Detachable connecting means consisting of mechanical auxiliary parts connecting the device

Industry

CPC
H01L24/72

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device

Industries

Patents Grantslast 30 patents

Information Patent Grant
IC package with top-side memory module
- Patent number 11,967,587
- Issue date Apr 23, 2024
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible clip with aligner structure
- Patent number 11,908,826
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device having cantilever electrode, LED display pane...
- Patent number 11,876,069
- Issue date Jan 16, 2024
- SEOUL VIOSYS CO., LTD.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
External contact element for a power semiconductor module and power...
- Patent number 11,810,889
- Issue date Nov 7, 2023
- Infineon Technologies AG
- Andre Uhlemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,806,141
- Issue date Nov 7, 2023
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid short circuit failure mode preform for power semiconductor d...
- Patent number 11,742,312
- Issue date Aug 29, 2023
- Hitachi Energy Switzerland AG
- Didier Cottet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-contact semiconductor device
- Patent number 11,742,313
- Issue date Aug 29, 2023
- Mitsubishi Electric Corporation
- Satoshi Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip having locking recess for connecting an electronic component w...
- Patent number 11,728,309
- Issue date Aug 15, 2023
- Infineon Technologies AG
- Melvin Levardo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring electrode for press-pack power semiconductor module
- Patent number 11,705,424
- Issue date Jul 18, 2023
- Mitsubishi Electric Corporation
- Shigeto Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for arranging said power semi...
- Patent number 11,706,883
- Issue date Jul 18, 2023
- Semikron Elektronik GmbH & Co. KG
- Sandro Bulovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with top-side memory module
- Patent number 11,581,292
- Issue date Feb 14, 2023
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for heater element, method for mounting heater e...
- Patent number 11,574,852
- Issue date Feb 7, 2023
- Fuji Electric Co., Ltd.
- Shun Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device sub-assembly
- Patent number 11,574,894
- Issue date Feb 7, 2023
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 11,569,140
- Issue date Jan 31, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging apparatus and terminal device including anti-shake compensa...
- Patent number 11,570,363
- Issue date Jan 31, 2023
- Huawei Technologies Co., Ltd.
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device having cantilever electrode, LED display pane...
- Patent number 11,538,784
- Issue date Dec 27, 2022
- SEOUL VIOSYS CO., LTD.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-fabricated, stress-engineered members formed on passivation l...
- Patent number 11,527,420
- Issue date Dec 13, 2022
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-pack semiconductor fixtures
- Patent number 11,488,927
- Issue date Nov 1, 2022
- ABB Schweiz AG
- Thomas Kendzia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,471,080
- Issue date Oct 18, 2022
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,437,304
- Issue date Sep 6, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for interconnecting microelectronic circuits
- Patent number 11,431,115
- Issue date Aug 30, 2022
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,382,542
- Issue date Jul 12, 2022
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressing assembly and chip testing apparatus
- Patent number 11,366,136
- Issue date Jun 21, 2022
- ONE TEST SYSTEMS
- Chen-Lung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for securing substrates with varying coefficie...
- Patent number 11,367,701
- Issue date Jun 21, 2022
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly
- Patent number 11,328,977
- Issue date May 10, 2022
- Cobham Colorado Springs Inc.
- Sean Leighton Thorne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microspring structure for hardware trusted platform module
- Patent number 11,289,443
- Issue date Mar 29, 2022
- Palo Alto Research Center Incorporated
- Warren B. Jackson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,234,622
- Issue date Feb 1, 2022
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device and method of forming a semiconductor device
- Patent number 11,217,529
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Stefan Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting module
- Patent number 11,201,131
- Issue date Dec 14, 2021
- Nichia Corporation
- Tomohiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20240090801
- Publication date Mar 21, 2024
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240071952
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS
- Publication number 20240064943
- Publication date Feb 22, 2024
- Toyota Motor Engineering & Manufacturing North America Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Manufacturing A Package Using A Clip Having At Least One...
- Publication number 20230387068
- Publication date Nov 30, 2023
- INFINEON TECHNOLOGIES AG
- Melvin Levardo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CLIP
- Publication number 20230326902
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230299039
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Shun TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES FOR CIRCUIT PROTECTION
- Publication number 20230283278
- Publication date Sep 7, 2023
- NUTECH VENTURES
- Jun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH TOP-SIDE MEMORY MODULE
- Publication number 20230187423
- Publication date Jun 15, 2023
- MARVELL ISRAEL (M.I.S.L) LTD.
- Dan AZEROUAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE HAVING CANTILEVER ELECTRODE, LED DISPLAY PANE...
- Publication number 20230126735
- Publication date Apr 27, 2023
- Seoul Viosys Co., Ltd.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20230086180
- Publication date Mar 23, 2023
- Intel Corporation
- Onur Ozkan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230069296
- Publication date Mar 2, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Woan CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS
- Publication number 20230006374
- Publication date Jan 5, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20230000400
- Publication date Jan 5, 2023
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20220375833
- Publication date Nov 24, 2022
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE...
- Publication number 20220359454
- Publication date Nov 10, 2022
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SECURING SUBSTRATES WITH VARYING COEFFICIE...
- Publication number 20220278068
- Publication date Sep 1, 2022
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL CONTACT ELEMENT FOR A POWER SEMICONDUCTOR MODULE AND POWER...
- Publication number 20220278070
- Publication date Sep 1, 2022
- Andre Uhlemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-PACK SEMICONDUCTOR FIXTURES
- Publication number 20220262763
- Publication date Aug 18, 2022
- ABB Schweiz AG
- Thomas Kendzia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDED COOLING MODULE WITH POWER TRANSISTOR SUBMODULES
- Publication number 20220238413
- Publication date Jul 28, 2022
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CIRCUITS WITH FLEXIBLE INTERCONNECTS
- Publication number 20220240383
- Publication date Jul 28, 2022
- DUJUD LLC
- Reza Abbaspour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESILIENT ELECTRICAL CONNECTORS FOR ELECTROMAGNETIC INTERFERENCE SH...
- Publication number 20220139843
- Publication date May 5, 2022
- Intel Corporation
- Jun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSING ASSEMBLY AND CHIP TESTING APPARATUS
- Publication number 20220128600
- Publication date Apr 28, 2022
- ONE TEST SYSTEMS
- CHEN-LUNG TSAI
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE-CONTACT SEMICONDUCTOR DEVICE
- Publication number 20220108972
- Publication date Apr 7, 2022
- Mitsubishi Electric Corporation
- Satoshi OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093562
- Publication date Mar 24, 2022
- Kabushiki Kaisha Toshiba
- Hideaki KITAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Short Circuit Failure Mode Preform for Power Semiconductor D...
- Publication number 20220028822
- Publication date Jan 27, 2022
- ABB Schweiz AG
- Didier Cottet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE-CONTACT-TYPE SEMICONDUCTOR DEVICE
- Publication number 20220005783
- Publication date Jan 6, 2022
- Mitsubishi Electric Corporation
- Jun OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20210345914
- Publication date Nov 11, 2021
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE FOR HEATER ELEMENT, METHOD FOR MOUNTING HEATER E...
- Publication number 20210327784
- Publication date Oct 21, 2021
- Fuji Electric Co., Ltd.
- Shun FUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING APPARATUS AND TERMINAL DEVICE
- Publication number 20210281761
- Publication date Sep 9, 2021
- Huawei Technologies Co., Ltd
- Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connectors for Interconnecting Microelectronic Circuits
- Publication number 20210257758
- Publication date Aug 19, 2021
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS

Detachable connecting means consisting of mechanical auxiliary parts connecting the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

IC package with top-side memory module

Flexible clip with aligner structure

Light emitting device having cantilever electrode, LED display pane...

Hybrid felts of electrospun nanofibers

External contact element for a power semiconductor module and power...

Connectors for making connections between analyte sensors and other...

Hybrid short circuit failure mode preform for power semiconductor d...

Pressure-contact semiconductor device

Clip having locking recess for connecting an electronic component w...

Spring electrode for press-pack power semiconductor module

Power semiconductor module and method for arranging said power semi...

IC package with top-side memory module

Mounting structure for heater element, method for mounting heater e...

Semiconductor device sub-assembly

Semiconductor package with elastic coupler and related methods

Imaging apparatus and terminal device including anti-shake compensa...

Light emitting device having cantilever electrode, LED display pane...

Micro-fabricated, stress-engineered members formed on passivation l...

Press-pack semiconductor fixtures

Connectors for making connections between analyte sensors and other...

Substrate structures and methods of manufacture

Connectors for interconnecting microelectronic circuits

Connectors for making connections between analyte sensors and other...

Pressing assembly and chip testing apparatus

Apparatus and method for securing substrates with varying coefficie...

Flip chip assembly

Microspring structure for hardware trusted platform module

Connectors for making connections between analyte sensors and other...

Semiconductor device and method of forming a semiconductor device

Light emitting module

Patents Applicationslast 30 patents

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS

Method Of Manufacturing A Package Using A Clip Having At Least One...

FLEXIBLE CLIP

SEMICONDUCTOR DEVICE

POWER MODULES FOR CIRCUIT PROTECTION

IC PACKAGE WITH TOP-SIDE MEMORY MODULE

LIGHT EMITTING DEVICE HAVING CANTILEVER ELECTRODE, LED DISPLAY PANE...

DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION

DISPLAY DEVICE

MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE...

APPARATUS AND METHOD FOR SECURING SUBSTRATES WITH VARYING COEFFICIE...

EXTERNAL CONTACT ELEMENT FOR A POWER SEMICONDUCTOR MODULE AND POWER...

PRESS-PACK SEMICONDUCTOR FIXTURES

DOUBLE SIDED COOLING MODULE WITH POWER TRANSISTOR SUBMODULES

THREE-DIMENSIONAL CIRCUITS WITH FLEXIBLE INTERCONNECTS

RESILIENT ELECTRICAL CONNECTORS FOR ELECTROMAGNETIC INTERFERENCE SH...

PRESSING ASSEMBLY AND CHIP TESTING APPARATUS

PRESSURE-CONTACT SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Hybrid Short Circuit Failure Mode Preform for Power Semiconductor D...

PRESSURE-CONTACT-TYPE SEMICONDUCTOR DEVICE

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

MOUNTING STRUCTURE FOR HEATER ELEMENT, METHOD FOR MOUNTING HEATER E...

IMAGING APPARATUS AND TERMINAL DEVICE

Connectors for Interconnecting Microelectronic Circuits