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Semiconductor device and method
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Patent number 11,862,468
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Issue date Jan 2, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd
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Kuei-Lun Lin
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H01 - BASIC ELECTRIC ELEMENTS
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Method for Si gap fill by PECVD
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Patent number 11,848,232
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Issue date Dec 19, 2023
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Applied Materials, Inc.
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Xin Liu
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Semiconductor device and method
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Patent number 11,728,406
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Issue date Aug 15, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd
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De-Wei Yu
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H01 - BASIC ELECTRIC ELEMENTS
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Low-k dielectric films
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Patent number 11,393,678
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Issue date Jul 19, 2022
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Applied Materials, Inc.
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William J. Durand
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Method for Si gap fill by PECVD
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Patent number 11,361,991
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Issue date Jun 14, 2022
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Applied Materials, Inc.
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Xin Liu
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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