Detachable connecting means consisting of mechanical auxiliary parts connecting the device

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H01L2224/72

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pressure-contact-type semiconductor device
- Patent number 12,051,671
- Issue date Jul 30, 2024
- Mitsubishi Electric Corporation
- Jun Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid short circuit failure mode preform for power semiconductor d...
- Patent number 11,742,312
- Issue date Aug 29, 2023
- Hitachi Energy Switzerland AG
- Didier Cottet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 11,569,140
- Issue date Jan 31, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for interconnecting microelectronic circuits
- Patent number 11,431,115
- Issue date Aug 30, 2022
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microspring structure for hardware trusted platform module
- Patent number 11,289,443
- Issue date Mar 29, 2022
- Palo Alto Research Center Incorporated
- Warren B. Jackson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with integrated shunt resistor
- Patent number 10,950,509
- Issue date Mar 16, 2021
- Infineon Technologies AG
- Rainald Sander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with short circuit failure mode
- Patent number 10,872,830
- Issue date Dec 22, 2020
- ABB Schweiz AG
- Chunlei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module comprising graphene
- Patent number 10,804,182
- Issue date Oct 13, 2020
- ABB Power Grids Switzerland AG
- Muhammad Nawaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell module and conductor
- Patent number 10,644,182
- Issue date May 5, 2020
- Kabushiki Kaisha Toyota Jidoshokki
- Hirotaka Inaba
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 10,607,903
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a clip
- Patent number 10,424,534
- Issue date Sep 24, 2019
- Infineon Technologies AG
- Xavier Arokiasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 10,319,652
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap for a chip device having a groove, device provided with said ca...
- Patent number 9,888,573
- Issue date Feb 6, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Dominique Vicard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 9,691,732
- Issue date Jun 27, 2017
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a clip
- Patent number 9,640,465
- Issue date May 2, 2017
- Infineon Technologies AG
- Xavier Arokiasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid-integrated photonic chip package with an interposer
- Patent number 9,297,971
- Issue date Mar 29, 2016
- Oracle International Corporation
- Hiren D. Thacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid-integrated photonic chip package with an interposer
- Patent number 9,250,403
- Issue date Feb 2, 2016
- Oracle International Corporation
- Hiren D. Thacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Batch process for three-dimensional integration
- Patent number 9,082,808
- Issue date Jul 14, 2015
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor assembly and method for manufacturing the same
- Patent number 8,450,146
- Issue date May 28, 2013
- Panasonic Corporation
- Kenichiro Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for controlled shock and vibration of electrical intercon...
- Patent number 7,101,193
- Issue date Sep 5, 2006
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for controlled shock and vibration of electrical intercon...
- Patent number 6,986,668
- Issue date Jan 17, 2006
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with heat sink
- Patent number 6,856,015
- Issue date Feb 15, 2005
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling shock and vibration of electrical interconnects
- Patent number 6,658,729
- Issue date Dec 9, 2003
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for controlled shock and vibration of electric...
- Patent number 6,375,475
- Issue date Apr 23, 2002
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICAL...
- Publication number 20240404982
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE HEAT SINK SIDE ATTACH METHODOLOGY
- Publication number 20240387320
- Publication date Nov 21, 2024
- Cisco Technology, Inc.
- Gary K. CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package with Detachable Chips
- Publication number 20240332110
- Publication date Oct 3, 2024
- Western Digital Technologies, Inc.
- Rotem Sela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE
- Publication number 20240266278
- Publication date Aug 8, 2024
- Monolithic Power Systems, Inc.
- Yi Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213106
- Publication date Jun 27, 2024
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS
- Publication number 20240064943
- Publication date Feb 22, 2024
- Toyota Motor Engineering & Manufacturing North America Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS
- Publication number 20230006374
- Publication date Jan 5, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE AND THE ME...
- Publication number 20220399264
- Publication date Dec 15, 2022
- Monolithic Power Systems, Inc.
- Yi Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Short Circuit Failure Mode Preform for Power Semiconductor D...
- Publication number 20220028822
- Publication date Jan 27, 2022
- ABB Schweiz AG
- Didier Cottet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE-CONTACT-TYPE SEMICONDUCTOR DEVICE
- Publication number 20220005783
- Publication date Jan 6, 2022
- Mitsubishi Electric Corporation
- Jun OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connectors for Interconnecting Microelectronic Circuits
- Publication number 20210257758
- Publication date Aug 19, 2021
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH SHORT CIRCUIT FAILURE MODE
- Publication number 20190355634
- Publication date Nov 21, 2019
- ABB Schweiz AG
- Chunlei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Module Comprising Graphene
- Publication number 20190333838
- Publication date Oct 31, 2019
- ABB Schweiz AG
- Muhammad Nawaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELASTIC COUPLER AND RELATED METHODS
- Publication number 20160343683
- Publication date Nov 24, 2016
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
- Publication number 20140321803
- Publication date Oct 30, 2014
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
- Publication number 20140321804
- Publication date Oct 30, 2014
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
BATCH PROCESS FOR THREE-DIMENSIONAL INTEGRATION
- Publication number 20130320567
- Publication date Dec 5, 2013
- ORACLE INTERNATIONAL CORPORATION
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110297960
- Publication date Dec 8, 2011
- PANASONIC CORPORATION
- Kenichiro Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for controlled shock and vibration of electrical intercon...
- Publication number 20060030197
- Publication date Feb 9, 2006
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT SINK
- Publication number 20050040519
- Publication date Feb 24, 2005
- Siliconware Precision Industries
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for controlled shock and vibration of electrical intercon...
- Publication number 20040060733
- Publication date Apr 1, 2004
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structure for controlled shock and vibration of electric...
- Publication number 20020127894
- Publication date Sep 12, 2002
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS

Detachable connecting means consisting of mechanical auxiliary parts connecting the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressure-contact-type semiconductor device

Hybrid short circuit failure mode preform for power semiconductor d...

Semiconductor package with elastic coupler and related methods

Connectors for interconnecting microelectronic circuits

Microspring structure for hardware trusted platform module

Semiconductor device with integrated shunt resistor

Power semiconductor module with short circuit failure mode

Semiconductor power module comprising graphene

Solar cell module and conductor

Semiconductor package with elastic coupler and related methods

Semiconductor device including a clip

Semiconductor package with elastic coupler and related methods

Cap for a chip device having a groove, device provided with said ca...

Semiconductor package with elastic coupler and related methods

Semiconductor device including a clip

Hybrid-integrated photonic chip package with an interposer

Hybrid-integrated photonic chip package with an interposer

Batch process for three-dimensional integration

Transistor assembly and method for manufacturing the same

Structure for controlled shock and vibration of electrical intercon...

Structure for controlled shock and vibration of electrical intercon...

Semiconductor package with heat sink

Method of controlling shock and vibration of electrical interconnects

Method and structure for controlled shock and vibration of electric...

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICAL...

REMOTE HEAT SINK SIDE ATTACH METHODOLOGY

Multi-Chip Package with Detachable Chips

INTERCONNECTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR DEVICE

COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS

MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS

INTERCONNECTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE AND THE ME...

Hybrid Short Circuit Failure Mode Preform for Power Semiconductor D...

PRESSURE-CONTACT-TYPE SEMICONDUCTOR DEVICE

Connectors for Interconnecting Microelectronic Circuits

POWER SEMICONDUCTOR MODULE WITH SHORT CIRCUIT FAILURE MODE

Semiconductor Power Module Comprising Graphene

SEMICONDUCTOR PACKAGE WITH ELASTIC COUPLER AND RELATED METHODS

HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER

HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER

BATCH PROCESS FOR THREE-DIMENSIONAL INTEGRATION

TRANSISTOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

Structure for controlled shock and vibration of electrical intercon...

SEMICONDUCTOR PACKAGE WITH HEAT SINK

Structure for controlled shock and vibration of electrical intercon...

Method and structure for controlled shock and vibration of electric...