Details of electrostatic chucks

Industry

CPC
H01L21/6833

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6833Details of electrostatic chucks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Dielectric substance-electrode assembly and method of manufacturing...
- Patent number 11,974,382
- Issue date Apr 30, 2024
- Korea Institute of Industrial Technology
- Taeg Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and substrate support of plasma process...
- Patent number 11,972,933
- Issue date Apr 30, 2024
- Tokyo Electron Limited
- Masahiro Dogome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support for chucking of mask for deposition processes
- Patent number 11,967,516
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Jrjyan Jerry Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck with ceramic monolithic body
- Patent number 11,967,517
- Issue date Apr 23, 2024
- Lam Research Corporation
- Feng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 11,967,511
- Issue date Apr 23, 2024
- Tokyo Electron Limited
- Akira Ishikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate fixing device
- Patent number 11,961,754
- Issue date Apr 16, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroki Oguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support and substrate processing apparatus
- Patent number 11,961,755
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Shinya Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite green sheet and ceramic member
- Patent number 11,952,316
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic susceptor
- Patent number 11,955,320
- Issue date Apr 9, 2024
- MiCo Ceramics Ltd.
- Ju Sung Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck with high insulation performance and electrosta...
- Patent number 11,951,583
- Issue date Apr 9, 2024
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic chuck and processing apparatus
- Patent number 11,955,360
- Issue date Apr 9, 2024
- Tocalo Co., Ltd.
- Takeshi Takabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with mesas
- Patent number 11,955,361
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power electrostatic chuck design with radio frequency coupling
- Patent number 11,948,826
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Jaeyong Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer placement table
- Patent number 11,948,825
- Issue date Apr 2, 2024
- NGK Insulators, Ltd.
- Kenichiro Aikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck and substrate holding device
- Patent number 11,942,350
- Issue date Mar 26, 2024
- Shinko Electric Industries Co., Ltd.
- Masakuni Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chucks with coolant gas zones and corresponding groov...
- Patent number 11,942,351
- Issue date Mar 26, 2024
- Lam Research Corporation
- Alexander Matyushkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatically clamped edge ring
- Patent number 11,935,776
- Issue date Mar 19, 2024
- Lam Research Corporation
- Christopher Kimball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixelated electrostatic adhesion
- Patent number 11,936,308
- Issue date Mar 19, 2024
- The Boeing Company
- David M. Bain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus having electrostatic chuck and subst...
- Patent number 11,929,251
- Issue date Mar 12, 2024
- ASM IP Holding B.V.
- Toshihisa Nozawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite sintered body, semiconductor manufacturing apparatus memb...
- Patent number 11,926,570
- Issue date Mar 12, 2024
- NGK Insulators, Ltd.
- Kyohei Atsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and semiconductor device manufacturing...
- Patent number 11,929,239
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Sejin Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer supporting device
- Patent number 11,929,266
- Issue date Mar 12, 2024
- NISSIN ION EQUIPMENT CO., LTD.
- Takashi Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low impedance current path for edge non-uniformity tuning
- Patent number 11,929,278
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Madhu Santosh Kumar Mutyala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Correction data creating method, substrate processing method, and s...
- Patent number 11,923,211
- Issue date Mar 5, 2024
- Tokyo Electron Limited
- Hiroki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 11,923,229
- Issue date Mar 5, 2024
- Tokyo Electron Limited
- Yusuke Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 11,923,171
- Issue date Mar 5, 2024
- Tokyo Electron Limited
- Junichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage and plasma processing apparatus
- Patent number 11,923,228
- Issue date Mar 5, 2024
- Tokyo Electron Limited
- Takehiro Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck and method for manufacturing same
- Patent number 11,923,227
- Issue date Mar 5, 2024
- Kyocera Corporation
- Yasunori Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-function wafer backside pressure control and edge purge
- Patent number 11,923,233
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Joseph AuBuchon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Detector for process kit ring wear
- Patent number 11,913,777
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Yogananda Sarode Vishwanath
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Hermetic Tubular Linear Motor Based Wafer Lift Actuator
- Publication number 20240145291
- Publication date May 2, 2024
- Applied Materials, Inc.
- Alexander SULYMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK ASSEMBLY
- Publication number 20240145220
- Publication date May 2, 2024
- Applied Materials, Inc.
- Jaeyong CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20240145288
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Youngbok LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELEC...
- Publication number 20240136214
- Publication date Apr 25, 2024
- LAM RESEARCH CORPORATION
- Siyuan TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSECOND PULSER ADC SYSTEM
- Publication number 20240136152
- Publication date Apr 25, 2024
- Eagle Harbor Technologies, Inc.
- Kenneth Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE RESTRAINING SYSTEM
- Publication number 20240136218
- Publication date Apr 25, 2024
- ASML NETHERLANDS B.V.
- Marinus Augustinus Christiaan VERSCHUREN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIPOLAR ELECTRODE ARRANGEMENT FOR ELECTROSTATIC CHUCKS
- Publication number 20240136161
- Publication date Apr 25, 2024
- LAM RESEARCH CORPORATION
- Karl Frederick LEESER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240136157
- Publication date Apr 25, 2024
- SEMES CO., LTD.
- Je Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION APPARATUS
- Publication number 20240131555
- Publication date Apr 25, 2024
- SAMSUNG DISPLAY CO., LTD.
- MINCHUL SONG
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR L...
- Publication number 20240120218
- Publication date Apr 11, 2024
- LG ELECTRONICS INC.
- Kitae AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR ELECTROSTATIC CHUCK FOR ETCH CHAMBER
- Publication number 20240120229
- Publication date Apr 11, 2024
- Shinichi OKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING...
- Publication number 20240120224
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Jin Hyuk CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PLATE ELECTROSTATIC CHUCKS WITH CERAMIC BASEPLATES
- Publication number 20240112893
- Publication date Apr 4, 2024
- LAM RESEARCH CORPORATION
- Feng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS
- Publication number 20240112894
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Sankaranarayanan RAVI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE DIAMETER POROUS PLUG FOR ARGON DELIVERY
- Publication number 20240112889
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Tony Jefferson GNANAPRAKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- Publication number 20240112895
- Publication date Apr 4, 2024
- TOKYO ELECTRON LIMITED
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK HEATER AND MANUFACTURING METHOD THEREFOR
- Publication number 20240112940
- Publication date Apr 4, 2024
- MICO CERAMICS LTD.
- Jin Young CHOI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
FILM STRESS CONTROL FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION
- Publication number 20240105427
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Chien-Teh KAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROSTATIC CHUCK ASSEMBLY
- Publication number 20240105488
- Publication date Mar 28, 2024
- NGK Insulators, Ltd.
- Hiroshi TAKEBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK
- Publication number 20240105489
- Publication date Mar 28, 2024
- KYOCERA CORPORATION
- Wataru FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK
- Publication number 20240100639
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- INSEOK SEO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH POWER CABLE FOR HEATED COMPONENTS IN RF ENVIRONMENT
- Publication number 20240105429
- Publication date Mar 28, 2024
- Lam Reseach Corporation
- Seyed Jafar JAFARIAN-TEHRANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION
- Publication number 20240096688
- Publication date Mar 21, 2024
- Applied Materials, Inc.
- Michael Robert Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME
- Publication number 20240096679
- Publication date Mar 21, 2024
- SAMSUNG DISPLAY CO., LTD.
- JUNHYEUK KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF
- Publication number 20240096678
- Publication date Mar 21, 2024
- Intel Corporation
- Deniz TURAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS
- Publication number 20240096680
- Publication date Mar 21, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CARBON FILMS FOR PATTERNING APPLICATIONS
- Publication number 20240087894
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Eswaranand VENKATASUBRAMANIAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PIXELATED CHUCK FOR RETAINING WARPED SEMICONDUCTOR WAFERS
- Publication number 20240087939
- Publication date Mar 14, 2024
- International Business Machines Corporation
- VINAY PAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE SEAL FOR LOWER ELECTRODE ASSEMBLY
- Publication number 20240077138
- Publication date Mar 7, 2024
- LAM RESEARCH CORPORATION
- David SCHAEFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20240079217
- Publication date Mar 7, 2024
- NGK Insulators, Ltd.
- Tatsuya KUNO
- H01 - BASIC ELECTRIC ELEMENTS

