deposition by decomposition or reaction of gaseous or vapour phase compounds

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CPC
H01L21/02271

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02271deposition by decomposition or reaction of gaseous or vapour phase compounds

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 12,142,668
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 12,142,575
- Issue date Nov 12, 2024
- Yangtza Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor phase deposition of organic films
- Patent number 12,138,654
- Issue date Nov 12, 2024
- ASM IP Holding B.V.
- Viljami J. Pore
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for cleaning reaction vessel for processing su...
- Patent number 12,139,787
- Issue date Nov 12, 2024
- Kokusai Electric Corporation
- Shinya Ebata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of manufacturing three-dimensional integrated circuit struc...
- Patent number 12,136,619
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,125,901
- Issue date Oct 22, 2024
- Fuji Electric Co., Ltd.
- Makoto Shimosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated method for low-cost wide band gap semiconductor device m...
- Patent number 12,125,697
- Issue date Oct 22, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism for finFET well doping
- Patent number 12,112,975
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact features of semiconductor devices
- Patent number 12,112,984
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsui-Ling Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
NMOS and PMOS transistor gates with hafnium oxide layers and lantha...
- Patent number 12,107,015
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment process to densify oxide layers
- Patent number 12,094,709
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Jung Chan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing tool and methods of operation
- Patent number 12,084,762
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ker-hsun Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ film growth rate monitoring apparatus, systems, and methods...
- Patent number 12,077,880
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Zhepeng Cong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 12,065,741
- Issue date Aug 20, 2024
- Kokusai Electric Corporation
- Mikio Ohno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of reducing capacitance in field-effect transistors
- Patent number 12,057,488
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compositions and methods using same for deposition of silicon-conta...
- Patent number 12,049,695
- Issue date Jul 30, 2024
- VERSUM MATERIALS US, LLC
- Raymond Nicholas Vrtis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Isolation regions including two layers and method forming same
- Patent number 12,051,614
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor phase transport systems for depositing perovskite semiconductors
- Patent number 12,046,467
- Issue date Jul 23, 2024
- Swift Solar Inc.
- Kevin Alexander Bush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for depositing sib films
- Patent number 12,033,848
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Aykut Aydin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and related device for removing by-product on semiconductor...
- Patent number 12,027,350
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes to deposit amorphous-silicon etch protection liner
- Patent number 12,027,374
- Issue date Jul 2, 2024
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for preparing AlN based template having Si substrate and Ga...
- Patent number 12,020,925
- Issue date Jun 25, 2024
- Xidian University
- Zhihong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,018,373
- Issue date Jun 25, 2024
- Kokusai Electric Corporation
- Seiyo Nakashima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabricating field-effect transistor
- Patent number 12,020,931
- Issue date Jun 25, 2024
- Nippon Telegraph and Telephone Corporation
- Yuki Yoshiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single process volume to perform high-pressure and low-pressure pro...
- Patent number 12,012,652
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Kelvin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced critical dimensions
- Patent number 12,009,212
- Issue date Jun 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device and method for producing same
- Patent number 12,009,213
- Issue date Jun 11, 2024
- Rohm Co., Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a passivation layer and method of making
- Patent number 12,002,771
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming lead wires in hybrid-bonded semiconductor devices
- Patent number 11,996,322
- Issue date May 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD
- Publication number 20240387701
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Jung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF GAP FILLING FOR SEMICONDUCTOR DEVICE
- Publication number 20240387704
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Yang Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240384403
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ker-hsun LIAO
- B08 - CLEANING
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240371852
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371630
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Hsuan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NMOS and PMOS Transistor Gates with Hafnium Oxide Layers and Lantha...
- Publication number 20240363442
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240360552
- Publication date Oct 31, 2024
- Kokusai Electric Corporation
- Hideharu ITATANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSES FOR DEPOSITING SIB FILMS
- Publication number 20240339316
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Aykut AYDIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIVE FILMS FOR LARGE AREA GAPFILL
- Publication number 20240332028
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Supriya Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND RELATED DEVICE FOR REMOVING BY-PRODUCT ON SEMICONDUCTOR...
- Publication number 20240331988
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE SUPPORTER
- Publication number 20240321619
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Yunjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER
- Publication number 20240321787
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lung SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES TO DEPOSIT AMORPHOUS-SILICON ETCH PROTECTION LINER
- Publication number 20240321589
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Zeqing SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20240304447
- Publication date Sep 12, 2024
- Rohm Co., Ltd.
- Yuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF REDUCING CAPACITANCE IN FIELD-EFFECT TRANSISTORS
- Publication number 20240297236
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL AND SELECTIVE SIN DEPOSITION
- Publication number 20240290612
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Zeqing SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION BETWEEN SOURCE/DRAIN AND GATE
- Publication number 20240292592
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290881
- Publication date Aug 29, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasuhiro OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240266164
- Publication date Aug 8, 2024
- Kokusai Electric Corporation
- Nagisa SUYAMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240266184
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- HSUAN-WU LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, MET...
- Publication number 20240254630
- Publication date Aug 1, 2024
- Kokusai Electric Corporation
- Hideo TATENO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LAMINATED STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING CR...
- Publication number 20240250185
- Publication date Jul 25, 2024
- Shin-Etsu Chemical Co., Ltd.
- Takenori WATABE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES
- Publication number 20240249972
- Publication date Jul 25, 2024
- Intel Corporation
- Ebony L. Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240249933
- Publication date Jul 25, 2024
- Kokusai Electric Corporation
- Katsuyoshi HARADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Gate Structures in Transistor Devices and Methods of Forming Same
- Publication number 20240249938
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL NITRIDE FERROELECTRONICS
- Publication number 20240242963
- Publication date Jul 18, 2024
- The Regents of the University of Michigan
- Zetian Mi
- C30 - CRYSTAL GROWTH
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240222109
- Publication date Jul 4, 2024
- Kokusai Electric Corporation
- Naofumi OHASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICES
- Publication number 20240213096
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Tsui-Ling Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOCVD METHOD FOR GROWING INALGAN/GAN HETEROSTRUCTURE
- Publication number 20240213020
- Publication date Jun 27, 2024
- National Yang Ming Chiao Tung University
- Edward Yi CHANG
- H01 - BASIC ELECTRIC ELEMENTS

deposition by decomposition or reaction of gaseous or vapour phase compounds

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method

Staircase etch control in forming three-dimensional memory device

Vapor phase deposition of organic films

Apparatus and method for cleaning reaction vessel for processing su...

Methods of manufacturing three-dimensional integrated circuit struc...

Method of manufacturing semiconductor device

Integrated method for low-cost wide band gap semiconductor device m...

Mechanism for finFET well doping

Contact features of semiconductor devices

NMOS and PMOS transistor gates with hafnium oxide layers and lantha...

Plasma treatment process to densify oxide layers

Semiconductor processing tool and methods of operation

In-situ film growth rate monitoring apparatus, systems, and methods...

Substrate processing apparatus and method of manufacturing semicond...

Methods of reducing capacitance in field-effect transistors

Compositions and methods using same for deposition of silicon-conta...

Isolation regions including two layers and method forming same

Vapor phase transport systems for depositing perovskite semiconductors

Processes for depositing sib films

Chip package, method of forming a chip package and method of formin...

Process and related device for removing by-product on semiconductor...

Processes to deposit amorphous-silicon etch protection liner

Methods for preparing AlN based template having Si substrate and Ga...

Substrate processing apparatus

Method for fabricating field-effect transistor

Single process volume to perform high-pressure and low-pressure pro...

Semiconductor device with reduced critical dimensions

Semiconductor power device and method for producing same

Semiconductor device having a passivation layer and method of making

Method for forming lead wires in hybrid-bonded semiconductor devices

Patents Applicationslast 30 patents

FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD

METHOD OF GAP FILLING FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF

NMOS and PMOS Transistor Gates with Hafnium Oxide Layers and Lantha...

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

PROCESSES FOR DEPOSITING SIB FILMS

COMPRESSIVE FILMS FOR LARGE AREA GAPFILL

PROCESS AND RELATED DEVICE FOR REMOVING BY-PRODUCT ON SEMICONDUCTOR...

SUBSTRATE SUPPORTER

SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER

PROCESSES TO DEPOSIT AMORPHOUS-SILICON ETCH PROTECTION LINER

SEMICONDUCTOR POWER DEVICE AND METHOD FOR PRODUCING SAME

METHODS OF REDUCING CAPACITANCE IN FIELD-EFFECT TRANSISTORS

CONFORMAL AND SELECTIVE SIN DEPOSITION

CONNECTION BETWEEN SOURCE/DRAIN AND GATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, MET...

LAMINATED STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING CR...

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

Gate Structures in Transistor Devices and Methods of Forming Same

EPITAXIAL NITRIDE FERROELECTRONICS

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

CONTACT FEATURES OF SEMICONDUCTOR DEVICES

MOCVD METHOD FOR GROWING INALGAN/GAN HETEROSTRUCTURE