICE

SEMICONDUCTOR DEVICE AND METHOD

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

DEPOSITION DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTU...

SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...

ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...

PLANARIZATION SYSTEM, PLANARIZING METHOD, AND METHOD OF MANUFACTURI...

METHOD OF FORMING INSULATING FILM BY USING ATOMIC LAYER DEPOSITION

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE PROCESSING METHOD

METHOD TO CREATE AIR GAPS

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION