Details of three-dimensional rigid printed circuit boards

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H05K1/0284

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/0284Details of three-dimensional rigid printed circuit boards

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Patents Grantslast 30 patents

Information Patent Grant
Device for temperature measurement
- Patent number 12,171,060
- Issue date Dec 17, 2024
- SMA Solar Technology AG
- Felix Muehlhausen
- G01 - MEASURING TESTING
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 12,156,345
- Issue date Nov 26, 2024
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body and insulating circuit board
- Patent number 12,137,526
- Issue date Nov 5, 2024
- Mitsubishi Materials Corporation
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 12,120,815
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing substrate and manufacturing method thereof and probe card
- Patent number 12,108,543
- Issue date Oct 1, 2024
- Hermes Testing Solutions Inc.
- Chiao-Pei Chen
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,108,530
- Issue date Oct 1, 2024
- Unimicron Technology Corp.
- Kuang-Ching Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mobile terminal and camera assembly
- Patent number 12,101,545
- Issue date Sep 24, 2024
- VIVO MOBILE COMMUNICATION CO., LTD.
- Zhijun Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-printed, PCB composite structures, and formation methods
- Patent number 12,035,465
- Issue date Jul 9, 2024
- Continental Automotive Systems, Inc.
- Stanton F Rak
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 12,028,970
- Issue date Jul 2, 2024
- Kyocera Corporation
- Seiichirou Itou
- G01 - MEASURING TESTING
Information Patent Grant
Method of printed circuit board dielectric molding and electrolytic...
- Patent number 12,004,306
- Issue date Jun 4, 2024
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Work vehicle systems including multilayer wiring panels
- Patent number 11,987,187
- Issue date May 21, 2024
- Deere & Company
- Kunal Gupta
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Angled faceplates for a network element
- Patent number 11,985,454
- Issue date May 14, 2024
- Ciena Corporation
- Simon J. E. Shearman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cavity printed circuit board for three-dimensional IC package
- Patent number 11,963,296
- Issue date Apr 16, 2024
- Google LLC
- Yuan Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint identification apparatus and electronic device
- Patent number 11,917,763
- Issue date Feb 27, 2024
- Shenzhen Goodix Technology Co., Ltd.
- Fanzhou Zeng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display apparatus
- Patent number 11,889,669
- Issue date Jan 30, 2024
- LG Display Co., Ltd.
- Hyo-Jin Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making an interconnect device for electronic circuits
- Patent number 11,881,671
- Issue date Jan 23, 2024
- Eagle Technology, LLC
- Clarke O. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional molded circuit component
- Patent number 11,839,023
- Issue date Dec 5, 2023
- MAXELL, LTD.
- Atsushi Yusa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Connection structure and method of forming the same
- Patent number 11,810,849
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board dielectric molding and electrolytic metalliza...
- Patent number 11,800,640
- Issue date Oct 24, 2023
- Infinitum Electric, Inc.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrical conveyance assembly
- Patent number 11,785,736
- Issue date Oct 10, 2023
- EATON INTELLIGENT POWER LIMITED
- Christopher T. Cantrell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multiple in-mold electronics structure and method of manufacturing...
- Patent number 11,765,819
- Issue date Sep 19, 2023
- INTOPS.CO., LTD.
- Sung-hoon Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mobile terminal and camera assembly
- Patent number 11,743,567
- Issue date Aug 29, 2023
- VIVO MOBILE COMMUNICATION CO., LTD.
- Zhijun Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vehicular sensing device with cooling feature
- Patent number 11,683,911
- Issue date Jun 20, 2023
- Magna Electronics Inc.
- Wilhelm Johann Wolfgang Wöhlte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 11,657,989
- Issue date May 23, 2023
- Harris Corporation
- Louis Joseph Rendek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and manufacturing method thereof
- Patent number 11,647,615
- Issue date May 9, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic or electrical system
- Patent number 11,618,227
- Issue date Apr 4, 2023
- Friedrich-Alexander-Universitat Erlangen-Nurnberg
- Gerald Gold
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device having color resists pattern
- Patent number 11,609,492
- Issue date Mar 21, 2023
- Ming-An Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 11,602,055
- Issue date Mar 7, 2023
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,589,457
- Issue date Feb 21, 2023
- Kyocera Corporation
- Seiichirou Itou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING SPACER HAVING SELF-ALIGNM...
- Publication number 20240407097
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Jaeheung YE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Signal Transmission System
- Publication number 20240397612
- Publication date Nov 28, 2024
- ZTE Corporation
- Xindan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240373552
- Publication date Nov 7, 2024
- Hefei BOE Ruisheng Technology Co., Ltd.
- Jiawei XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING OR MACHINING AND ELECTROLY...
- Publication number 20240334595
- Publication date Oct 3, 2024
- INFINITUM ELECTRIC INC.
- Edward C. CARIGNAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND ELECTROLYTI...
- Publication number 20240334594
- Publication date Oct 3, 2024
- INFINITUM ELECTRIC, INC.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20240292518
- Publication date Aug 29, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240284605
- Publication date Aug 22, 2024
- Samsung Electro-Mechanics Co., Ltd.
- SANGHO JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME
- Publication number 20240224436
- Publication date Jul 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR STAIRCASE ANTENNAS
- Publication number 20240170847
- Publication date May 23, 2024
- Analog Devices International Unlimited Company
- Islam A. Eshrah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY FOR AN AIRCRAFT SOLID STATE POWER CO...
- Publication number 20240164025
- Publication date May 16, 2024
- HS Elektronik Systeme GmbH
- Josef MAIER
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
3D GLASS MODULES
- Publication number 20240114617
- Publication date Apr 4, 2024
- ELECTRONIC DESIGN & DEVELOPMENT, CORP.
- Sergio E. Cardona
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME
- Publication number 20240090137
- Publication date Mar 14, 2024
- SKC CO., LTD.
- Il Hwan YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR USE WITH AN EXTERIOR LIGHTING DEVICE OF A...
- Publication number 20240064894
- Publication date Feb 22, 2024
- HELLA GmbH & Co. KGaA
- Martin KAPPELHOFF
- B60 - VEHICLES IN GENERAL
Information Patent Application
IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD OF MANUFACTURING IMAGE PIC...
- Publication number 20240040224
- Publication date Feb 1, 2024
- OLYMPUS MEDICAL SYSTEMS CORP.
- Junya YAMADA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE
- Publication number 20240032190
- Publication date Jan 25, 2024
- Canon Kabushiki Kaisha
- KOICHI ODAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mobile Terminal And Camera Assembly
- Publication number 20240022805
- Publication date Jan 18, 2024
- VIVO MOBILE COMMUNICATION CO., LTD.
- Zhijun HUANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20230413421
- Publication date Dec 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20230328883
- Publication date Oct 12, 2023
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20230328884
- Publication date Oct 12, 2023
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT
- Publication number 20230300975
- Publication date Sep 21, 2023
- Intel Corporation
- Jan Proschwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20230238197
- Publication date Jul 27, 2023
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING SUBSTRATE AND MANUFACTURING METHOD THEREOF AND PROBE CARD
- Publication number 20230217600
- Publication date Jul 6, 2023
- HERMES TESTING SOLUTIONS INC.
- Chiao-Pei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS
- Publication number 20230209723
- Publication date Jun 29, 2023
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND...
- Publication number 20230209706
- Publication date Jun 29, 2023
- Industrial Technology Research Institute
- Min-Chieh Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cavity Printed Circuit Board for Three-Dimensional IC Package
- Publication number 20230114118
- Publication date Apr 13, 2023
- Google LLC
- Yuan Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-PRINTED, PCB COMPOSITE STRUCTURES, AND FORMATION METHODS
- Publication number 20230094289
- Publication date Mar 30, 2023
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Stanton F Rak
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Angled Faceplates for a network element
- Publication number 20230088207
- Publication date Mar 23, 2023
- CIENA CORPORATION
- Simon J. E. Shearman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC MODULE, MANUFACTURING METHOD FOR ELECTRONIC MODULE, AND...
- Publication number 20230080558
- Publication date Mar 16, 2023
- OLYMPUS CORPORATION
- Shigeru HOSOKAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR TEMPERATURE MEASUREMENT
- Publication number 20230021547
- Publication date Jan 26, 2023
- SMA Solar Technology AG
- Felix Muehlhausen
- G01 - MEASURING TESTING

