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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 12,062,599
- Issue date Aug 13, 2024
- Mitsubishi Electric Corporation
- Tatsuro Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-contact-type semiconductor device
- Patent number 12,051,671
- Issue date Jul 30, 2024
- Mitsubishi Electric Corporation
- Jun Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bidirectional switch circuit and power conversion device
- Patent number 11,894,839
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Koichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and power converter
- Patent number 11,863,166
- Issue date Jan 2, 2024
- Mitsubishi Electric Corporation
- Junichi Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor device
- Patent number 11,854,950
- Issue date Dec 26, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter
- Patent number 11,837,514
- Issue date Dec 5, 2023
- Mitsubishi Electric Corporation
- Yusuke Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct filter hybridization for an optical sensor and filter assembly
- Patent number 11,788,884
- Issue date Oct 17, 2023
- Raytheon Company
- Thomas P. Sprafke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,784,156
- Issue date Oct 10, 2023
- Mitsubishi Electric Corporation
- Takuya Kitabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable wide bandgap semiconductor substrate
- Patent number 11,710,662
- Issue date Jul 25, 2023
- United Silicon Carbide, Inc.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power conversion device
- Patent number 11,699,666
- Issue date Jul 11, 2023
- Mitsubishi Electric Corporation
- Akira Kosugi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and manufacturing method of semiconductor a...
- Patent number 11,605,568
- Issue date Mar 14, 2023
- Mitsubishi Electric Corporation
- Takuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with semiconductor die having a low ohmic port...
- Patent number 11,605,572
- Issue date Mar 14, 2023
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,587,841
- Issue date Feb 21, 2023
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,538,727
- Issue date Dec 27, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,495,509
- Issue date Nov 8, 2022
- Denso Corporation
- Nobuyuki Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability semiconductor devices and methods of fabricating t...
- Patent number 11,488,923
- Issue date Nov 1, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and power conversion apparatus
- Patent number 11,476,170
- Issue date Oct 18, 2022
- Mitsubishi Electric Corporation
- Yusuke Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-attach method to compensate for thermal expansion
- Patent number 11,430,744
- Issue date Aug 30, 2022
- Cree, Inc.
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor device
- Patent number 11,152,287
- Issue date Oct 19, 2021
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power conversion apparatus, and method for ma...
- Patent number 11,145,616
- Issue date Oct 12, 2021
- Mitsubishi Electric Corporation
- Takumi Shigemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies and cooling structures having metalized exte...
- Patent number 11,121,060
- Issue date Sep 14, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electric power conversion apparatus and metho...
- Patent number 11,107,760
- Issue date Aug 31, 2021
- Mitsubishi Electric Corporation
- Daisuke Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,896,863
- Issue date Jan 19, 2021
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable wide bandgap semiconductor substrate
- Patent number 10,825,733
- Issue date Nov 3, 2020
- United Silicon Carbide, Inc.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,790,242
- Issue date Sep 29, 2020
- Mitsubishi Electric Corporation
- Tetsuo Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,770,420
- Issue date Sep 8, 2020
- Mitsubishi Electric Corporation
- Shigeto Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,748,830
- Issue date Aug 18, 2020
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20240263004
- Publication date Aug 8, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258188
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Shoji SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240243071
- Publication date Jul 18, 2024
- Mitsubishi Electric Corporation
- Shota YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240203929
- Publication date Jun 20, 2024
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING BOARD
- Publication number 20240203928
- Publication date Jun 20, 2024
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145349
- Publication date May 2, 2024
- DENSO CORPORATION
- TAKAHIRO HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
- Publication number 20240047297
- Publication date Feb 8, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DIAMOND SUBSTRATE FOR THERMAL MANAGEMENT
- Publication number 20230317692
- Publication date Oct 5, 2023
- Raytheon Company
- Jarrod Vaillancourt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230245969
- Publication date Aug 3, 2023
- Mitsubishi Electric Corporation
- Masaya IMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230163037
- Publication date May 25, 2023
- Mitsubishi Electric Corporation
- Ken SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING RESI...
- Publication number 20230132513
- Publication date May 4, 2023
- Mitsubishi Electric Corporation
- Ryuichi ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIDIRECTIONAL SWITCH CIRCUIT AND POWER CONVERSION DEVICE
- Publication number 20230090703
- Publication date Mar 23, 2023
- Mitsubishi Electric Corporation
- Koichi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER, MOTOR DRIVE CONTROLLER, BLOWER, COMPRESSOR, AND AI...
- Publication number 20230092110
- Publication date Mar 23, 2023
- Mitsubishi Electric Corporation
- Satoru ICHIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20230019230
- Publication date Jan 19, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230012134
- Publication date Jan 12, 2023
- Mitsubishi Electric Corporation
- Shintaro ARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20220372274
- Publication date Nov 24, 2022
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR A...
- Publication number 20220157672
- Publication date May 19, 2022
- Mitsubishi Electric Corporation
- Takuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220102312
- Publication date Mar 31, 2022
- Mitsubishi Electric Corporation
- Takuya KITABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE-CONTACT-TYPE SEMICONDUCTOR DEVICE
- Publication number 20220005783
- Publication date Jan 6, 2022
- Mitsubishi Electric Corporation
- Jun OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20210366813
- Publication date Nov 25, 2021
- Mitsubishi Electric Corporation
- Tatsuro SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20210210404
- Publication date Jul 8, 2021
- Mitsubishi Electric Corporation
- Takuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210210401
- Publication date Jul 8, 2021
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20210118815
- Publication date Apr 22, 2021
- Mitsubishi Electric Corporation
- Akira KOSUGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS
- Publication number 20210082778
- Publication date Mar 18, 2021
- Mitsubishi Electric Corporation
- Yusuke KAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE
- Publication number 20210005517
- Publication date Jan 7, 2021
- UNITED SILICON CARBIDE, INC.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20200373270
- Publication date Nov 26, 2020
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS AND SEMICONDUCTOR...
- Publication number 20200321306
- Publication date Oct 8, 2020
- Mitsubishi Electric Corporation
- Takumi SHIGEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ASSEMBLIES AND COOLING STRUCTURES HAVING METALIZED EXTE...
- Publication number 20200194342
- Publication date Jun 18, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE
- Publication number 20200135565
- Publication date Apr 30, 2020
- UNITED SILICON CARBIDE, INC.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS

Diamond [C]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package having an electronic component and an encapsulant encapsula...

Power semiconductor module

Pressure-contact-type semiconductor device

Bidirectional switch circuit and power conversion device

Power semiconductor module and power converter

Semiconductor module and semiconductor device

Semiconductor device and power converter

Direct filter hybridization for an optical sensor and filter assembly

Semiconductor device

Reusable wide bandgap semiconductor substrate

Semiconductor device and power conversion device

Semiconductor apparatus and manufacturing method of semiconductor a...

Electronic component with semiconductor die having a low ohmic port...

Semiconductor module

Semiconductor module

Semiconductor device and method for manufacturing semiconductor device

High reliability semiconductor devices and methods of fabricating t...

Power semiconductor module and power conversion apparatus

Die-attach method to compensate for thermal expansion

Wafer level integration including design/co-design, structure proce...

Semiconductor module and semiconductor device

Semiconductor device, power conversion apparatus, and method for ma...

Electronics assemblies and cooling structures having metalized exte...

Semiconductor device, electric power conversion apparatus and metho...

Semiconductor device and method for manufacturing the same

Multi-layered composite bonding materials and power electronics ass...

Reusable wide bandgap semiconductor substrate

Method of manufacturing a semiconductor device

Semiconductor device

Semiconductor device

Patents Applicationslast 30 patents

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

METAL WIRING BOARD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER

INTEGRATED DIAMOND SUBSTRATE FOR THERMAL MANAGEMENT

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING RESI...

BIDIRECTIONAL SWITCH CIRCUIT AND POWER CONVERSION DEVICE

POWER CONVERTER, MOTOR DRIVE CONTROLLER, BLOWER, COMPRESSOR, AND AI...

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

SEMICONDUCTOR DEVICE

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR A...

SEMICONDUCTOR DEVICE

PRESSURE-CONTACT-TYPE SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

POWER SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS

REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS AND SEMICONDUCTOR...

ELECTRONICS ASSEMBLIES AND COOLING STRUCTURES HAVING METALIZED EXTE...

REUSABLE WIDE BANDGAP SEMICONDUCTOR SUBSTRATE