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H05K1/02

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/02Details

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Patents Grantslast 30 patents

Information Patent Grant
PCB having edge antenna, and battery including PCB having edge antenna
- Patent number 12,170,414
- Issue date Dec 17, 2024
- LG ENERGY SOLUTION, LTD.
- Changjoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board (PCB) module comprising an embedded radio-fre...
- Patent number 12,171,058
- Issue date Dec 17, 2024
- GN HEARING A/S
- Maja Amskov Gravad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency circuit and communication module
- Patent number 12,171,059
- Issue date Dec 17, 2024
- Mitsubishi Electric Corporation
- Nobuo Ohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated copper foil and copper clad laminate
- Patent number 12,168,834
- Issue date Dec 17, 2024
- Chang Chun Petrochemical Co., Ltd.
- Jian-Ming Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic assembly and method for thermal balancing of surfacemoun...
- Patent number 12,171,056
- Issue date Dec 17, 2024
- MELLANOX TECHNOLOGIES LTD.
- Igor Loiferman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical leak detection of liquid cooling components within an elect...
- Patent number 12,169,180
- Issue date Dec 17, 2024
- Intel Corporation
- Prabhakar Subrahmanyam
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device including flexible printed circuit board
- Patent number 12,171,077
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus with inspection terminals
- Patent number 12,171,061
- Issue date Dec 17, 2024
- Seiko Epson Corporation
- Kyosuke Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting strip
- Patent number 12,169,059
- Issue date Dec 17, 2024
- SIGNIFY HOLDING, B.V.
- Andrew Christanto
- F21 - LIGHTING
Information Patent Grant
Manufacturing method for pcb with thermal conductor embedded therei...
- Patent number 12,171,057
- Issue date Dec 17, 2024
- SHENGYI ELECTRONICS CO., LTD.
- Lu Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for temperature measurement
- Patent number 12,171,060
- Issue date Dec 17, 2024
- SMA Solar Technology AG
- Felix Muehlhausen
- G01 - MEASURING TESTING
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 12,165,950
- Issue date Dec 10, 2024
- Vitesco Technologies GmbH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number RE50236
- Issue date Dec 10, 2024
- Kioxia Corporation
- Naoya Kamimura
Information Patent Grant
Electromagnetic interference shielding enclosure with thermal condu...
- Patent number 12,167,530
- Issue date Dec 10, 2024
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board having waterproof structure and fold...
- Patent number 12,167,531
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation structures and printed circuit board including the same
- Patent number 12,167,532
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hyejin Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible circuit film and display apparatus having the same
- Patent number 12,167,538
- Issue date Dec 10, 2024
- Samsung Display Co., Ltd.
- Jun Ho Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, devices, and methods for robotic end effectors
- Patent number 12,162,138
- Issue date Dec 10, 2024
- Sanctuary Cognitive Systems Corporation
- Connor Richard Shannon
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Stepped electronic substrate for integrated circuit packages
- Patent number 12,165,983
- Issue date Dec 10, 2024
- Intel Corporation
- Eleanor Patricia Paras Rabadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,167,536
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 12,167,545
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for high-speed data transmission across an elec...
- Patent number 12,161,290
- Issue date Dec 10, 2024
- Intuitive Surgical Operations, Inc.
- Derek C. Liou
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Display panel, jig, and method of manufacturing display panel with...
- Patent number 12,167,620
- Issue date Dec 10, 2024
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Shuquan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and display device
- Patent number 12,167,632
- Issue date Dec 10, 2024
- LG Display Co., Ltd.
- Jongseok Cha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat removal architecture for stack-type component carrier with emb...
- Patent number 12,167,529
- Issue date Dec 10, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,167,535
- Issue date Dec 10, 2024
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mask arrangement for a component carrier
- Patent number 12,167,543
- Issue date Dec 10, 2024
- AT&S(Chongqing) Company Limited
- Ismadi Bin Ismail
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Phase change material (PCM) heatsinks
- Patent number 12,163,740
- Issue date Dec 10, 2024
- Simmonds Precision Products, Inc.
- Jason Graham
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Radio frequency antennas and waveguides for communication between i...
- Patent number 12,165,994
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Producing a PCB, as well as a PCB, and a Circuit Board
- Publication number 20240422894
- Publication date Dec 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Potential-separating optical signal transmitting device
- Publication number 20240422897
- Publication date Dec 19, 2024
- Knick Elektronische Messgeräte GmbH & Co. KG
- Lars SCHWEIZER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DYNAMICALLY RECONFIGURABLE MAGNETIC CIRCUIT SYSTEMS WITH TUNABLE CO...
- Publication number 20240422898
- Publication date Dec 19, 2024
- Albert Moses Haim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
- Publication number 20240422899
- Publication date Dec 19, 2024
- Intel Corporation
- Srinivas B REDDY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240422900
- Publication date Dec 19, 2024
- KYOCERA CORPORATION
- Noriyuki SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Continuously Extending Vertical Connection S...
- Publication number 20240422907
- Publication date Dec 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus LEITGEB
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20240418943
- Publication date Dec 19, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240419272
- Publication date Dec 19, 2024
- InnoLux Corporation
- Yuan-Lin WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER TOOLS WITH HIGH-EMISSIVITY HEAT SINKS
- Publication number 20240416497
- Publication date Dec 19, 2024
- Milwaukee Electric Tool Corporation
- Steven LCB Hartig
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
DISPLAY MODULE AND DISPLAY DEVICE
- Publication number 20240423017
- Publication date Dec 19, 2024
- LG Display Co., Ltd.
- Jongseok Cha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422901
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422908
- Publication date Dec 19, 2024
- LG Innotek Co., Ltd.
- Kyo Hun KOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INKJET PRINTING DEDICATED TEST PINS
- Publication number 20240421105
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING PRINTED...
- Publication number 20240422891
- Publication date Dec 19, 2024
- Samsung SDI Co., Ltd.
- Woojin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADERS FEATURING COEFFICIENT OF THERMAL EXPANSION MATCHING...
- Publication number 20240422892
- Publication date Dec 19, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES
- Publication number 20240422895
- Publication date Dec 19, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROTATING COMPACT LIGHT RANGING SYSTEM
- Publication number 20240418833
- Publication date Dec 19, 2024
- Ouster, Inc.
- Angus PACALA
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC SYSTEM ASSEMBLY
- Publication number 20240422893
- Publication date Dec 19, 2024
- EPIRUS, INC.
- Shawn Warren Merritt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC SHEET, SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD...
- Publication number 20240422902
- Publication date Dec 19, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo KAIMORI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTROCONDUCTIVE COMPOSITION
- Publication number 20240417602
- Publication date Dec 19, 2024
- Toyobo Co., Ltd.
- Naomi TAKIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20240421471
- Publication date Dec 19, 2024
- DAI NIPPON PRINTING CO., LTD.
- Koichi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- Publication number 20240421104
- Publication date Dec 19, 2024
- SAUDI ARABIANOIL COMPANY
- Dong Kyu Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT HARVESTING IN DATA STORAGE DEVICES
- Publication number 20240422938
- Publication date Dec 19, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD
- Publication number 20240422954
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Bongkyu MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240414835
- Publication date Dec 12, 2024
- Omron Corporation
- Junya MISHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS
- Publication number 20240414837
- Publication date Dec 12, 2024
- Bitmain Technologies Inc.
- Shitao TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
- Publication number 20240414841
- Publication date Dec 12, 2024
- MITSUBISHI MATERIALS CORPORATION
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240412918
- Publication date Dec 12, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Hao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

