Detaching layer connectors

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CPC
H01L2224/83052

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83052Detaching layer connectors

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 11,948,908
- Issue date Apr 2, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing a light-emitting device and a method for manuf...
- Patent number 11,916,041
- Issue date Feb 27, 2024
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection structure and detection method
- Patent number 11,915,985
- Issue date Feb 27, 2024
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Qin Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device transferring method, and micro device substrate manufa...
- Patent number 10,770,426
- Issue date Sep 8, 2020
- CENTER FOR ADVANCED META-MATERIALS
- Yun Hwangbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-bonding methods and articles for semiconductor and interpos...
- Patent number 10,510,576
- Issue date Dec 17, 2019
- Corning Incorporated
- Darwin Gene Enicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,236,408
- Issue date Mar 19, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating diamond-semiconductor composite substrates
- Patent number 10,043,700
- Issue date Aug 7, 2018
- RFHIC CORPORATION
- Daniel Francis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PANEL-LEVEL SEMICONDUCTOR PACKAGING METHOD
- Publication number 20240404974
- Publication date Dec 5, 2024
- PEP INNOVATION PTE LTD.
- Munirathinam Senthil Kumar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...
- Publication number 20220181293
- Publication date Jun 9, 2022
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION STRUCTURE AND DETECTION METHOD
- Publication number 20220148930
- Publication date May 12, 2022
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Qin KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION METHOD AND DETECTION STRUCTURE FOR DISPLAY BACKPLANE
- Publication number 20220148929
- Publication date May 12, 2022
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Ruilin XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20220005780
- Publication date Jan 6, 2022
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DIAMOND-SEMICONDUCTOR COMPOSITE SUBSTRATES
- Publication number 20180151404
- Publication date May 31, 2018
- RFHIC Corporation
- Daniel FRANCIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-BONDING METHODS AND ARTICLES FOR SEMICONDUCTOR AND INTERPOS...
- Publication number 20150102498
- Publication date Apr 16, 2015
- Corning Incorporated
- Darwin Gene Enicks
- H01 - BASIC ELECTRIC ELEMENTS

Detaching layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and manufacturing method of electronic device

Method for repairing a light-emitting device and a method for manuf...

Detection structure and detection method

Micro device transferring method, and micro device substrate manufa...

Carrier-bonding methods and articles for semiconductor and interpos...

Method for manufacturing semiconductor device

Method of fabricating diamond-semiconductor composite substrates

Patents Applicationslast 30 patents

PANEL-LEVEL SEMICONDUCTOR PACKAGING METHOD

METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...

DETECTION STRUCTURE AND DETECTION METHOD

DETECTION METHOD AND DETECTION STRUCTURE FOR DISPLAY BACKPLANE

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

METHOD OF FABRICATING DIAMOND-SEMICONDUCTOR COMPOSITE SUBSTRATES

CARRIER-BONDING METHODS AND ARTICLES FOR SEMICONDUCTOR AND INTERPOS...