Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17

Industry

CPC
H05K2203/30

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a laminate structure having a plated through-hole...
- Patent number 12,150,254
- Issue date Nov 19, 2024
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board assembly sheet
- Patent number 12,120,829
- Issue date Oct 15, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screen-printing screen and process for obtaining glazings equipped...
- Patent number 12,049,093
- Issue date Jul 30, 2024
- Saint-Gobain Glass France
- André Beyrle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device manufacturing apparatus with rotator and display dev...
- Patent number 11,937,490
- Issue date Mar 19, 2024
- Samsung Display Co., Ltd.
- Myung Gil Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost panel AESA with thermal management
- Patent number 11,917,746
- Issue date Feb 27, 2024
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and electronic apparatus
- Patent number 11,818,844
- Issue date Nov 14, 2023
- Canon Kabushiki Kaisha
- Yuya Karakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a packaged circuit structure
- Patent number 11,683,888
- Issue date Jun 20, 2023
- Leading Interconnect Semiconductor Technology Qinhuangdao Co, Ltd.
- Chun-Chieh Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 11,483,923
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,375,611
- Issue date Jun 28, 2022
- Murata Manufacturing Co., Ltd.
- Masaaki Hanao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermoforming an electronic device with surface curvature
- Patent number 11,310,915
- Issue date Apr 19, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Edsger Constant Pieter Smits
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separable modules PCB modules
- Patent number 11,277,906
- Issue date Mar 15, 2022
- SIGNIFY HOLDING B.V.
- Remco Christianus Wilhelmus Leermakers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnection system and method for electrically inter...
- Patent number 11,165,178
- Issue date Nov 2, 2021
- Lear Corporation
- Marc Tena Gil
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Flexible printed circuit board
- Patent number 11,140,785
- Issue date Oct 5, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for producing the printed circuit...
- Patent number 11,134,565
- Issue date Sep 28, 2021
- ENDRESS+HAUSER SE+CO.KG
- Harald Schäuble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed, flexible integrated circuits and methods for making hig...
- Patent number 11,109,486
- Issue date Aug 31, 2021
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device having printed circuit board substrate with built-in...
- Patent number 11,089,688
- Issue date Aug 10, 2021
- TT ELECTRONICS PLC
- Brent Hans Larson
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board with a bent connecting section and method for...
- Patent number 11,067,622
- Issue date Jul 20, 2021
- Vitesco Technologies GmbH
- Detlev Bagung
- G01 - MEASURING TESTING
Information Patent Grant
Printable 3D electronic structure
- Patent number 11,064,609
- Issue date Jul 13, 2021
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board interposer
- Patent number 11,006,524
- Issue date May 11, 2021
- Apple Inc.
- Scott A. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection for printed circuit board assemblies
- Patent number 10,971,880
- Issue date Apr 6, 2021
- Neptune Technology Group Inc.
- Wilson Philip Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing hermetic electrical feedthrough
- Patent number 10,952,332
- Issue date Mar 16, 2021
- Second Sight Medical Products, Inc.
- Jerry Ok
- B32 - LAYERED PRODUCTS
Information Patent Grant
Arrangement to enclose a circuit board
- Patent number 10,933,505
- Issue date Mar 2, 2021
- Atlas Copco Airpower, naamloze vennootschap
- Per-Anders Karlsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,939,547
- Issue date Mar 2, 2021
- Samsung Display Co., Ltd.
- Ah-Ram Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly
- Patent number 10,856,419
- Issue date Dec 1, 2020
- ZF Friedrichshafen AG
- Josef Loibl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel for the purpose of winding a length of cable of optical fiber...
- Patent number 10,845,562
- Issue date Nov 24, 2020
- Sagemcom Broadband SAS
- Stéphane Kohn
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Control unit
- Patent number 10,829,048
- Issue date Nov 10, 2020
- Jaguar Land Rover Limited
- Ashutosh Tomar
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240298407
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES
- Publication number 20240284603
- Publication date Aug 22, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Eitan Ariel Caplan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTU...
- Publication number 20240155929
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- Myung Gil CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER FOLDED 3D ELECTRONICS
- Publication number 20240090126
- Publication date Mar 14, 2024
- U.S. Army DEVCOM, Army Research Laboratory
- Nathan S. Lazarus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW COST PANEL AESA WITH THERMAL MANAGEMENT
- Publication number 20230345616
- Publication date Oct 26, 2023
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...
- Publication number 20230309239
- Publication date Sep 28, 2023
- Canon Kabushiki Kaisha
- Minoru Kambegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230232527
- Publication date Jul 20, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED CIRCUIT STRUCTURE
- Publication number 20230232537
- Publication date Jul 20, 2023
- Leading Interconnect Semiconductor Technology Qinhuangdao Co., Ltd.
- CHUN-CHIEH HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BENDING APPARATUS, DEVICE TO BE BENT AND MACHINING METHOD THEREFOR,...
- Publication number 20230225057
- Publication date Jul 13, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Tianjun DENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...
- Publication number 20230189444
- Publication date Jun 15, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With a Magnetic Element and a Manufacturing Method
- Publication number 20220377896
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan SALKOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220330432
- Publication date Oct 13, 2022
- IBIDEN CO., LTD.
- Hirotaka TANIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220240385
- Publication date Jul 28, 2022
- Qi Ding Technology Qinhuangdao Co., Ltd.
- CHUN-CHIEH HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTU...
- Publication number 20220173364
- Publication date Jun 2, 2022
- SAMSUNG DISPLAY CO., LTD.
- Myung Gil CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARABLE MODULES PCB MODULES
- Publication number 20210385945
- Publication date Dec 9, 2021
- SIGNIFY HOLDING B.V.
- REMCO CHRISTIANUS WILHELMUS LEERMAKERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOFORMING AN ELECTRONIC DEVICE WITH SURFACE CURVATURE
- Publication number 20210368627
- Publication date Nov 25, 2021
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Edsger Constant Pieter SMITS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL INTERCONNECTION SYSTEM AND METHOD FOR ELECTRICALLY INTER...
- Publication number 20210135384
- Publication date May 6, 2021
- LEAR CORPORATION
- Marc TENA GIL
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE...
- Publication number 20210014980
- Publication date Jan 14, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200305289
- Publication date Sep 24, 2020
- PHOENIX & CORPORATION
- Chun-Hsien Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE PROVIDED WITH SUBSTRATE ON WHICH ELECTR...
- Publication number 20200258805
- Publication date Aug 13, 2020
- Denso Corporation
- Tomohiro YOKOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20200185349
- Publication date Jun 11, 2020
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECIPROCAL PCB MANUFACTURING PROCESS
- Publication number 20200120808
- Publication date Apr 16, 2020
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20200113064
- Publication date Apr 9, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS AND METHODS FOR MAKING HIG...
- Publication number 20200084891
- Publication date Mar 12, 2020
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PLURALITY OF PRINTED CIRCUIT BOARDS FROM A SINGL...
- Publication number 20200052450
- Publication date Feb 13, 2020
- Canon Kabushiki Kaisha
- Norikazu Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20190394874
- Publication date Dec 26, 2019
- Murata Manufacturing Co., Ltd.
- Masaaki Hanao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING THE PRINTED CIRCUIT...
- Publication number 20190387618
- Publication date Dec 19, 2019
- Endress+Hauser SE+Co. KG
- Harald Schäuble
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190269011
- Publication date Aug 29, 2019
- SAMSUNG DISPLAY CO., LTD.
- Ah-Ram LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board With A Bent Connecting Section And Method For...
- Publication number 20190235016
- Publication date Aug 1, 2019
- CPT GROUP GMBH
- DETLEV BAGUNG
- G01 - MEASURING TESTING

Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a laminate structure having a plated through-hole...

Wiring circuit board assembly sheet

Reciprocal PCB manufacturing process

Screen-printing screen and process for obtaining glazings equipped...

Laminated component carrier with a thermoplastic structure

Display device manufacturing apparatus with rotator and display dev...

Low cost panel AESA with thermal management

Structure for embedding and packaging multiple devices by layer and...

Semiconductor module and electronic apparatus

Method for manufacturing a packaged circuit structure

Ultra-thin embedded semiconductor device package and method of manu...

Laminated component carrier with a thermoplastic structure

Multilayer substrate

Thermoforming an electronic device with surface curvature

Separable modules PCB modules

Electrical interconnection system and method for electrically inter...

Flexible printed circuit board

Printed circuit board and method for producing the printed circuit...

High-speed, flexible integrated circuits and methods for making hig...

Sensor device having printed circuit board substrate with built-in...

Printed circuit board with a bent connecting section and method for...

Printable 3D electronic structure

Circuit board interposer

Connection for printed circuit board assemblies

Method for providing hermetic electrical feedthrough

Arrangement to enclose a circuit board

Display device and method of manufacturing the same

Printed circuit board assembly

Reel for the purpose of winding a length of cable of optical fiber...

Control unit

Patents Applicationslast 30 patents

CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME

REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES

DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTU...

LASER FOLDED 3D ELECTRONICS

LOW COST PANEL AESA WITH THERMAL MANAGEMENT

MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...

ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE SAME

PACKAGED CIRCUIT STRUCTURE

BENDING APPARATUS, DEVICE TO BE BENT AND MACHINING METHOD THEREFOR,...

STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...

Laminated Component Carrier With a Thermoplastic Structure

Component Carrier With a Magnetic Element and a Manufacturing Method

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

PACKAGED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTU...

SEPARABLE MODULES PCB MODULES

THERMOFORMING AN ELECTRONIC DEVICE WITH SURFACE CURVATURE

ELECTRICAL INTERCONNECTION SYSTEM AND METHOD FOR ELECTRICALLY INTER...

METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE...

FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC COMPONENT MODULE PROVIDED WITH SUBSTRATE ON WHICH ELECTR...

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

RECIPROCAL PCB MANUFACTURING PROCESS

FLEXIBLE PRINTED CIRCUIT BOARD

HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS AND METHODS FOR MAKING HIG...

METHOD OF MAKING A PLURALITY OF PRINTED CIRCUIT BOARDS FROM A SINGL...

MULTILAYER SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING THE PRINTED CIRCUIT...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Printed Circuit Board With A Bent Connecting Section And Method For...