Details of components or other objects attached to or integrated in a printed circuit board

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Thermal Management Enhancement of Electronic Components

    • Publication number 20250240867
    • Publication date Jul 24, 2025
    • Wolfspeed, Inc.
    • Kenneth P. Brewer
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RELAY, POWER DISTRIBUTION APPARATUS, AND CHARGING PILE

    • Publication number 20250240892
    • Publication date Jul 24, 2025
    • Huawei Digital Power Technologies Co., Ltd.
    • Qiao WANG
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    MULTI-LAYER FAN BASE

    • Publication number 20250240912
    • Publication date Jul 24, 2025
    • Apple Inc.
    • Anthony J. AIELLO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD

    • Publication number 20250239408
    • Publication date Jul 24, 2025
    • Taiyo Yuden Co., Ltd.
    • Ayumi SHIROTA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD INCLUDING FIXING PART AND ELECTRONIC DEVICE C...

    • Publication number 20250240529
    • Publication date Jul 24, 2025
    • Samsung Electronics Co., Ltd.
    • Bongchan KIM
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMIN...

    • Publication number 20250240871
    • Publication date Jul 24, 2025
    • STMicroelectronics International N.V.
    • Deborah COGONI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

    • Publication number 20250240874
    • Publication date Jul 24, 2025
    • Murata Manufacturing Co., Ltd.
    • Ryutatsu MIZUKAMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY DEVICE

    • Publication number 20250240880
    • Publication date Jul 24, 2025
    • LG Display Co., Ltd.
    • Binn KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC APPARATUS

    • Publication number 20250240888
    • Publication date Jul 24, 2025
    • SAMSUNG DISPLAY CO., LTD.
    • JAEJIN OH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY DEVICE

    • Publication number 20250240894
    • Publication date Jul 24, 2025
    • LG Display Co., Ltd.
    • Jicheol SON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INFORMATION PROCESSING DEVICE

    • Publication number 20250240053
    • Publication date Jul 24, 2025
    • NIDEC INSTRUMENTS CORPORATION
    • Shinya MIYAZAWA
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Wireless Connector System

    • Publication number 20250239769
    • Publication date Jul 24, 2025
    • NUCURRENT, INC.
    • Vinit Singh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY APPARATUS

    • Publication number 20250237900
    • Publication date Jul 24, 2025
    • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Ren XIONG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    INDUCTANCE STRUCTURE

    • Publication number 20250239396
    • Publication date Jul 24, 2025
    • TAI-TECH ADVANCED ELECTRONICS CO., LTD.
    • Ming-Yen Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20250240866
    • Publication date Jul 24, 2025
    • Sony Interactive Entertainment Inc.
    • Takayuki HACHIYA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TILED DISPLAY PANEL AND DISPLAY DEVICE

    • Publication number 20250241065
    • Publication date Jul 24, 2025
    • Chengdu Vistar Optoelectronics Co., Ltd.
    • Zhenli SONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN

    • Publication number 20250239911
    • Publication date Jul 24, 2025
    • Milwaukee Electric Tool Corporation
    • Matthew J. Mergener
    • B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
  • Information Patent Application

    TWIN CRYSTAL COPPER MATERIAL AND HYBRID BONDING STRUCTURE

    • Publication number 20250236981
    • Publication date Jul 24, 2025
    • SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES
    • Zhi-Quan LIU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    LENS MODULE AND TERMINAL DEVICE

    • Publication number 20250240875
    • Publication date Jul 24, 2025
    • Rayprus Technology (Foshan) Co., Ltd.
    • Jia-Qi Wu
    • G02 - OPTICS
  • Information Patent Application

    CIRCUIT BOARD AND IMAGE FORMING APPARATUS

    • Publication number 20250240881
    • Publication date Jul 24, 2025
    • Canon Kabushiki Kaisha
    • TAKESHI HONDA
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    INTERPOSER FOR ACTIVE IMPLANTABLE MEDICAL DEVICE

    • Publication number 20250240886
    • Publication date Jul 24, 2025
    • NeuroPace, Inc.
    • Joseph Vandenburg
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE STRUCTURE

    • Publication number 20250240893
    • Publication date Jul 24, 2025
    • Advanced Semiconductor Engineering, Inc.
    • Che-Neng LIU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    CNC SWITCH DEVICE AND CONTROL METHOD

    • Publication number 20250231574
    • Publication date Jul 17, 2025
    • Fly Cat Electrical Co.,Ltd.
    • Xiao LIU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE-LEVEL THERMAL MANAGEMENT MECHANISM

    • Publication number 20250234452
    • Publication date Jul 17, 2025
    • Micron Technology, Inc.
    • Mark A. Tverdy
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC C...

    • Publication number 20250234455
    • Publication date Jul 17, 2025
    • TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    • MING-HSUN LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR MODULE

    • Publication number 20250233030
    • Publication date Jul 17, 2025
    • Samsung Electronics Co., Ltd.
    • Hwanjoo Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY

    • Publication number 20250234451
    • Publication date Jul 17, 2025
    • ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
    • Uwe Waltrich
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENTS

    • Publication number 20250234460
    • Publication date Jul 17, 2025
    • Canon Kabushiki Kaisha
    • Naoyuki NAKAGAWARA
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE

    • Publication number 20250233092
    • Publication date Jul 17, 2025
    • INFINEON TECHNOLOGIES AG
    • Ivan Nikitin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...

    • Publication number 20250227837
    • Publication date Jul 10, 2025
    • Rockwell Collins, Inc.
    • John A. Bauer
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR