deposition by decomposition or reaction of gaseous or vapour phase compounds

Industry

CPC
H01L21/02271

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02271deposition by decomposition or reaction of gaseous or vapour phase compounds

Industries

Patents Grantslast 30 patents

Information Patent Grant
Gate structures in transistor devices and methods of forming same
- Patent number 11,967,504
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate retainer and method of ma...
- Patent number 11,961,715
- Issue date Apr 16, 2024
- Kokusai Electric Corporation
- Daisuke Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including an interdeck region between deck...
- Patent number 11,955,330
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate of aluminum nitride single-crystal substrate
- Patent number 11,952,677
- Issue date Apr 9, 2024
- Tokuyama Corporation
- Masao Ariyuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor processing device
- Patent number 11,946,136
- Issue date Apr 2, 2024
- ASM IP Holding B.V.
- Jereld Lee Winkler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming semiconductor device with helmet structure betwe...
- Patent number 11,942,476
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the semiconductor...
- Patent number 11,942,513
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Guan-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum dot devices with overlapping gates
- Patent number 11,942,516
- Issue date Mar 26, 2024
- Intel Corporation
- Nicole K. Thomas
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Contact features of semiconductor devices
- Patent number 11,935,786
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsui-Ling Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual gate dielectric layers grown with an inhibitor layer
- Patent number 11,935,740
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Mark Francis Arendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method and non...
- Patent number 11,926,893
- Issue date Mar 12, 2024
- Kokusai Electric Corporation
- Naofumi Ohashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 11,929,419
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator with crystalline silicon oxide
- Patent number 11,923,236
- Issue date Mar 5, 2024
- TURUN YLIOPISTO
- Pekka Laukkanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device having contact plugs with re-ent...
- Patent number 11,916,147
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rounded vertical wafer vessel rods
- Patent number 11,908,719
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric film for semiconductor fabrication
- Patent number 11,901,295
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step process for flowable gap-fill film
- Patent number 11,901,222
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Maximillian Clemons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,903,202
- Issue date Feb 13, 2024
- Kioxia Corporation
- Aki Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of manufacturing the same
- Patent number 11,903,212
- Issue date Feb 13, 2024
- Kioxia Corporation
- Kyungmin Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 11,891,697
- Issue date Feb 6, 2024
- Kokusai Electric Corporation
- Naofumi Ohashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,887,861
- Issue date Jan 30, 2024
- Tokyo Electron Limited
- Jaewon Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 11,881,508
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Kyungin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method and non...
- Patent number 11,869,764
- Issue date Jan 9, 2024
- Kokusai Electric Corporation
- Akinori Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vaporizer, substrate processing apparatus, and method of manufactur...
- Patent number 11,866,822
- Issue date Jan 9, 2024
- Kokusai Electric Corporation
- Hirohisa Yamazaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device and method for high pressure anneal
- Patent number 11,854,800
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structure and method with reduced fin buckling
- Patent number 11,855,207
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated method for low-cost wide band gap semiconductor device m...
- Patent number 11,848,197
- Issue date Dec 19, 2023
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 11,848,211
- Issue date Dec 19, 2023
- Kabushiki Kaisha Toshiba
- Tatsuo Shimizu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,837,466
- Issue date Dec 5, 2023
- Kokusai Electric Corporation
- Kimihiko Nakatani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PRODUCING RAW MATERIAL SOLUTION, METHOD OF FILM-FORMING A...
- Publication number 20240124974
- Publication date Apr 18, 2024
- Shin-Etsu Chemical Co., Ltd.
- Takenori WATABE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240130135
- Publication date Apr 18, 2024
- KIOXIA Corporation
- Kyungmin JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP PROCESS FOR FLOWABLE GAP-FILL FILM
- Publication number 20240128121
- Publication date Apr 18, 2024
- Applied Materials, Inc.
- Maximillian CLEMONS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240105443
- Publication date Mar 28, 2024
- Kokusai Electric Corporation
- Kimihiko NAKATANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20240105445
- Publication date Mar 28, 2024
- TOKYO ELECTRON LIMITED
- Issei TAKEYASU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GROUP III-V SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION OF SAME...
- Publication number 20240105450
- Publication date Mar 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yoganand Saripalli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FINFET STRUCTURE AND METHOD WITH REDUCED FIN BUCKLING
- Publication number 20240097033
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITO...
- Publication number 20240096615
- Publication date Mar 21, 2024
- Kokusai Electric Corporation
- Akinori TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPORIZATION VESSEL AND METHOD
- Publication number 20240084452
- Publication date Mar 14, 2024
- Entegris, Inc.
- Bryan C. HENDRIX
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME
- Publication number 20240088025
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR DEPOSITION OF TELLURIUM NANOMESH ELECTRONICS ON ARBITRARY SUR...
- Publication number 20240079234
- Publication date Mar 7, 2024
- City University of Hong Kong
- Johnny Chung Yin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
YTTRIUM COMPOUND, SOURCE MATERIAL FOR FORMING YTTRIUM-CONTAINING FI...
- Publication number 20240067663
- Publication date Feb 29, 2024
- ADEKA CORPORATION
- Hyunwoo KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SiC SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SiC MOSFET
- Publication number 20240071764
- Publication date Feb 29, 2024
- KYOTO UNIVERSITY
- Tsunenobu KIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Method For Low-Cost Wide Band Gap Semiconductor Device M...
- Publication number 20240063013
- Publication date Feb 22, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION FOR SUB 20 NM PITCH EUV PATTERNING
- Publication number 20240055255
- Publication date Feb 15, 2024
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20240055252
- Publication date Feb 15, 2024
- Kokusai Electric Corporation
- Kimihiko NAKATANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE WITH HIGH ASPECT RATIO
- Publication number 20240047276
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Deep Trench Capacitor with Reduced Deforma...
- Publication number 20240047552
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20240030026
- Publication date Jan 25, 2024
- Kokusai Electric Corporation
- Shoma MIYATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
- Publication number 20240014133
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING...
- Publication number 20240014032
- Publication date Jan 11, 2024
- Kokusai Electric Corporation
- Kazuhiro HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION OF HIGH DIELECTRIC CONSTANT MATERIALS
- Publication number 20230420486
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Geetika Bajaj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230420324
- Publication date Dec 28, 2023
- ROHM CO., LTD.
- Takayuki OSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20230411145
- Publication date Dec 21, 2023
- Kokusai Electric Corporation
- Yusaku OKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230413560
- Publication date Dec 21, 2023
- Yangtze Memory Technologies Co., Ltd.
- Qiang XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20230402281
- Publication date Dec 14, 2023
- Kokusai Electric Corporation
- Yasunobu Koshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, MET...
- Publication number 20230392257
- Publication date Dec 7, 2023
- Kokusai Electric Corporation
- Masaya NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL
- Publication number 20230386832
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALKOXYDISILOXANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM
- Publication number 20230386825
- Publication date Nov 30, 2023
- VERSUM MATERIALS US, LLC
- MANCHAO XIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS
- Publication number 20230386839
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Lakmal Charidu Kalutarage
- H01 - BASIC ELECTRIC ELEMENTS

