Details of electrostatic chucks

Industry

CPC
H01L21/6833

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6833Details of electrostatic chucks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ceramic susceptor and method of manufacturing same
- Patent number 12,237,204
- Issue date Feb 25, 2025
- MiCo Ceramics Ltd.
- So Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,235,287
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Daesung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lift pin interface in a substrate support
- Patent number 12,237,200
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Alexander Sulyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer placement table
- Patent number 12,237,156
- Issue date Feb 25, 2025
- NGK Insulators, Ltd.
- Tatsuya Kuno
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor-manufacturing apparatus member and method of manufact...
- Patent number 12,238,826
- Issue date Feb 25, 2025
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chucks with coolant gas zones and corresponding groov...
- Patent number 12,237,201
- Issue date Feb 25, 2025
- Lam Research Corporation
- Alexander Matyushkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck and substrate fixing device
- Patent number 12,230,527
- Issue date Feb 18, 2025
- Shinko Electric Industries Co., Ltd.
- Yusuke Muramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanosecond pulser ADC system
- Patent number 12,230,477
- Issue date Feb 18, 2025
- Eagle Harbor Technologies, Inc.
- Kenneth Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching apparatus
- Patent number 12,230,505
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Akihiro Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer probe device
- Patent number 12,228,590
- Issue date Feb 18, 2025
- Winbond Electronics Corp.
- Ting-Ming Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck heater
- Patent number 12,230,526
- Issue date Feb 18, 2025
- NGK Insulators, Ltd.
- Tatsuya Kuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centering wafer for processing chamber
- Patent number 12,224,195
- Issue date Feb 11, 2025
- Applied Materials, Inc.
- Muhannad Mustafa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode pattern structure of concentric-circular-structured elect...
- Patent number 12,224,197
- Issue date Feb 11, 2025
- RAYCER ADVANCED MATERIALS TECHNOLOGY CO., LTD
- Juxian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with mesas
- Patent number 12,224,198
- Issue date Feb 11, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature manifold assembly for substrate processing systems
- Patent number 12,224,161
- Issue date Feb 11, 2025
- Lam Research Corporation
- Gabriel De Jesus Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and electrostatic chuck
- Patent number 12,217,943
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Kohei Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power cable for heated components in RF environment
- Patent number 12,217,944
- Issue date Feb 4, 2025
- Lam Research Corporation
- Seyed Jafar Jafarian-Tehrani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting conductive balls using electrostatic chuck
- Patent number 12,217,995
- Issue date Feb 4, 2025
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus, and plasma processing method
- Patent number 12,217,941
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Satoru Kawakami
- B08 - CLEANING
Information Patent Grant
RF tuning systems including tuning circuits having impedances for s...
- Patent number 12,217,939
- Issue date Feb 4, 2025
- Lam Research Corporation
- David French
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck device and sleeve for electrostatic chuck device
- Patent number 12,217,994
- Issue date Feb 4, 2025
- TOMOEGAWA CORPORATION
- Nobuyoshi Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck design with improved chucking and arcing perfor...
- Patent number 12,211,728
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Abdul Aziz Khaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor manufacturing apparatus
- Patent number 12,211,729
- Issue date Jan 28, 2025
- NGK Insulators, Ltd.
- Natsuki Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer placement table
- Patent number 12,211,671
- Issue date Jan 28, 2025
- NGK Insulators, Ltd.
- Tatsuya Kuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lift pin mechanism
- Patent number 12,211,734
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Alexander Sulyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor manufacturing apparatus
- Patent number 12,211,726
- Issue date Jan 28, 2025
- NGK Insulators, Ltd.
- Seiya Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking
- Patent number 12,211,727
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck assembly
- Patent number 12,211,725
- Issue date Jan 28, 2025
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance measurement jig and method of controlling a substrate-pro...
- Patent number 12,210,045
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Byeongsang Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ground electrode formed in an electrostatic chuck for a plasma proc...
- Patent number 12,205,843
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Michael R. Rice
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROSTATIC CHUCK
- Publication number 20250069933
- Publication date Feb 27, 2025
- TOTO LTD.
- Masafumi IKEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK DEVICE
- Publication number 20250069936
- Publication date Feb 27, 2025
- Tomoegawa Corporation
- Tomoya HAGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250069862
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Nobutaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC PLATE
- Publication number 20250069930
- Publication date Feb 27, 2025
- NGK Insulators, Ltd.
- Takahiro ANDO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
ELECTROSTATIC CHUCK MEMBER, ELECTROSTATIC CHUCK DEVICE, AND PRODUCT...
- Publication number 20250069931
- Publication date Feb 27, 2025
- Sumitomo Osaka Cement Co., Ltd.
- Satoyoshi INUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUSCEPTOR AND METHOD OF MANUFACTURING SAME
- Publication number 20250069941
- Publication date Feb 27, 2025
- MICO CERAMICS LTD.
- So Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OBJECT HOLDER, LITHOGRAPHIC APPARATUS COMPRISING SUCH OBJECT HOLDER...
- Publication number 20250069932
- Publication date Feb 27, 2025
- ASML NETHERLANDS B.V.
- Martinus Cornelis REIJNEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE WAFER CHUCK
- Publication number 20250069934
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...
- Publication number 20250069935
- Publication date Feb 27, 2025
- KIOXIA Corporation
- Wu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS
- Publication number 20250069944
- Publication date Feb 27, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Bo-Ru CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUSCEPTOR HEIGHT ADJUSTMENT
- Publication number 20250069928
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20250069929
- Publication date Feb 27, 2025
- NGK Insulators, Ltd.
- Seiya INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK WITH SEAL SURFACE
- Publication number 20250062150
- Publication date Feb 20, 2025
- LAM RESEARCH CORPORATION
- Patrick Girard Breiling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC ADSORPTION TOOL AND OBJECT SURFACE PROCESSING METHOD
- Publication number 20250062704
- Publication date Feb 20, 2025
- TSUKUBASEIKO Co., LTD.
- Fow-Lai POH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCKS WITH SELF-SEALING GAS CONDUITS AND/OR REDUCED...
- Publication number 20250062149
- Publication date Feb 20, 2025
- LAM RESEARCH CORPORATION
- Kadthala R. NARENDRNATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE SUPPORT LEVELING APPARATUS
- Publication number 20250054797
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Katherine Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD
- Publication number 20250054798
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT...
- Publication number 20250050439
- Publication date Feb 13, 2025
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOLDING APPARATUS
- Publication number 20250054799
- Publication date Feb 13, 2025
- Niterra Co., Ltd.
- Akira INAYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE ESC FOR RAPID ALTERNATING PROCESS APPLICATIONS
- Publication number 20250054738
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Dan MAROHL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMP...
- Publication number 20250054803
- Publication date Feb 13, 2025
- PSK Holdings Inc.
- Gunwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A WAFER CHUCK ASSEMBLY WITH THERMAL INSULATION FOR RF CONNECTIONS
- Publication number 20250054736
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Patrick G. BREILING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERED ALUMINA MATERIAL AND ELECTROSTATIC CHUCK
- Publication number 20250046641
- Publication date Feb 6, 2025
- Niterra Co., Ltd.
- Motoki HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC SPECTROSCOPY TEMPERATURE MONITORING USING ELECTROSTATIC...
- Publication number 20250046640
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Ori NOKED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...
- Publication number 20250038030
- Publication date Jan 30, 2025
- CANON KABUSIKI KAISHA
- Byung-Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER PROCESSING METHOD
- Publication number 20250038033
- Publication date Jan 30, 2025
- Hitachi High-Tech Corporation
- Nozomu YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR RADIO FREQUENCY GRID DESIGN IN AN ESC TO R...
- Publication number 20250038034
- Publication date Jan 30, 2025
- LAM RESEARCH CORPORATION
- Stephen Topping
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK, TEMPERATURE CONTROL SYSTEM, AND TEMPERATURE CONTROL ME...
- Publication number 20250038035
- Publication date Jan 30, 2025
- TOKYO SEIMITSU CO., LTD.
- Takenori TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK MODULE
- Publication number 20250029863
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Naoyuki TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT
- Publication number 20250022724
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Masanori TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS

Details of electrostatic chucks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic susceptor and method of manufacturing same

Substrate processing apparatus

Lift pin interface in a substrate support

Wafer placement table

Semiconductor-manufacturing apparatus member and method of manufact...

Electrostatic chucks with coolant gas zones and corresponding groov...

Electrostatic chuck and substrate fixing device

Nanosecond pulser ADC system

Etching apparatus

Wafer probe device

Electrostatic chuck heater

Centering wafer for processing chamber

Electrode pattern structure of concentric-circular-structured elect...

Electrostatic chuck with mesas

Low temperature manifold assembly for substrate processing systems

Substrate processing apparatus and electrostatic chuck

High power cable for heated components in RF environment

Method of mounting conductive balls using electrostatic chuck

Plasma processing apparatus, and plasma processing method

RF tuning systems including tuning circuits having impedances for s...

Electrostatic chuck device and sleeve for electrostatic chuck device

Electrostatic chuck design with improved chucking and arcing perfor...

Member for semiconductor manufacturing apparatus

Wafer placement table

Lift pin mechanism

Member for semiconductor manufacturing apparatus

Simultaneous bonding approach for high quality wafer stacking

Electrostatic chuck assembly

Impedance measurement jig and method of controlling a substrate-pro...

Ground electrode formed in an electrostatic chuck for a plasma proc...

Patents Applicationslast 30 patents

ELECTROSTATIC CHUCK

ELECTROSTATIC CHUCK DEVICE

SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING APPARATUS

CERAMIC PLATE

ELECTROSTATIC CHUCK MEMBER, ELECTROSTATIC CHUCK DEVICE, AND PRODUCT...

CERAMIC SUSCEPTOR AND METHOD OF MANUFACTURING SAME

OBJECT HOLDER, LITHOGRAPHIC APPARATUS COMPRISING SUCH OBJECT HOLDER...

ADJUSTABLE WAFER CHUCK

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...

SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS

SUSCEPTOR HEIGHT ADJUSTMENT

MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS

ELECTROSTATIC CHUCK WITH SEAL SURFACE

ELECTROSTATIC ADSORPTION TOOL AND OBJECT SURFACE PROCESSING METHOD

ELECTROSTATIC CHUCKS WITH SELF-SEALING GAS CONDUITS AND/OR REDUCED...

SEMICONDUCTOR SUBSTRATE SUPPORT LEVELING APPARATUS

BONDING SYSTEM AND METHOD

SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT...

HOLDING APPARATUS

TUNABLE ESC FOR RAPID ALTERNATING PROCESS APPLICATIONS

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMP...

A WAFER CHUCK ASSEMBLY WITH THERMAL INSULATION FOR RF CONNECTIONS

SINTERED ALUMINA MATERIAL AND ELECTROSTATIC CHUCK

DIELECTRIC SPECTROSCOPY TEMPERATURE MONITORING USING ELECTROSTATIC...

SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...

SEMICONDUCTOR WAFER PROCESSING METHOD

METHOD AND APPARATUS FOR RADIO FREQUENCY GRID DESIGN IN AN ESC TO R...

WAFER CHUCK, TEMPERATURE CONTROL SYSTEM, AND TEMPERATURE CONTROL ME...

ELECTROSTATIC CHUCK MODULE

SUBSTRATE SUPPORT