Dielectric regions

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H01L21/762

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/762Dielectric regions

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded stressors in epitaxy source/drain regions
- Patent number 12,266,572
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench isolation structure and method of making the same
- Patent number 12,266,577
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rails and power distribution network for density sca...
- Patent number 12,268,031
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of single crystal semiconductors using planar vapor liqui...
- Patent number 12,266,526
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Martin Christopher Holland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,266,652
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Junmo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,266,576
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parasitic capacitance reduction in GaN-on-silicon devices
- Patent number 12,266,523
- Issue date Apr 1, 2025
- MACOM Technology Solutions Holdings, Inc.
- Gabriel R. Cueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having gate dielectric layer
- Patent number 12,266,543
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact formed using bottom-...
- Patent number 12,266,688
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor isolation regions and methods of forming the same
- Patent number 12,266,573
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi Chen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,266,728
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having buried word lines
- Patent number 12,267,993
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Min-Chung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-end-of-line strap for standard cell
- Patent number 12,261,113
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Hung Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming integrated circuit
- Patent number 12,261,175
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming low-stress silicon nitride layer through hydrogen treatment
- Patent number 12,261,036
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gapfill of variable aspect ratio features with a composite PEALD an...
- Patent number 12,261,038
- Issue date Mar 25, 2025
- Lam Research Corporation
- Hu Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming nitrogen-containing layers as oxidation blocking layers
- Patent number 12,261,042
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a strained semiconductor-on-insulator substrate
- Patent number 12,261,079
- Issue date Mar 25, 2025
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic multi-bit weight cell for neuromorphic computing
- Patent number 12,260,324
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Borna J. Obradovic
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,261,201
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Young-Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-based optical device and method of fabricating the same
- Patent number 12,259,604
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including isolation regions
- Patent number 12,261,200
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Min-Chul Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin-end gate structures and method forming same
- Patent number 12,261,213
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boundary design to reduce memory array edge CMP dishing effect
- Patent number 12,256,549
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation structures with varying depths and method of formi...
- Patent number 12,255,200
- Issue date Mar 18, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Yong Wah See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 12,255,164
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 12,255,063
- Issue date Mar 18, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with backside via contact and a protection...
- Patent number 12,255,103
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,249,649
- Issue date Mar 11, 2025
- United Microelectronics Corp.
- Cheng-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER
- Publication number 20250112067
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250112116
- Publication date Apr 3, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT TRANSFER OF TRANSITION METAL DICHALCOGENIDE MONOLAYERS USING...
- Publication number 20250113521
- Publication date Apr 3, 2025
- Intel Corporation
- Andrey Vyatskikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTOR CRESCENT-SHAPED DIELECTRIC ISOLATION
- Publication number 20250113560
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM FREE ISOLATION STRUCTURES AND METHOD FOR MAKING THE SAME
- Publication number 20250113602
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Ruei JHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER OF A 2D MATERIAL TO A TARGET SUBSTRATE
- Publication number 20250113520
- Publication date Apr 3, 2025
- Intel Corporation
- Andrey Vyatskikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPI HEIGHT REDUCTION FOR IMPROVED TRANSISTOR PERFORMANCE
- Publication number 20250113564
- Publication date Apr 3, 2025
- Intel Corporation
- Leonard Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL WORK FUNCTION WORD LINE FOR 4F2
- Publication number 20250107068
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Tong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CROSS-TALK NOISE RESISTIVE MEMORY DEVICES ON A SOI SUBSTRATE AN...
- Publication number 20250107104
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kao-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250105192
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Tae Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ELECTRICAL ISOLATION OF TRANSISTORS
- Publication number 20250107170
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Yun-Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250107242
- Publication date Mar 27, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250107210
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Kanako Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE DEVICE AND RELATED METHODS
- Publication number 20250107222
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Yang CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS
- Publication number 20250105053
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MEMORY DEVICE
- Publication number 20250105017
- Publication date Mar 27, 2025
- Macronix International Co., Ltd.
- Hsun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURES FOR MINIMIZING SUBTHRESHOLD HUMP EFFECT
- Publication number 20250107162
- Publication date Mar 27, 2025
- Cirrus Logic International Semiconductor Ltd.
- Kuen-Ting SHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRECISION HETEROGENEOUS INTEGRATION
- Publication number 20250105009
- Publication date Mar 27, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY
- Publication number 20250098160
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20250098325
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250098259
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Wen CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20250095994
- Publication date Mar 20, 2025
- United Semiconductor (Xiamen) Co., Ltd.
- Jian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096004
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIN-YUAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20250096000
- Publication date Mar 20, 2025
- United Microelectronics Corp.
- Kun-Ju Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHOD...
- Publication number 20250096035
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Chiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK
- Publication number 20250096126
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Dan Moy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250098283
- Publication date Mar 20, 2025
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250096033
- Publication date Mar 20, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM LAMINATE ISOLATION SUBSTRATE
- Publication number 20250096034
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chang-Yen KO
- H01 - BASIC ELECTRIC ELEMENTS

Dielectric regions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded stressors in epitaxy source/drain regions

Deep trench isolation structure and method of making the same

Backside power rails and power distribution network for density sca...

Formation of single crystal semiconductors using planar vapor liqui...

Semiconductor device

Semiconductor device and methods of manufacture

Parasitic capacitance reduction in GaN-on-silicon devices

Semiconductor device structure having gate dielectric layer

Semiconductor device with source/drain contact formed using bottom-...

Transistor isolation regions and methods of forming the same

Semiconductor device and method of manufacture

Semiconductor structure having buried word lines

Middle-end-of-line strap for standard cell

Method for forming integrated circuit

Forming low-stress silicon nitride layer through hydrogen treatment

Gapfill of variable aspect ratio features with a composite PEALD an...

Forming nitrogen-containing layers as oxidation blocking layers

Method for fabricating a strained semiconductor-on-insulator substrate

Monolithic multi-bit weight cell for neuromorphic computing

Semiconductor device

Silicon-based optical device and method of fabricating the same

Semiconductor device including isolation regions

Fin-end gate structures and method forming same

Trench contact structures for advanced integrated circuit structure...

Boundary design to reduce memory array edge CMP dishing effect

Trench isolation structures with varying depths and method of formi...

Structure and method for isolation of bit-line drivers for a three-...

Substrate processing system and substrate processing method

Semiconductor structure with backside via contact and a protection...

Semiconductor device

Patents Applicationslast 30 patents

REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

DIRECT TRANSFER OF TRANSITION METAL DICHALCOGENIDE MONOLAYERS USING...

FIELD-EFFECT TRANSISTOR CRESCENT-SHAPED DIELECTRIC ISOLATION

SEAM FREE ISOLATION STRUCTURES AND METHOD FOR MAKING THE SAME

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

TRANSFER OF A 2D MATERIAL TO A TARGET SUBSTRATE

EPI HEIGHT REDUCTION FOR IMPROVED TRANSISTOR PERFORMANCE

DUAL WORK FUNCTION WORD LINE FOR 4F2

LOW CROSS-TALK NOISE RESISTIVE MEMORY DEVICES ON A SOI SUBSTRATE AN...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

METHODS FOR ELECTRICAL ISOLATION OF TRANSISTORS

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

MULTI-GATE DEVICE AND RELATED METHODS

SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS

METHOD OF MANUFACTURING MEMORY DEVICE

TRANSISTOR STRUCTURES FOR MINIMIZING SUBTHRESHOLD HUMP EFFECT

HIGH-PRECISION HETEROGENEOUS INTEGRATION

ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHOD...

BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK

SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DAM LAMINATE ISOLATION SUBSTRATE