Detaching bonding areas

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CPC
H01L2224/80052

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80052Detaching bonding areas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
- Patent number 11,791,305
- Issue date Oct 17, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe methodology for ultrafine pitch interconnects
- Patent number 10,748,824
- Issue date Aug 18, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe methodology for ultrafine pitch interconnects
- Patent number 10,529,634
- Issue date Jan 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor wafer bonding and system thereof
- Patent number 10,410,892
- Issue date Sep 10, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor formation using cold welding
- Patent number 8,941,147
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Cheng-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240332247
- Publication date Oct 3, 2024
- Nichia Corporation.
- Hiroaki KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20240321820
- Publication date Sep 26, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Mark SCANNELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING REPAIR DEVICES
- Publication number 20240222319
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...
- Publication number 20220262764
- Publication date Aug 18, 2022
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE METHODOLOGY FOR ULTRAFINE PITCH INTERCONNECTS
- Publication number 20200105630
- Publication date Apr 2, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Probe methodology for ultrafine pitch Interconnects
- Publication number 20180331000
- Publication date Nov 15, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEMICONDUCTOR WAFER BONDING AND SYSTEM THEREOF
- Publication number 20180144999
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-LIANG LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR FORMATION USING COLD WELDING
- Publication number 20150311179
- Publication date Oct 29, 2015
- International Business Machines Corporation
- CHENG-WEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR FORMATION USING COLD WELDING
- Publication number 20140094006
- Publication date Apr 3, 2014
- International Business Machines Corporation
- CHENG-WEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR FORMATION USING COLD WELDING
- Publication number 20140091370
- Publication date Apr 3, 2014
- International Business Machines Corporation
- CHENG-WEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS

Detaching bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing apparatus, operation method thereof, and method for m...

Probe methodology for ultrafine pitch interconnects

Probe methodology for ultrafine pitch interconnects

Method of semiconductor wafer bonding and system thereof

Transistor formation using cold welding

Patents Applicationslast 30 patents

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME

BONDING METHOD

DEBONDING REPAIR DEVICES

MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...

PROBE METHODOLOGY FOR ULTRAFINE PITCH INTERCONNECTS

Probe methodology for ultrafine pitch Interconnects

METHOD OF SEMICONDUCTOR WAFER BONDING AND SYSTEM THEREOF

TRANSISTOR FORMATION USING COLD WELDING

TRANSISTOR FORMATION USING COLD WELDING

TRANSISTOR FORMATION USING COLD WELDING