Dicing

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CPC
Y10S148/028

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S148/00Metal treatment

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Y10S148/028Dicing

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Patents Grantslast 30 patents

Information Patent Grant
Nitride compound semiconductor element and method for manufacturing...
- Patent number 8,306,085
- Issue date Nov 6, 2012
- Panasonic Corporation
- Yoshiaki Hasegawa
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Nitride compound semiconductor element and method for manufacturing...
- Patent number 8,039,283
- Issue date Oct 18, 2011
- Panasonic Corporation
- Yoshiaki Hasegawa
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Apparatus and method for batch processing semiconductor substrates...
- Patent number 6,673,699
- Issue date Jan 6, 2004
- ADC Telecommunications, Inc.
- Kevin J. Hubbard
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method for batch processing semiconductor substrates...
- Patent number 6,451,120
- Issue date Sep 17, 2002
- ADC Telecommunications, Inc.
- Kevin J. Hubbard
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of manufacturing semiconductor acceleration sensor
- Patent number 6,124,148
- Issue date Sep 26, 2000
- Seiko Instruments R&D Center Inc.
- Masataka Shinogi
- G01 - MEASURING TESTING
Information Patent Grant
Simplified process for the fabrication of deep clear laser marks us...
- Patent number 6,063,695
- Issue date May 16, 2000
- Taiwan Semiconductor Manufacturing Company
- Chung-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for locating dies cut from a silicon wafer on a w...
- Patent number 5,933,351
- Issue date Aug 3, 1999
- Texas Instruments Incorporated
- Subramanian Balamurugan
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Methods for precise definition of integrated circuit chip edges
- Patent number 5,925,924
- Issue date Jul 20, 1999
- International Business Machines Corporation
- John Edward Cronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stacked three dimensional device manufacture
- Patent number 5,872,025
- Issue date Feb 16, 1999
- International Business Machines Corporation
- John E. Cronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging technique yielding increased inner lead cou...
- Patent number 5,744,858
- Issue date Apr 28, 1998
- LSI Logic Corporation
- Michael D. Rostoker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for precise definition of integrated circuit chip edges
- Patent number 5,691,248
- Issue date Nov 25, 1997
- International Business Machines Corporation
- John Edward Cronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing members
- Patent number 5,641,714
- Issue date Jun 24, 1997
- Sony Corporation
- Hideo Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of severing a thin film semiconductor device
- Patent number 5,637,537
- Issue date Jun 10, 1997
- United Solar Systems Corporation
- Prem Nath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of preventing humidity invasion
- Patent number 5,629,557
- Issue date May 13, 1997
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of protecting micromechanical devices during wafer separation
- Patent number 5,605,489
- Issue date Feb 25, 1997
- Texas Instruments Incorporated
- Richard O. Gale
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 5,593,926
- Issue date Jan 14, 1997
- Sumitomo Electric Industries, Ltd.
- Mitsuaki Fujihira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of preventing humidity invasion
- Patent number 5,593,925
- Issue date Jan 14, 1997
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawcut method of forming alignment marks on two faces of a substrate
- Patent number 5,580,831
- Issue date Dec 3, 1996
- Fujitsu Limited
- James J. Roman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scribe technique using laser by forming polysilicon
- Patent number 5,543,365
- Issue date Aug 6, 1996
- Texas Instruments Incorporated
- Kendall S. Wills
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer method for breaking a semiconductor
- Patent number 5,527,744
- Issue date Jun 18, 1996
- Texas Instruments Incorporated
- Michael A. Mignardi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Pressure-adjusting device for adjusting output of integrated pressu...
- Patent number 5,528,214
- Issue date Jun 18, 1996
- Nippondenso Co., Ltd.
- Kazuhiko Koga
- G01 - MEASURING TESTING
Information Patent Grant
Process for fabircating an integrated circuit
- Patent number 5,516,728
- Issue date May 14, 1996
- AT&T Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor elements without burrs
- Patent number 5,462,900
- Issue date Oct 31, 1995
- Rohm Co., Ltd.
- Tetsuro Oki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dicing method which uses variable sawing speeds
- Patent number 5,451,549
- Issue date Sep 19, 1995
- Rohm Co., Ltd.
- Tetsuro Oki
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer-like processing after sawing DMDs
- Patent number 5,445,559
- Issue date Aug 29, 1995
- Texas Instruments Incorporated
- Richard O. Gale
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of producing a field effect transistor
- Patent number 5,434,094
- Issue date Jul 18, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Michihiro Kobiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an integrated pressure sensor
- Patent number 5,421,956
- Issue date Jun 6, 1995
- Nippondenso Co., Ltd.
- Kazuhiko Koga
- G01 - MEASURING TESTING
Information Patent Grant
Integrated partial sawing process
- Patent number 5,393,706
- Issue date Feb 28, 1995
- Texas Instruments Incorporated
- Michael A. Mignardi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor - slice cleaving
- Patent number 5,393,707
- Issue date Feb 28, 1995
- Northern Telecom Limited
- Kevin Canning
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Individually powering-up unsingulated dies on a wafer
- Patent number 5,389,556
- Issue date Feb 14, 1995
- LSI Logic Corporation
- Michael D. Rostoker
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
NITRIDE COMPOUND SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING...
- Publication number 20120002693
- Publication date Jan 5, 2012
- PANASONIC CORPORATION
- Yoshiaki HASEGAWA
- B82 - NANO-TECHNOLOGY
Information Patent Application
NITRIDE COMPOUND SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING...
- Publication number 20100226401
- Publication date Sep 9, 2010
- Yoshiaki Hasegawa
- B82 - NANO-TECHNOLOGY
Information Patent Application
Apparatus and method for batch processing semiconductor substrates...
- Publication number 20020197757
- Publication date Dec 26, 2002
- ADC Telecommunications, Inc.
- Kevin J. Hubbard
- B28 - WORKING CEMENT, CLAY, OR STONE

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nitride compound semiconductor element and method for manufacturing...

Nitride compound semiconductor element and method for manufacturing...

Apparatus and method for batch processing semiconductor substrates...

Apparatus and method for batch processing semiconductor substrates...

Method of manufacturing semiconductor acceleration sensor

Simplified process for the fabrication of deep clear laser marks us...

System and method for locating dies cut from a silicon wafer on a w...

Methods for precise definition of integrated circuit chip edges

Method for stacked three dimensional device manufacture

Semiconductor packaging technique yielding increased inner lead cou...

Methods for precise definition of integrated circuit chip edges

Method of manufacturing members

Method of severing a thin film semiconductor device

Semiconductor device capable of preventing humidity invasion

Method of protecting micromechanical devices during wafer separation

Method of manufacturing semiconductor device

Semiconductor device capable of preventing humidity invasion

Sawcut method of forming alignment marks on two faces of a substrate

Wafer scribe technique using laser by forming polysilicon

Wafer method for breaking a semiconductor

Pressure-adjusting device for adjusting output of integrated pressu...

Process for fabircating an integrated circuit

Method of manufacturing semiconductor elements without burrs

Semiconductor dicing method which uses variable sawing speeds

Wafer-like processing after sawing DMDs

Method of producing a field effect transistor

Method of fabricating an integrated pressure sensor

Integrated partial sawing process

Semiconductor - slice cleaving

Individually powering-up unsingulated dies on a wafer

Patents Applicationslast 30 patents

NITRIDE COMPOUND SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING...

NITRIDE COMPOUND SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING...

Apparatus and method for batch processing semiconductor substrates...