deposition by decomposition or reaction of gaseous or vapour phase compounds

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gate structures in transistor devices and methods of forming same

Via for semiconductor device connection and methods of forming the...

Substrate processing apparatus, substrate retainer and method of ma...

Microelectronic devices including an interdeck region between deck...

Laminate of aluminum nitride single-crystal substrate

Semiconductor processing device

Method for forming semiconductor device with helmet structure betwe...

Semiconductor structure and method of fabricating the semiconductor...

Quantum dot devices with overlapping gates

Contact features of semiconductor devices

Dual gate dielectric layers grown with an inhibitor layer

Substrate processing apparatus, substrate processing method and non...

Semiconductor device

Silicon-on-insulator with crystalline silicon oxide

Fin field-effect transistor device having contact plugs with re-ent...

Rounded vertical wafer vessel rods

Dielectric film for semiconductor fabrication

Multi-step process for flowable gap-fill film

Method of manufacturing semiconductor device

Semiconductor memory device and method of manufacturing the same

Substrate processing apparatus

Substrate processing method and substrate processing apparatus

Method of fabricating a semiconductor device

Substrate processing apparatus, substrate processing method and non...

Vaporizer, substrate processing apparatus, and method of manufactur...

Device and method for high pressure anneal

FinFET structure and method with reduced fin buckling

Integrated method for low-cost wide band gap semiconductor device m...

Semiconductor device, method for manufacturing semiconductor device...

Method of manufacturing semiconductor device, substrate processing...

Patents Applicationslast 30 patents

METHOD OF PRODUCING RAW MATERIAL SOLUTION, METHOD OF FILM-FORMING A...

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

MULTI-STEP PROCESS FOR FLOWABLE GAP-FILL FILM

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM

GROUP III-V SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION OF SAME...

FINFET STRUCTURE AND METHOD WITH REDUCED FIN BUCKLING

SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITO...

VAPORIZATION VESSEL AND METHOD

SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME

VAPOR DEPOSITION OF TELLURIUM NANOMESH ELECTRONICS ON ARBITRARY SUR...

YTTRIUM COMPOUND, SOURCE MATERIAL FOR FORMING YTTRIUM-CONTAINING FI...

SiC SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SiC MOSFET

Integrated Method For Low-Cost Wide Band Gap Semiconductor Device M...

SELECTIVE DEPOSITION FOR SUB 20 NM PITCH EUV PATTERNING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE WITH HIGH ASPECT RATIO

Structure and Method for Deep Trench Capacitor with Reduced Deforma...

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING...

ATOMIC LAYER DEPOSITION OF HIGH DIELECTRIC CONSTANT MATERIALS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, MET...

DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL

ALKOXYDISILOXANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM

DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS