Details of three-dimensional rigid printed circuit boards

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CPC
H05K1/0284

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0284Details of three-dimensional rigid printed circuit boards

Industries

Patents Grantslast 30 patents

Information Patent Grant
Work vehicle systems including multilayer wiring panels
- Patent number 11,987,187
- Issue date May 21, 2024
- Deere & Company
- Kunal Gupta
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Angled faceplates for a network element
- Patent number 11,985,454
- Issue date May 14, 2024
- Ciena Corporation
- Simon J. E. Shearman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cavity printed circuit board for three-dimensional IC package
- Patent number 11,963,296
- Issue date Apr 16, 2024
- Google LLC
- Yuan Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint identification apparatus and electronic device
- Patent number 11,917,763
- Issue date Feb 27, 2024
- Shenzhen Goodix Technology Co., Ltd.
- Fanzhou Zeng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display apparatus
- Patent number 11,889,669
- Issue date Jan 30, 2024
- LG Display Co., Ltd.
- Hyo-Jin Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making an interconnect device for electronic circuits
- Patent number 11,881,671
- Issue date Jan 23, 2024
- Eagle Technology, LLC
- Clarke O. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional molded circuit component
- Patent number 11,839,023
- Issue date Dec 5, 2023
- MAXELL, LTD.
- Atsushi Yusa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Connection structure and method of forming the same
- Patent number 11,810,849
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board dielectric molding and electrolytic metalliza...
- Patent number 11,800,640
- Issue date Oct 24, 2023
- Infinitum Electric, Inc.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrical conveyance assembly
- Patent number 11,785,736
- Issue date Oct 10, 2023
- EATON INTELLIGENT POWER LIMITED
- Christopher T. Cantrell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multiple in-mold electronics structure and method of manufacturing...
- Patent number 11,765,819
- Issue date Sep 19, 2023
- INTOPS.CO., LTD.
- Sung-hoon Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mobile terminal and camera assembly
- Patent number 11,743,567
- Issue date Aug 29, 2023
- VIVO MOBILE COMMUNICATION CO., LTD.
- Zhijun Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vehicular sensing device with cooling feature
- Patent number 11,683,911
- Issue date Jun 20, 2023
- Magna Electronics Inc.
- Wilhelm Johann Wolfgang Wöhlte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 11,657,989
- Issue date May 23, 2023
- Harris Corporation
- Louis Joseph Rendek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and manufacturing method thereof
- Patent number 11,647,615
- Issue date May 9, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic or electrical system
- Patent number 11,618,227
- Issue date Apr 4, 2023
- Friedrich-Alexander-Universitat Erlangen-Nurnberg
- Gerald Gold
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device having color resists pattern
- Patent number 11,609,492
- Issue date Mar 21, 2023
- Ming-An Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 11,602,055
- Issue date Mar 7, 2023
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,589,457
- Issue date Feb 21, 2023
- Kyocera Corporation
- Seiichirou Itou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing curved-surface metal line
- Patent number 11,564,319
- Issue date Jan 24, 2023
- Lotes Co., Ltd.
- Zuo Feng Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,558,958
- Issue date Jan 17, 2023
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional light emitting appliance
- Patent number 11,553,597
- Issue date Jan 10, 2023
- Lumileds LLC
- Barbara Muelders
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Angled faceplates for a network element
- Patent number 11,516,558
- Issue date Nov 29, 2022
- Ciena Corporation
- Simon J. E. Shearman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing an electromechanical structure and an arra...
- Patent number 11,516,920
- Issue date Nov 29, 2022
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed stacked micro-devices
- Patent number 11,490,519
- Issue date Nov 1, 2022
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 11,483,923
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled faceplates for a network element
- Patent number 11,477,544
- Issue date Oct 18, 2022
- Ciena Corporation
- Simon J. E. Shearman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,445,606
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and method of forming the same
- Patent number 11,437,310
- Issue date Sep 6, 2022
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufactured reactive beamformer
- Patent number 11,432,408
- Issue date Aug 30, 2022
- Raytheon Company
- Thomas V. Sikina
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY FOR AN AIRCRAFT SOLID STATE POWER CO...
- Publication number 20240164025
- Publication date May 16, 2024
- HS Elektronik Systeme GmbH
- Josef MAIER
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
3D GLASS MODULES
- Publication number 20240114617
- Publication date Apr 4, 2024
- ELECTRONIC DESIGN & DEVELOPMENT, CORP.
- Sergio E. Cardona
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME
- Publication number 20240090137
- Publication date Mar 14, 2024
- SKC CO., LTD.
- Il Hwan YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR USE WITH AN EXTERIOR LIGHTING DEVICE OF A...
- Publication number 20240064894
- Publication date Feb 22, 2024
- HELLA GmbH & Co. KGaA
- Martin KAPPELHOFF
- B60 - VEHICLES IN GENERAL
Information Patent Application
IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD OF MANUFACTURING IMAGE PIC...
- Publication number 20240040224
- Publication date Feb 1, 2024
- OLYMPUS MEDICAL SYSTEMS CORP.
- Junya YAMADA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE
- Publication number 20240032190
- Publication date Jan 25, 2024
- Canon Kabushiki Kaisha
- KOICHI ODAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mobile Terminal And Camera Assembly
- Publication number 20240022805
- Publication date Jan 18, 2024
- VIVO MOBILE COMMUNICATION CO., LTD.
- Zhijun HUANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20230413421
- Publication date Dec 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20230328883
- Publication date Oct 12, 2023
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20230328884
- Publication date Oct 12, 2023
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT
- Publication number 20230300975
- Publication date Sep 21, 2023
- Intel Corporation
- Jan Proschwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20230238197
- Publication date Jul 27, 2023
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING SUBSTRATE AND MANUFACTURING METHOD THEREOF AND PROBE CARD
- Publication number 20230217600
- Publication date Jul 6, 2023
- HERMES TESTING SOLUTIONS INC.
- Chiao-Pei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS
- Publication number 20230209723
- Publication date Jun 29, 2023
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND...
- Publication number 20230209706
- Publication date Jun 29, 2023
- Industrial Technology Research Institute
- Min-Chieh Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cavity Printed Circuit Board for Three-Dimensional IC Package
- Publication number 20230114118
- Publication date Apr 13, 2023
- Google LLC
- Yuan Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-PRINTED, PCB COMPOSITE STRUCTURES, AND FORMATION METHODS
- Publication number 20230094289
- Publication date Mar 30, 2023
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Stanton F Rak
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Angled Faceplates for a network element
- Publication number 20230088207
- Publication date Mar 23, 2023
- CIENA CORPORATION
- Simon J. E. Shearman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC MODULE, MANUFACTURING METHOD FOR ELECTRONIC MODULE, AND...
- Publication number 20230080558
- Publication date Mar 16, 2023
- OLYMPUS CORPORATION
- Shigeru HOSOKAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR TEMPERATURE MEASUREMENT
- Publication number 20230021547
- Publication date Jan 26, 2023
- SMA Solar Technology AG
- Felix Muehlhausen
- G01 - MEASURING TESTING
Information Patent Application
MULTIPLE IN-MOLD ELECTRONICS STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20230020151
- Publication date Jan 19, 2023
- INTOPS CO., LTD.
- sung-hoon Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED STACKED MICRO-DEVICES
- Publication number 20230017617
- Publication date Jan 19, 2023
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE, METHOD OF MANUFACTURING ELECTRONIC MODULE, AND E...
- Publication number 20230007769
- Publication date Jan 5, 2023
- OLYMPUS CORPORATION
- Junya YAMADA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220377886
- Publication date Nov 24, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE
- Publication number 20220322518
- Publication date Oct 6, 2022
- Japan Aviation Electronics Industry, Limited
- Shinji UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTILAYER LAMINATE
- Publication number 20220287186
- Publication date Sep 8, 2022
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Jeroen VAN DEN BRAND
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A MOLDED INTERCONNECT DEVICE
- Publication number 20220279656
- Publication date Sep 1, 2022
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED STACKED MICRO-DEVICES
- Publication number 20220225508
- Publication date Jul 14, 2022
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Having at Least a Part Formed as a Three-Dimensio...
- Publication number 20220190464
- Publication date Jun 16, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS

Details of three-dimensional rigid printed circuit boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Work vehicle systems including multilayer wiring panels

Angled faceplates for a network element

Cavity printed circuit board for three-dimensional IC package

Fingerprint identification apparatus and electronic device

Display apparatus

Method for making an interconnect device for electronic circuits

Three-dimensional molded circuit component

Connection structure and method of forming the same

Printed circuit board dielectric molding and electrolytic metalliza...

Electrical conveyance assembly

Multiple in-mold electronics structure and method of manufacturing...

Mobile terminal and camera assembly

Vehicular sensing device with cooling feature

Method for making a three-dimensional liquid crystal polymer multil...

Electronic device package and manufacturing method thereof

Method for manufacturing an electronic or electrical system

Device having color resists pattern

Overmolded components having sub-flush residuals

Wiring substrate

Method of manufacturing curved-surface metal line

Laminated body and method for manufacturing the same

Three-dimensional light emitting appliance

Angled faceplates for a network element

Method for manufacturing an electromechanical structure and an arra...

Printed stacked micro-devices

Laminated component carrier with a thermoplastic structure

Angled faceplates for a network element

Laminated body and method for manufacturing the same

Connection structure and method of forming the same

Additive manufactured reactive beamformer

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD ASSEMBLY FOR AN AIRCRAFT SOLID STATE POWER CO...

3D GLASS MODULES

SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME

PRINTED CIRCUIT BOARD FOR USE WITH AN EXTERIOR LIGHTING DEVICE OF A...

IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD OF MANUFACTURING IMAGE PIC...

BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE

Mobile Terminal And Camera Assembly

Component Carrier For Waveguide Applications

MULTILAYER SUBSTRATE

MULTILAYER SUBSTRATE

INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

TESTING SUBSTRATE AND MANUFACTURING METHOD THEREOF AND PROBE CARD

OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS

THREE-DIMENSIONAL CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND...

Cavity Printed Circuit Board for Three-Dimensional IC Package

3D-PRINTED, PCB COMPOSITE STRUCTURES, AND FORMATION METHODS

Angled Faceplates for a network element

ELECTRONIC MODULE, MANUFACTURING METHOD FOR ELECTRONIC MODULE, AND...

Laminated Component Carrier With a Thermoplastic Structure

DEVICE FOR TEMPERATURE MEASUREMENT

MULTIPLE IN-MOLD ELECTRONICS STRUCTURE AND METHOD OF MANUFACTURING...

PRINTED STACKED MICRO-DEVICES

ELECTRONIC MODULE, METHOD OF MANUFACTURING ELECTRONIC MODULE, AND E...

LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME

DEVICE

ELECTRONIC DEVICE WITH MULTILAYER LAMINATE

METHOD OF MAKING A MOLDED INTERCONNECT DEVICE

PRINTED STACKED MICRO-DEVICES

Component Carrier Having at Least a Part Formed as a Three-Dimensio...