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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    POWER ELECTRONIC SYSTEM WITH CONDUCTOR HAVING DAMPING FUNCTION
    • Publication number 20250239378
    • Publication date Jul 24, 2025
    • Delta Electronics, Inc.
    • Boyi Zhang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Thermal Management Enhancement of Electronic Components
    • Publication number 20250240867
    • Publication date Jul 24, 2025
    • Wolfspeed, Inc.
    • Kenneth P. Brewer
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER DELIVERY SYSTEM FOR HIGH DENSITY SIGNALING AND HIGH POWER DEL...
    • Publication number 20250240870
    • Publication date Jul 24, 2025
    • Cisco Technology, Inc.
    • Wenbin Ma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250240876
    • Publication date Jul 24, 2025
    • KYOCERA CORPORATION
    • Daichi SHIMIZU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER MODULE
    • Publication number 20250240891
    • Publication date Jul 24, 2025
    • Hyundai Motor Company
    • Nam Sik Kong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-LAYER FAN BASE
    • Publication number 20250240912
    • Publication date Jul 24, 2025
    • Apple Inc.
    • Anthony J. AIELLO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Printed circuit board assembly
    • Publication number 20250240868
    • Publication date Jul 24, 2025
    • COOLER MASTER TECHNOLOGY INC.
    • Yi-Cheng Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMIN...
    • Publication number 20250240871
    • Publication date Jul 24, 2025
    • STMicroelectronics International N.V.
    • Deborah COGONI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-LAMINATION STRUCTURE THAT ELIMINATES MICRO CAVITY RESONANCE
    • Publication number 20250240873
    • Publication date Jul 24, 2025
    • Cisco Technology, Inc.
    • Wenbin Ma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
    • Publication number 20250240874
    • Publication date Jul 24, 2025
    • Murata Manufacturing Co., Ltd.
    • Ryutatsu MIZUKAMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20250240880
    • Publication date Jul 24, 2025
    • LG Display Co., Ltd.
    • Binn KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LAYOUT SOLUTION FOR DATA TRANSMISSION TRACE, MAINBOARD, AND ELECTRO...
    • Publication number 20250240883
    • Publication date Jul 24, 2025
    • Huawei Technologies Co., Ltd
    • Longxiao XU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC APPARATUS
    • Publication number 20250240888
    • Publication date Jul 24, 2025
    • SAMSUNG DISPLAY CO., LTD.
    • JAEJIN OH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wireless Connector System
    • Publication number 20250239769
    • Publication date Jul 24, 2025
    • NUCURRENT, INC.
    • Vinit Singh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INFORMATION PROCESSING DEVICE
    • Publication number 20250240053
    • Publication date Jul 24, 2025
    • NIDEC INSTRUMENTS CORPORATION
    • Shinya MIYAZAWA
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    DROPLET ACTUATOR FABRICATION APPARATUS, SYSTEMS, AND RELATED METHODS
    • Publication number 20250235864
    • Publication date Jul 24, 2025
    • Abbott Laboratories
    • Andrew Fischer
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20250240882
    • Publication date Jul 24, 2025
    • Nitto Denko Corporation
    • Ikuya HASHIMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250240866
    • Publication date Jul 24, 2025
    • Sony Interactive Entertainment Inc.
    • Takayuki HACHIYA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250240869
    • Publication date Jul 24, 2025
    • Murata Manufacturing Co., Ltd.
    • Akihito NAITO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING A FLUID-FILLABLE...
    • Publication number 20250240879
    • Publication date Jul 24, 2025
    • Liquid Wire Inc.
    • Jorge E. Carbo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND DISPLAY APPARATUS
    • Publication number 20250240872
    • Publication date Jul 24, 2025
    • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Shuang LEI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LENS MODULE AND TERMINAL DEVICE
    • Publication number 20250240875
    • Publication date Jul 24, 2025
    • Rayprus Technology (Foshan) Co., Ltd.
    • Jia-Qi Wu
    • G02 - OPTICS
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20250240877
    • Publication date Jul 24, 2025
    • Nitto Denko Corporation
    • Takashi YAMAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Liquid Cooling Using PCB Through Holes
    • Publication number 20250240878
    • Publication date Jul 24, 2025
    • Jordan K. Hu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND IMAGE FORMING APPARATUS
    • Publication number 20250240881
    • Publication date Jul 24, 2025
    • Canon Kabushiki Kaisha
    • TAKESHI HONDA
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    INTEGRATED CIRCUIT WITH CONSTRAINED METAL LINE ARRANGEMENT AND METH...
    • Publication number 20250238591
    • Publication date Jul 24, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • XinYong WANG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN
    • Publication number 20250239911
    • Publication date Jul 24, 2025
    • Milwaukee Electric Tool Corporation
    • Matthew J. Mergener
    • B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
  • Information Patent Application

    MODULE-LEVEL THERMAL MANAGEMENT MECHANISM
    • Publication number 20250234452
    • Publication date Jul 17, 2025
    • Micron Technology, Inc.
    • Mark A. Tverdy
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITE MEMBER
    • Publication number 20250234453
    • Publication date Jul 17, 2025
    • Hitachi, Ltd
    • Daigo KOMESU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC C...
    • Publication number 20250234455
    • Publication date Jul 17, 2025
    • TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    • MING-HSUN LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR