Deposition of semiconductive layers

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H01L21/32055

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32055Deposition of semiconductive layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Deep trench intersections
- Patent number 12,218,188
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing gap filling including filling trenches between...
- Patent number 12,183,590
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacks of electrically resistive materials and related systems and...
- Patent number 12,148,789
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Ahmed N. Noemaun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seam removal in high aspect ratio gap-fill
- Patent number 12,142,480
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Qinghua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single chamber flowable film formation and treatments
- Patent number 12,142,459
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective liquid sliding surface and method of fabricating the same
- Patent number 12,112,941
- Issue date Oct 8, 2024
- THE INDUSTRY & ACADEMIC COOPERAPATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC)
- Seong Min Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method, substrate processing apparatus, and substrate proce...
- Patent number 12,112,954
- Issue date Oct 8, 2024
- Tokyo Electron Limited
- Maju Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective silicon deposition
- Patent number 12,106,972
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Yifeng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Amorphous silicon forming composition comprising block copolymer an...
- Patent number 12,091,323
- Issue date Sep 17, 2024
- Marck Patent GmbH
- Naoko Nakamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing amorphous silicon sacrifice film and amorphous...
- Patent number 12,060,276
- Issue date Aug 13, 2024
- Merck Patent GmbH
- Naoko Nakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,058,858
- Issue date Aug 6, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable film curing using H2 plasma
- Patent number 12,054,827
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Shishi Jiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming polycrystalline channel on dielectric films wit...
- Patent number 12,057,321
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal routing trench by additive processing
- Patent number 11,996,343
- Issue date May 28, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND gate stack reinforcement
- Patent number 11,967,524
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Praket Prakash Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating interconnection using graphene
- Patent number 11,876,050
- Issue date Jan 16, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,862,468
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polysilicon structure including protective layer
- Patent number 11,855,086
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Shao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for Si gap fill by PECVD
- Patent number 11,848,232
- Issue date Dec 19, 2023
- Applied Materials, Inc.
- Xin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming polycrystalline channel on dielectric films wit...
- Patent number 11,742,213
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,728,406
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 11,688,762
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having side-diffused trench plug
- Patent number 11,688,763
- Issue date Jun 27, 2023
- Littelfuse, Inc.
- Ader Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing device
- Patent number 11,670,517
- Issue date Jun 6, 2023
- SCREEN Holdings Co., Ltd.
- Sei Negoro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating memory device
- Patent number 11,641,744
- Issue date May 2, 2023
- Macronix International Co., Ltd.
- Wei-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of gap filling using conformal deposition-annealing-etching...
- Patent number 11,605,543
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistance reduction for word lines in memory arrays
- Patent number 11,587,874
- Issue date Feb 21, 2023
- Intel Corporation
- Sung-Taeg Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-compact inductor made of 3D Dirac semimetal
- Patent number 11,563,078
- Issue date Jan 24, 2023
- The University of Utah Research Foundation
- Berardi Sensale Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of manufacturing the same
- Patent number 11,495,609
- Issue date Nov 8, 2022
- STMicroelectronics (Crolles 2) SAS
- Fausto Piazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier three-dimensional memory device with nested contact via...
- Patent number 11,488,975
- Issue date Nov 1, 2022
- SanDisk Technologies LLC
- Yuji Totoki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN...
- Publication number 20250054758
- Publication date Feb 13, 2025
- Samsung SDI Co., Ltd.
- Dong Wan RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM REMOVAL IN HIGH ASPECT RATIO GAP-FILL
- Publication number 20250037996
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Qinghua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR HEATING FOR THIN FILM EVAPORATION AND DIRECTIONAL SOLIDIFICATION
- Publication number 20250003054
- Publication date Jan 2, 2025
- Blue Origin, LLC
- Alexander lmbault
- C01 - INORGANIC CHEMISTRY
Information Patent Application
NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379366
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES
- Publication number 20240347339
- Publication date Oct 17, 2024
- Syrnatec, Inc.
- Yash Suresh Mirchandani
- B24 - GRINDING POLISHING
Information Patent Application
CERAMIC SUBSTRATE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240339320
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240321774
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kitae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING
- Publication number 20240312862
- Publication date Sep 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...
- Publication number 20240297078
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Mariko SUMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Conductive Material Deposition
- Publication number 20240178003
- Publication date May 30, 2024
- TOKYO ELECTRON LIMITED
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SILICON-ON-INSULATOR
- Publication number 20240153764
- Publication date May 9, 2024
- SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY...
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BLOCKING DIELECTRIC SURFACES USING BLOCKING MOLECULES TO...
- Publication number 20240145242
- Publication date May 2, 2024
- Applied Materials, Inc.
- Geetika BAJAJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES
- Publication number 20240112914
- Publication date Apr 4, 2024
- University of Electronic Science and Technology of China
- Bo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240105465
- Publication date Mar 28, 2024
- Kokusai Electric Corporation
- Takahiro MIYAKURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MAKING POLYSILICON STRUCTURE INCLUDING PROTECTIVE LAYER
- Publication number 20240096884
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Shao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A CONDUCTI...
- Publication number 20240079456
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Jae Man YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BOAT AND A METHOD FOR FORMING LAYER ON A PLURALITY OF SUBSTRATES
- Publication number 20240044003
- Publication date Feb 8, 2024
- ASM IP HOLDING B.V.
- Dieter Pierreux
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...
- Publication number 20240047359
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...
- Publication number 20240047358
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A NOVEL TRANSISTOR DEVICE
- Publication number 20240021712
- Publication date Jan 18, 2024
- Search For The Next, LTD.
- David SUMMERLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE USING MULTI-LAYER H...
- Publication number 20240014038
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE USING MULTI-LAYER H...
- Publication number 20240014040
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITION FOR SELECTIVELY ETCHING SILICON NITRIDE, ETCHIN...
- Publication number 20240014044
- Publication date Jan 11, 2024
- SK hynix, Inc.
- Eun Seok OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230411166
- Publication date Dec 21, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yizhi ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING POLYCRYSTALLINE CHANNEL ON DIELECTRIC FILMS WIT...
- Publication number 20230386856
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hsien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20230377891
- Publication date Nov 23, 2023
- Taiwan Semiconducor Manufacturing Co., Ltd.
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Warpage High Density Trench Capacitor
- Publication number 20230361166
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20230352563
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS

Deposition of semiconductive layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Deep trench intersections

Method of performing gap filling including filling trenches between...

Stacks of electrically resistive materials and related systems and...

Seam removal in high aspect ratio gap-fill

Single chamber flowable film formation and treatments

Selective liquid sliding surface and method of fabricating the same

Etching method, substrate processing apparatus, and substrate proce...

Selective silicon deposition

Amorphous silicon forming composition comprising block copolymer an...

Method for producing amorphous silicon sacrifice film and amorphous...

Three-dimensional memory devices and methods for forming the same

Flowable film curing using H2 plasma

Methods for forming polycrystalline channel on dielectric films wit...

Thermal routing trench by additive processing

3D NAND gate stack reinforcement

Method for fabricating interconnection using graphene

Semiconductor device and method

Polysilicon structure including protective layer

Method for Si gap fill by PECVD

Methods for forming polycrystalline channel on dielectric films wit...

Semiconductor device and method

Low warpage high density trench capacitor

Semiconductor device having side-diffused trench plug

Substrate processing method and substrate processing device

Method for fabricating memory device

Method of gap filling using conformal deposition-annealing-etching...

Resistance reduction for word lines in memory arrays

Ultra-compact inductor made of 3D Dirac semimetal

Integrated circuit and method of manufacturing the same

Multi-tier three-dimensional memory device with nested contact via...

Patents Applicationslast 30 patents

SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN...

SEAM REMOVAL IN HIGH ASPECT RATIO GAP-FILL

SOLAR HEATING FOR THIN FILM EVAPORATION AND DIRECTIONAL SOLIDIFICATION

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

SEMICONDUCTOR DEVICES

COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES

CERAMIC SUBSTRATE STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...

Method of Conductive Material Deposition

METHOD FOR PREPARING SILICON-ON-INSULATOR

METHOD OF BLOCKING DIELECTRIC SURFACES USING BLOCKING MOLECULES TO...

VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD OF MAKING POLYSILICON STRUCTURE INCLUDING PROTECTIVE LAYER

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A CONDUCTI...

WAFER BOAT AND A METHOD FOR FORMING LAYER ON A PLURALITY OF SUBSTRATES

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...

A NOVEL TRANSISTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE USING MULTI-LAYER H...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE USING MULTI-LAYER H...

ETCHING COMPOSITION FOR SELECTIVELY ETCHING SILICON NITRIDE, ETCHIN...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

METHODS FOR FORMING POLYCRYSTALLINE CHANNEL ON DIELECTRIC FILMS WIT...

SEMICONDUCTOR DEVICE AND METHOD

Low Warpage High Density Trench Capacitor

Semiconductor Device and Method