Devices or means for detecting lapping completion

Industry

CPC
B24B37/013

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/013Devices or means for detecting lapping completion

Industries

Patents Grantslast 30 patents

Information Patent Grant
Motor torque endpoint during polishing with spatial resolution
- Patent number 11,980,995
- Issue date May 14, 2024
- Applied Materials, Inc.
- Thomas Li
- B24 - GRINDING POLISHING
Information Patent Grant
Single bodied platen housing a detection module for CMP systems
- Patent number 11,975,421
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Filtering during in-situ monitoring of polishing
- Patent number 11,969,855
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Optical film-thickness measuring apparatus and polishing apparatus
- Patent number 11,951,588
- Issue date Apr 9, 2024
- Ebara Corporation
- Masaki Kinoshita
- G01 - MEASURING TESTING
Information Patent Grant
Consumable part monitoring in chemical mechanical polisher
- Patent number 11,931,860
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Thomas H. Osterheld
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for cleaning process monitoring
- Patent number 11,926,017
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Charlie Wang
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Method of cleaning an optical film-thickness measuring system
- Patent number 11,919,048
- Issue date Mar 5, 2024
- Ebara Corporation
- Nobuyuki Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,897,080
- Issue date Feb 13, 2024
- Ebara Corporation
- Masashi Kabasawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system with platen for substrate edge control
- Patent number 11,890,717
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Jay Gurusamy
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 11,883,922
- Issue date Jan 30, 2024
- Ebara Corporation
- Yuki Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Profile control with multiple instances of contol algorithm during...
- Patent number 11,865,664
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Switching control algorithms on detection of exposure of underlying...
- Patent number 11,850,699
- Issue date Dec 26, 2023
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
System using film thickness estimation from machine learning based...
- Patent number 11,847,776
- Issue date Dec 19, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Film thickness estimation from machine learning based processing of...
- Patent number 11,836,913
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate polishing apparatus, method of creating thickness map, an...
- Patent number 11,833,636
- Issue date Dec 5, 2023
- Ebara Corporation
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for double-side polishing work
- Patent number 11,826,870
- Issue date Nov 28, 2023
- Sumco Corporation
- Mami Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece processing apparatus including a resin coater and a resin...
- Patent number 11,819,975
- Issue date Nov 21, 2023
- Disco Corporation
- Shinya Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Polishing apparatus and calibration method
- Patent number 11,806,828
- Issue date Nov 7, 2023
- Ebara Corporation
- Akira Nakamura
- B24 - GRINDING POLISHING
Information Patent Grant
Technique for training neural network for use in in-situ monitoring...
- Patent number 11,791,224
- Issue date Oct 17, 2023
- Applied Materials, Inc.
- Kun Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polishing system with annular platen or polishing pad
- Patent number 11,780,046
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Paul D. Butterfield
- B24 - GRINDING POLISHING
Information Patent Grant
Determination of substrate layer thickness with polishing pad wear...
- Patent number 11,780,047
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Grouping spectral data from polishing substrates
- Patent number 11,774,235
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Jeffrey Drue David
- G01 - MEASURING TESTING
Information Patent Grant
Magnetic element and eddy current sensor using the same
- Patent number 11,759,912
- Issue date Sep 19, 2023
- Ebara Corporation
- Taro Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 11,759,913
- Issue date Sep 19, 2023
- Ebara Corporation
- Keita Yagi
- B24 - GRINDING POLISHING
Information Patent Grant
Eddy current detection device and polishing apparatus
- Patent number 11,731,233
- Issue date Aug 22, 2023
- Ebara Corporation
- Taro Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Machine learning systems for monitoring of semiconductor processing
- Patent number 11,733,686
- Issue date Aug 22, 2023
- Applied Materials, Inc.
- Graham Yennie
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus including polishing pad conditioner, non-contac...
- Patent number 11,735,427
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Jin Shin
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polish edge uniformity control with secondary fluid dispense
- Patent number 11,724,355
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Justin H. Wong
- B24 - GRINDING POLISHING
Information Patent Grant
Color imaging for CMP monitoring
- Patent number 11,715,193