Details of electrostatic chucks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dielectric substance-electrode assembly and method of manufacturing...

Plasma processing apparatus and substrate support of plasma process...

Substrate support for chucking of mask for deposition processes

Electrostatic chuck with ceramic monolithic body

Plasma processing apparatus

Substrate fixing device

Substrate support and substrate processing apparatus

Composite green sheet and ceramic member

Ceramic susceptor

Electrostatic chuck with high insulation performance and electrosta...

Electrostatic chuck and processing apparatus

Electrostatic chuck with mesas

High power electrostatic chuck design with radio frequency coupling

Wafer placement table

Electrostatic chuck and substrate holding device

Electrostatic chucks with coolant gas zones and corresponding groov...

Electrostatically clamped edge ring

Pixelated electrostatic adhesion

Substrate processing apparatus having electrostatic chuck and subst...

Composite sintered body, semiconductor manufacturing apparatus memb...

Plasma processing apparatus and semiconductor device manufacturing...

Wafer supporting device

Low impedance current path for edge non-uniformity tuning

Correction data creating method, substrate processing method, and s...

Plasma processing method and plasma processing apparatus

Plasma processing apparatus and plasma processing method

Stage and plasma processing apparatus

Electrostatic chuck and method for manufacturing same

Dual-function wafer backside pressure control and edge purge

Detector for process kit ring wear

Patents Applicationslast 30 patents

Hermetic Tubular Linear Motor Based Wafer Lift Actuator

ELECTROSTATIC CHUCK ASSEMBLY

SUBSTRATE PROCESSING APPARATUS

LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELEC...

NANOSECOND PULSER ADC SYSTEM

SUBSTRATE RESTRAINING SYSTEM

TRIPOLAR ELECTRODE ARRANGEMENT FOR ELECTROSTATIC CHUCKS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

DEPOSITION APPARATUS

ELECTRODE STRUCTURE OF ROLLER UNIT FOR TRANSFERRING SEMICONDUCTOR L...

BIPOLAR ELECTROSTATIC CHUCK FOR ETCH CHAMBER

SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING...

MULTI-PLATE ELECTROSTATIC CHUCKS WITH CERAMIC BASEPLATES

FLUID CONDUIT AND FLANGE FOR HIGH BIAS APPLICATIONS

LARGE DIAMETER POROUS PLUG FOR ARGON DELIVERY

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

ELECTROSTATIC CHUCK HEATER AND MANUFACTURING METHOD THEREFOR

FILM STRESS CONTROL FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION

ELECTROSTATIC CHUCK ASSEMBLY

ELECTROSTATIC CHUCK

ELECTROSTATIC CHUCK

HIGH POWER CABLE FOR HEATED COMPONENTS IN RF ENVIRONMENT

SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION

SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME

CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF

ELECTROSTATIC CHUCK ASSEMBLY FOR PLASMA PROCESSING APPARATUS

HIGH DENSITY CARBON FILMS FOR PATTERNING APPLICATIONS

PIXELATED CHUCK FOR RETAINING WARPED SEMICONDUCTOR WAFERS

EDGE SEAL FOR LOWER ELECTRODE ASSEMBLY

WAFER PLACEMENT TABLE