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H01L2224/78355

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78355Design

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Patents Grantslast 30 patents

Information Patent Grant
Ribbon bonding tools and methods of using the same
- Patent number 11,978,718
- Issue date May 7, 2024
- Kulicke and Soffa Industries, Inc,.
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,824,038
- Issue date Nov 21, 2023
- Shinkawa Ltd.
- Nobuyuki Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon bonding tools and methods of using the same
- Patent number 10,847,491
- Issue date Nov 24, 2020
- Kulicke and Soffa Industries, Inc.
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus with spurious vibration suppressing structure
- Patent number 6,779,702
- Issue date Aug 24, 2004
- NEC Electronics Corporation
- Naoto Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus with spurious vibration suppressing structure
- Patent number 6,575,348
- Issue date Jun 10, 2003
- NEC Electronics Corporation
- Naoto Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20210272927
- Publication date Sep 2, 2021
- SHINKAWA LTD.
- Nobuyuki AOYAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
- Publication number 20210028143
- Publication date Jan 28, 2021
- Kulicke and Soffa Indsutries,Inc.
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding apparatus with spurious vibration releasing structure
- Publication number 20030106923
- Publication date Jun 12, 2003
- Naoto Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding apparatus with spurious vibration releasing structure
- Publication number 20020185518
- Publication date Dec 12, 2002
- Naoto Kimura
- H01 - BASIC ELECTRIC ELEMENTS