PCB having edge antenna, and battery including PCB having edge antenna

Printed circuit board (PCB) module comprising an embedded radio-fre...

High-frequency circuit and communication module

Surface-treated copper foil and copper clad laminate

Electronic assembly and method for thermal balancing of surfacemoun...

Optical leak detection of liquid cooling components within an elect...

Electronic device including flexible printed circuit board

Semiconductor apparatus with inspection terminals

Lighting strip

Manufacturing method for pcb with thermal conductor embedded therei...

Device for temperature measurement

Power semiconductor component and method for producing a power semi...

Electronic device

Electromagnetic interference shielding enclosure with thermal condu...

Flexible printed circuit board having waterproof structure and fold...

Insulation structures and printed circuit board including the same

Flexible circuit film and display apparatus having the same

Systems, devices, and methods for robotic end effectors

Stepped electronic substrate for integrated circuit packages

Electronic device

Wiring circuit board, producing method thereof, and wiring circuit...

Multilayer substrate

Systems and methods for high-speed data transmission across an elec...

Display panel, jig, and method of manufacturing display panel with...

Display module and display device

Heat removal architecture for stack-type component carrier with emb...

Wiring substrate

Solder mask arrangement for a component carrier

Phase change material (PCM) heatsinks

Radio frequency antennas and waveguides for communication between i...

Patents Applicationslast 30 patents

Method of Producing a PCB, as well as a PCB, and a Circuit Board

Potential-separating optical signal transmitting device

DYNAMICALLY RECONFIGURABLE MAGNETIC CIRCUIT SYSTEMS WITH TUNABLE CO...

ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD

WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME

Component Carrier With Continuously Extending Vertical Connection S...

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

ELECTRONIC DEVICE

POWER TOOLS WITH HIGH-EMISSIVITY HEAT SINKS

DISPLAY MODULE AND DISPLAY DEVICE

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

INKJET PRINTING DEDICATED TEST PINS

PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING PRINTED...

HEAT SPREADERS FEATURING COEFFICIENT OF THERMAL EXPANSION MATCHING...

STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES

Circuit board

ROTATING COMPACT LIGHT RANGING SYSTEM

ELECTRONIC SYSTEM ASSEMBLY

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

DIELECTRIC SHEET, SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD...

ELECTROCONDUCTIVE COMPOSITION

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS

HEAT HARVESTING IN DATA STORAGE DEVICES

ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS

COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

COIL STRUCTURE AND ELECTRONIC DEVICE