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H05K1/02

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/02Details

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Patents Grantslast 30 patents

Information Patent Grant
Camera for a motor vehicle with a housing and an electrically condu...
- Patent number 12,206,973
- Issue date Jan 21, 2025
- Eanna Connolly
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for flex circuit connections in touch screens
- Patent number 12,204,717
- Issue date Jan 21, 2025
- Apple Inc.
- Meng-Tse Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,205,935
- Issue date Jan 21, 2025
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hatching ground under a pad in a printed circuit board
- Patent number 12,207,391
- Issue date Jan 21, 2025
- Dell Products L.P.
- Zhenli Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,207,404
- Issue date Jan 21, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overlap joint flex circuit board interconnection
- Patent number 12,207,407
- Issue date Jan 21, 2025
- Google LLC
- John Martinis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for an electronic device
- Patent number 12,207,444
- Issue date Jan 21, 2025
- Harman International Industries, Incorporated
- David Jia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial isolator
- Patent number 12,206,151
- Issue date Jan 21, 2025
- EZconn Corporation
- Ming-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket connector assembly having a heat sink and a retention member...
- Patent number 12,207,389
- Issue date Jan 21, 2025
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Fu-Jin Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component comprising first and second conductive traces...
- Patent number 12,207,392
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Matthew Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable circuit board
- Patent number 12,207,397
- Issue date Jan 21, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Fukao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for transmitting electrical energy and for si...
- Patent number 12,207,402
- Issue date Jan 21, 2025
- Airbus Defence and Space GmbH
- Stephan Friedl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fastening system for coupling a computing module to a printed circu...
- Patent number 12,207,388
- Issue date Jan 21, 2025
- Dell Products L.P.
- Tung-Yi Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,207,390
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 12,207,393
- Issue date Jan 21, 2025
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, antenna package and display device
- Patent number 12,207,394
- Issue date Jan 21, 2025
- Dongwoo Fine-Chem Co., Ltd.
- Byung Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Droplet actuator fabrication apparatus, systems, and related methods
- Patent number 12,201,980
- Issue date Jan 21, 2025
- Abbott Laboratories
- Andrew Fischer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board configured for waveguide coupling a diplexer...
- Patent number 12,206,150
- Issue date Jan 21, 2025
- Vubiq Networks, Inc.
- Michael Gregory Pettus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device carrier structures including polymer layers as ba...
- Patent number 12,207,398
- Issue date Jan 21, 2025
- Georgia Tech Research Corporation
- Omkar Gupte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,207,395
- Issue date Jan 21, 2025
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly with reduced height and reduced width, camer...
- Patent number 12,207,396
- Issue date Jan 21, 2025
- Rayprus Technology (Foshan) Co., Ltd.
- Han-Ru Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedded smart module
- Patent number 12,207,401
- Issue date Jan 21, 2025
- National Taipel University of Technology
- Syang-Peng Rwei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing display panel using inkjet device
- Patent number 12,207,418
- Issue date Jan 21, 2025
- UNIJET CO., LTD.
- Gil Hwan Yeo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Managing unwanted heat, mechanical stresses and EMI in electrical c...
- Patent number 12,207,430
- Issue date Jan 21, 2025
- Samtec, Inc.
- Burrell G. Best
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having both chassis and module dual-flow connec...
- Patent number 12,200,854
- Issue date Jan 14, 2025
- Eagle Technology, LLC
- Voi Nguyen
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Radio frequency front-end structures
- Patent number 12,200,855
- Issue date Jan 14, 2025
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board
- Patent number 12,200,859
- Issue date Jan 14, 2025
- TOPPAN INC.
- Jun Onohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and wire arrangement method thereof
- Patent number 12,200,863
- Issue date Jan 14, 2025
- CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD.
- Jing Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION
- Publication number 20250021145
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Joseph L. Turmes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Metal integrated suspended line (MISL) circuits
- Publication number 20250024585
- Publication date Jan 16, 2025
- TIANJIN UNIVERSITY
- Kaixue Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED MICROSTRIP TRACE
- Publication number 20250024586
- Publication date Jan 16, 2025
- Dell Products L.P.
- Sandor FARKAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20250024608
- Publication date Jan 16, 2025
- Innolux Corporation
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY AND INSULATING CIRCUIT BOARD
- Publication number 20250024610
- Publication date Jan 16, 2025
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE
- Publication number 20250018798
- Publication date Jan 16, 2025
- CPS Technology Holdings LLC
- Matthew R. TYLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
ANTENNA MODULE AND PORTABLE ELECTRIC DEVICE USING THE SAME
- Publication number 20250023223
- Publication date Jan 16, 2025
- QuantumZ Inc.
- Kun Yen TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CABLE DEVICE AND METHOD OF PRODUCING THE SAME
- Publication number 20250024588
- Publication date Jan 16, 2025
- Yamaichi Electronics Co., Ltd.
- Takahiro SHIMOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS
- Publication number 20250024590
- Publication date Jan 16, 2025
- Smith & Nephew PLC
- Ben Alan Askem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SUBSTRATE AND BUS BAR MODULE
- Publication number 20250024594
- Publication date Jan 16, 2025
- YAZAKI CORPORATION
- Hidehiko SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD
- Publication number 20250024596
- Publication date Jan 16, 2025
- Sumitomo Electric Industries, Ltd.
- Ryo IRIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE COMPOSITION, ADHESIVE SHEET, ELECTROMAGNETIC WAVE SHIELD F...
- Publication number 20250019572
- Publication date Jan 16, 2025
- TOYOBO MC Corporation
- Ryo SONODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC SUBASSEMBLY WITH IMPROVED MOUNTING OF A HEAT SINK
- Publication number 20250024583
- Publication date Jan 16, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Peter Sturm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE ARRANGEMENT
- Publication number 20250024584
- Publication date Jan 16, 2025
- Genomtec S.A.
- Henryk Roguszczak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024592
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEMS TO RETAIN A PRINTED CIRCUIT BOARD BETWEEN MOU...
- Publication number 20250024593
- Publication date Jan 16, 2025
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCREEN PROTECTOR
- Publication number 20250024604
- Publication date Jan 16, 2025
- SANE Products Inc.
- Pei-Hsun LU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FOLDABLE ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20250023966
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Honjeong PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AUXILIARY MODULE TO SUPPORT PRINTED CIRCUIT ASSEMBLY OF ELECTRONIC...
- Publication number 20250024582
- Publication date Jan 16, 2025
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- John P. Franz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPEDANCE TUNING OF MICROSTRIP TRACES
- Publication number 20250024589
- Publication date Jan 16, 2025
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anti-Break Structure for Setting Buffer Sheets at Circuit Board Edges
- Publication number 20250024591
- Publication date Jan 16, 2025
- MEC ADDHEAT (KAIPING) CO., LTD.
- CHIENCHOU CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20250024602
- Publication date Jan 16, 2025
- Amphenol Corporation
- Marc B. Cartier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250024587
- Publication date Jan 16, 2025
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
- Publication number 20250024595
- Publication date Jan 16, 2025
- Canon Kabushiki Kaisha
- MASANORI KIKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024599
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20250024631
- Publication date Jan 16, 2025
- Nintendo Co., Ltd.
- Takafumi NISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERAS FOR SMALL FORM FACTOR DEVICES
- Publication number 20250013002
- Publication date Jan 9, 2025
- Meta Platforms Technologies, LLC
- Gue Hyung Kwon
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SHIELDABLE CIRCUIT BOARD STRUCTURE
- Publication number 20250016910
- Publication date Jan 9, 2025
- Hsien-Chiang SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE DEVICE
- Publication number 20250016925
- Publication date Jan 9, 2025
- Japan Display Inc.
- Yosuke HYODO
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH SHIELDING AND HEAT DISSIPATION FUNCTIO...
- Publication number 20250016934
- Publication date Jan 9, 2025
- Hsien-Chiang SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Camera for a motor vehicle with a housing and an electrically condu...

Systems and methods for flex circuit connections in touch screens

Semiconductor device

Hatching ground under a pad in a printed circuit board

Circuit board

Overlap joint flex circuit board interconnection

Systems and methods for an electronic device

Coaxial isolator

Socket connector assembly having a heat sink and a retention member...

Electronic component comprising first and second conductive traces...

Stretchable circuit board

Printed circuit board for transmitting electrical energy and for si...

Fastening system for coupling a computing module to a printed circu...

Module

Sample holder and superconducting quantum computer

Circuit board, antenna package and display device

Component carrier having a double dielectric layer and method of ma...

Droplet actuator fabrication apparatus, systems, and related methods

Semiconductor device, circuit board structure and manufacturing met...

Printed circuit board configured for waveguide coupling a diplexer...

Electronic device carrier structures including polymer layers as ba...

Backplane footprint for high speed, high density electrical connectors

Circuit board assembly with reduced height and reduced width, camer...

Embedded smart module

Method for manufacturing display panel using inkjet device

Managing unwanted heat, mechanical stresses and EMI in electrical c...

Electronic assembly having both chassis and module dual-flow connec...

Radio frequency front-end structures

Circuit board

Printed circuit board and wire arrangement method thereof

Patents Applicationslast 30 patents

MEMORY SYSTEM THERMAL ISLANDING HEAT ISOLATION

Metal integrated suspended line (MISL) circuits

ENHANCED MICROSTRIP TRACE

CIRCUIT STRUCTURE

BONDED BODY AND INSULATING CIRCUIT BOARD

BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE

ANTENNA MODULE AND PORTABLE ELECTRIC DEVICE USING THE SAME

CABLE DEVICE AND METHOD OF PRODUCING THE SAME

PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS

FLEXIBLE SUBSTRATE AND BUS BAR MODULE

SUBSTRATE FOR PRINTED WIRING BOARD

ADHESIVE COMPOSITION, ADHESIVE SHEET, ELECTROMAGNETIC WAVE SHIELD F...

ELECTRONIC SUBASSEMBLY WITH IMPROVED MOUNTING OF A HEAT SINK

THERMAL INTERFACE ARRANGEMENT

CERAMIC WIRING MEMBER

APPARATUS AND SYSTEMS TO RETAIN A PRINTED CIRCUIT BOARD BETWEEN MOU...

SCREEN PROTECTOR

FOLDABLE ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD

AUXILIARY MODULE TO SUPPORT PRINTED CIRCUIT ASSEMBLY OF ELECTRONIC...

IMPEDANCE TUNING OF MICROSTRIP TRACES

Anti-Break Structure for Setting Buffer Sheets at Circuit Board Edges

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

CIRCUIT BOARD

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...

CERAMIC WIRING MEMBER

ELECTRONIC APPARATUS

CAMERAS FOR SMALL FORM FACTOR DEVICES

SHIELDABLE CIRCUIT BOARD STRUCTURE

STRETCHABLE DEVICE

CIRCUIT BOARD STRUCTURE WITH SHIELDING AND HEAT DISSIPATION FUNCTIO...