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Endpoint detection for chemical mechanical polishing based on spect...
- Patent number 11,715,672
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
OUTPUT SIGNAL PROCESSING DEVICE FOR EDDY-CURRENT SENSOR
- Publication number 20240118070
- Publication date Apr 11, 2024
- EBARA CORPORATION
- Katsuya MINATOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING...
- Publication number 20240116152
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING SYSTEM WITH PLATEN FOR SUBSTRATE EDGE CONTROL
- Publication number 20240100646
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Jay Gurusamy
- B24 - GRINDING POLISHING
Information Patent Application
SURFACE PROPERTY MEASURING SYSTEM, SURFACE PROPERTY MEASURING METHO...
- Publication number 20240075580
- Publication date Mar 7, 2024
- EBARA CORPORATION
- Toshifumi KIMBA
- B24 - GRINDING POLISHING
Information Patent Application
LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...
- Publication number 20240071841
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Sumin PARK
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM USING FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED...
- Publication number 20240062364
- Publication date Feb 22, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESIDUE CLASSIFICATION FROM MACHINE LEARNING BASED PROCESSING OF SU...
- Publication number 20240054634
- Publication date Feb 15, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER
- Publication number 20240017376
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Application
MONITORING THICKNESS IN FACE-UP POLISHING
- Publication number 20240017371
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240017370
- Publication date Jan 18, 2024
- EBARA CORPORATION
- Akihiro YAZAWA
- B24 - GRINDING POLISHING
Information Patent Application
TECHNIQUE FOR TRAINING NEURAL NETWORK FOR USE IN IN-SITU MONITORING...
- Publication number 20240014080
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Kun Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTROL OF PLATEN SHAPE IN CHEMICAL MECHANICAL POLISHING
- Publication number 20230415295
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
MONITORING OF ACOUSTIC EVENTS ON A SUBSTRATE
- Publication number 20230390886
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Upendra Ummethala
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METROLOGY
- Publication number 20230381911
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR...
- Publication number 20230381912
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Kun Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20230381919
- Publication date Nov 30, 2023
- EBARA CORPORATION
- Keita Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE
- Publication number 20230339066
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Justin H. WONG
- B24 - GRINDING POLISHING
Information Patent Application
WAFER POLISHING METHOD AND WAFER POLISHING DEVICE
- Publication number 20230330809
- Publication date Oct 19, 2023
- SUMCO CORPORATION
- Hiroki OTA
- B24 - GRINDING POLISHING
Information Patent Application
FILTERING DURING IN-SITU MONITORING OF POLISHING
- Publication number 20230286105
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Application
TRAINED NEURAL NETWORK IN IN-SITU MONITORING DURING POLISHING AND P...
- Publication number 20230290691
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Kun Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POLISHING SYSTEM WITH CAPACITIVE SHEAR SENSOR
- Publication number 20230278164
- Publication date Sep 7, 2023
- Applied Materials, Inc.
- Nicholas A. Wiswell
- B24 - GRINDING POLISHING
Information Patent Application
THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY
- Publication number 20230281801
- Publication date Sep 7, 2023
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING SYSTEM AND SUBSTRATE POLISHING METHOD
- Publication number 20230256559
- Publication date Aug 17, 2023
- KCTECH CO., LTD.
- Ji Hoon SON
- B24 - GRINDING POLISHING
Information Patent Application
CONSUMABLE PART MONITORING IN CHEMICAL MECHANICAL POLISHER
- Publication number 20230249315
- Publication date Aug 10, 2023
- Applied Materials, Inc.
- Thomas H. Osterheld
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20230219187
- Publication date Jul 13, 2023
- EBARA CORPORATION
- Masashi KABASAWA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING SYSTEM
- Publication number 20230191554
- Publication date Jun 22, 2023
- Konica Minolta, Inc.
- Atsushi TAKAHASHI
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING
- Publication number 20230182257
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu WANG
- B24 - GRINDING POLISHING
Information Patent Application
PAD CONDITIONER CUT RATE MONITORING
- Publication number 20230182264
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Application
MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM
- Publication number 20230182258
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Benjamin Cherian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR POLISHING SUBSTRATE INCLUDING FUNCTIONAL CHIP
- Publication number 20230173636
- Publication date Jun 8, 2023
- EBARA CORPORATION
- Tetsuji Togawa
- B24 - GRINDING POLISHING

Devices or means for detecting lapping completion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Motor torque endpoint during polishing with spatial resolution

Single bodied platen housing a detection module for CMP systems

Filtering during in-situ monitoring of polishing

Optical film-thickness measuring apparatus and polishing apparatus

Consumable part monitoring in chemical mechanical polisher

Method and apparatus for cleaning process monitoring

Method of cleaning an optical film-thickness measuring system

Polishing apparatus

Polishing system with platen for substrate edge control

Substrate processing apparatus

Profile control with multiple instances of contol algorithm during...

Switching control algorithms on detection of exposure of underlying...

System using film thickness estimation from machine learning based...

Film thickness estimation from machine learning based processing of...

Substrate polishing apparatus, method of creating thickness map, an...

Apparatus and method for double-side polishing work

Workpiece processing apparatus including a resin coater and a resin...

Polishing apparatus and calibration method

Technique for training neural network for use in in-situ monitoring...

Polishing system with annular platen or polishing pad

Determination of substrate layer thickness with polishing pad wear...

Grouping spectral data from polishing substrates

Magnetic element and eddy current sensor using the same

Polishing method and polishing apparatus

Eddy current detection device and polishing apparatus

Machine learning systems for monitoring of semiconductor processing

Polishing apparatus including polishing pad conditioner, non-contac...

Substrate polish edge uniformity control with secondary fluid dispense

Color imaging for CMP monitoring

Endpoint detection for chemical mechanical polishing based on spect...

Patents Applicationslast 30 patents

OUTPUT SIGNAL PROCESSING DEVICE FOR EDDY-CURRENT SENSOR

SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING...

POLISHING SYSTEM WITH PLATEN FOR SUBSTRATE EDGE CONTROL

SURFACE PROPERTY MEASURING SYSTEM, SURFACE PROPERTY MEASURING METHO...

LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...

SYSTEM USING FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED...

RESIDUE CLASSIFICATION FROM MACHINE LEARNING BASED PROCESSING OF SU...

MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER

MONITORING THICKNESS IN FACE-UP POLISHING

POLISHING APPARATUS AND POLISHING METHOD

TECHNIQUE FOR TRAINING NEURAL NETWORK FOR USE IN IN-SITU MONITORING...

CONTROL OF PLATEN SHAPE IN CHEMICAL MECHANICAL POLISHING

MONITORING OF ACOUSTIC EVENTS ON A SUBSTRATE

POLISHING METROLOGY

DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR...

POLISHING METHOD AND POLISHING APPARATUS

SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE

WAFER POLISHING METHOD AND WAFER POLISHING DEVICE

FILTERING DURING IN-SITU MONITORING OF POLISHING

TRAINED NEURAL NETWORK IN IN-SITU MONITORING DURING POLISHING AND P...

POLISHING SYSTEM WITH CAPACITIVE SHEAR SENSOR

THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY

SUBSTRATE POLISHING SYSTEM AND SUBSTRATE POLISHING METHOD

CONSUMABLE PART MONITORING IN CHEMICAL MECHANICAL POLISHER

POLISHING METHOD AND POLISHING APPARATUS

POLISHING SYSTEM

SYSTEM AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING

PAD CONDITIONER CUT RATE MONITORING

MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM

METHOD FOR POLISHING SUBSTRATE INCLUDING FUNCTIONAL CHIP