Details of three-dimensional rigid printed circuit boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device for temperature measurement

Overmolded components having sub-flush residuals

Bonded body and insulating circuit board

Multilayer substrate

Testing substrate and manufacturing method thereof and probe card

Circuit board structure and manufacturing method thereof

Mobile terminal and camera assembly

Laminated component carrier with a thermoplastic structure

3D-printed, PCB composite structures, and formation methods

Wiring board, electronic device, and electronic module

Method of printed circuit board dielectric molding and electrolytic...

Work vehicle systems including multilayer wiring panels

Angled faceplates for a network element

Cavity printed circuit board for three-dimensional IC package

Fingerprint identification apparatus and electronic device

Display apparatus

Method for making an interconnect device for electronic circuits

Three-dimensional molded circuit component

Connection structure and method of forming the same

Printed circuit board dielectric molding and electrolytic metalliza...

Electrical conveyance assembly

Multiple in-mold electronics structure and method of manufacturing...

Mobile terminal and camera assembly

Vehicular sensing device with cooling feature

Method for making a three-dimensional liquid crystal polymer multil...

Electronic device package and manufacturing method thereof

Method for manufacturing an electronic or electrical system

Device having color resists pattern

Overmolded components having sub-flush residuals

Wiring substrate

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING SPACER HAVING SELF-ALIGNM...

Printed Circuit Board and Signal Transmission System

WIRING SUBSTRATE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING OR MACHINING AND ELECTROLY...

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND ELECTROLYTI...

Component Carrier For Waveguide Applications

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME

APPARATUS AND METHODS FOR STAIRCASE ANTENNAS

PRINTED CIRCUIT BOARD ASSEMBLY FOR AN AIRCRAFT SOLID STATE POWER CO...

3D GLASS MODULES

SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME

PRINTED CIRCUIT BOARD FOR USE WITH AN EXTERIOR LIGHTING DEVICE OF A...

IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD OF MANUFACTURING IMAGE PIC...

BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE

Mobile Terminal And Camera Assembly

Component Carrier For Waveguide Applications

MULTILAYER SUBSTRATE

MULTILAYER SUBSTRATE

INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

TESTING SUBSTRATE AND MANUFACTURING METHOD THEREOF AND PROBE CARD

OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS

THREE-DIMENSIONAL CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND...

Cavity Printed Circuit Board for Three-Dimensional IC Package

3D-PRINTED, PCB COMPOSITE STRUCTURES, AND FORMATION METHODS

Angled Faceplates for a network element

ELECTRONIC MODULE, MANUFACTURING METHOD FOR ELECTRONIC MODULE, AND...

Laminated Component Carrier With a Thermoplastic Structure

DEVICE FOR TEMPERATURE MEASUREMENT