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WAFER PROCESSING SYSTEM
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Publication number 20240120194
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Publication date Apr 11, 2024
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Samsung Electronics Co., Ltd.
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Sang Min LEE
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H01 - BASIC ELECTRIC ELEMENTS
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OXIDE FILM PREPARATION METHOD
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Publication number 20230399734
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Publication date Dec 14, 2023
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Beijing NAURA Microelectronics Equipment Co., Ltd.
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Jianheng LUO
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD FOR MANUFACTURING METAL OXYNITRIDE FILM
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Publication number 20230402280
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Publication date Dec 14, 2023
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Semiconductor Energy Laboratory Co., Ltd.
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Kazuki TANEMURA
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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SEMICONDUCTOR DEVICE
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Publication number 20230387319
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Publication date Nov 30, 2023
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Japan Display Inc.
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Yohei YAMAGUCHI
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H01 - BASIC ELECTRIC ELEMENTS
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FIELD SUPPRESSED METAL GAPFILL
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Publication number 20230326744
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Publication date Oct 12, 2023
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Applied Materials, Inc.
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Annamalai Lakshmanan
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI PROCESS AIR GAP FORMATION
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Publication number 20230087442
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Publication date Mar 23, 2023
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Applied Materials, Inc.
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John Hautala
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H01 - BASIC ELECTRIC ELEMENTS
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DEPOSITION SYSTEM AND METHOD
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Publication number 20230066870
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Publication date Mar 2, 2023
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Chia-Hsi WANG
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H01 - BASIC ELECTRIC ELEMENTS
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