Dielectric regions

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H01L21/762

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/762Dielectric regions

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure with recessed top semiconductor layer in su...
- Patent number 12,230,720
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor-on-insulator substrate
- Patent number 12,230,533
- Issue date Feb 18, 2025
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 12,230,509
- Issue date Feb 18, 2025
- United Microelectronics Corp.
- Ming Thai Chai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 12,230,693
- Issue date Feb 18, 2025
- CSMC Technologies Fab2 Co., Ltd.
- Nailong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacture by monitoring relative...
- Patent number 12,230,532
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a MEMS switch having an embedded metal con...
- Patent number 12,230,457
- Issue date Feb 18, 2025
- Robert Bosch GmbH
- Jochen Reinmuth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated filler capacitor cell device and corresponding manufactu...
- Patent number 12,230,565
- Issue date Feb 18, 2025
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with BioFETs
- Patent number 12,222,317
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Tsun Chen
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,224,225
- Issue date Feb 11, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of buried wordline structure
- Patent number 12,224,323
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming backside power rails
- Patent number 12,224,324
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single crystalline silicon stack formation and bonding to a cmos wafer
- Patent number 12,224,201
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing 3D semiconductor devices and structures with t...
- Patent number 12,225,737
- Issue date Feb 11, 2025
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming an oxide volume within a fin
- Patent number 12,224,202
- Issue date Feb 11, 2025
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 12,225,740
- Issue date Feb 11, 2025
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Load switch including back-to-back connected transistors
- Patent number 12,224,740
- Issue date Feb 11, 2025
- Nuvolta Technoloiges (Heifei) Co., Ltd.
- Jinbiao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered substrate structures for power and RF applications
- Patent number 12,217,957
- Issue date Feb 4, 2025
- QROMIS, Inc.
- Vladimir Odnoblyudov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 12,218,012
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,218,222
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench intersections
- Patent number 12,218,188
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation process
- Patent number 12,217,999
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Growth structure for strained channel, and strained channel using t...
- Patent number 12,218,238
- Issue date Feb 4, 2025
- Korea Advanced Institute of Science and Technology
- Sanghyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including gate separation region
- Patent number 12,218,131
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Sun Ki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
False collectors and guard rings for semiconductor devices
- Patent number 12,218,190
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Alexei Sadovnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,210
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,218,130
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,218,221
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid channel semiconductor device and method
- Patent number 12,211,900
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming SOI substrates
- Patent number 12,211,686
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF IMPLANTING SEMICONDUCTOR DONOR SUBSTRATE AND METHOD OF MA...
- Publication number 20250062127
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN WAFER, METHOD OF MANUFACTURING THE THIN WAFER, STACK TYPE SEMI...
- Publication number 20250062284
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Hee Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING NOTCHES ON WAFER SIDEWALL FOR WAFER CUT
- Publication number 20250062159
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING NITRIDE SE...
- Publication number 20250059676
- Publication date Feb 20, 2025
- Shin-Etsu Handotai Co., Ltd.
- Ippei KUBONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures for Dual-Thickness Active Area SOI FETS
- Publication number 20250063822
- Publication date Feb 20, 2025
- pSemi Corporation
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE
- Publication number 20250063821
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shallow Trench Isolation using Porous Semiconductor
- Publication number 20250062157
- Publication date Feb 20, 2025
- MURATA MANUFACTURING CO., LTD.
- Kouassi Sebastien Kouassi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH GATE SPACER AND METHOD FOR FORM...
- Publication number 20250062158
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Li CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250062234
- Publication date Feb 20, 2025
- CXMT CORPORATION
- Xiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR (SOI) STRUCTURES FOR CHARGE DAMAGE PROTECTION
- Publication number 20250063828
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE SEMICONDUCTOR STRUCTURE ON SILICON-ON-INSULATOR A...
- Publication number 20250056858
- Publication date Feb 13, 2025
- SOITEC
- Christelle Veytizou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING FIN-THINNING THROUGH FEEDBACK
- Publication number 20250056823
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BACKSIDE ISOLATION FEATURE INTEGRATION
- Publication number 20250056865
- Publication date Feb 13, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A DONOR SUBSTRATE
- Publication number 20250054745
- Publication date Feb 13, 2025
- SOITEC
- Sebastien Thibert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE/NANOSHEET DEVICE WITH CRYSTAL SPACER AND METHOD OF MANUFAC...
- Publication number 20250056850
- Publication date Feb 13, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING WAFER EDGE DEFECTS
- Publication number 20250054807
- Publication date Feb 13, 2025
- WINBOND ELECTRONICS CORP.
- Cheng-Hsiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250054808
- Publication date Feb 13, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guangjie XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-GATE EFFECT CONTROL VIA DOPING
- Publication number 20250048691
- Publication date Feb 6, 2025
- Murata Manufacturing Co., Ltd.
- Kouassi Sebastien KOUASSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE VIA WITH BURIED SEMICONDUCTOR STRUCTURE AND T...
- Publication number 20250048710
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lo-Heng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WAFER BONDING
- Publication number 20250046650
- Publication date Feb 6, 2025
- WAFER WORKS CORPORATION
- Wei-Jing CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD...
- Publication number 20250046679
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BREAK BETWEEN PASSIVE DEVICE AND LOGIC DEVICE WITH BACKSI...
- Publication number 20250046714
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE SINGULATION USING BURIED SACRIFICIAL STRUCTURE
- Publication number 20250048714
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20250046649
- Publication date Feb 6, 2025
- DB HiTek Co., Ltd.
- Sang Il HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING ISOLATION TRENCH, AND ISOLATION TRENCH
- Publication number 20250040203
- Publication date Jan 30, 2025
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xufeng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENDRITE MITIGATION OF PASSIVE COMPONENTS
- Publication number 20250038043
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELECTRONIC DEVICE INTEGRATING AN ELECTRONIC COMPONENT...
- Publication number 20250040210
- Publication date Jan 30, 2025
- STMicroelectronics International N.V.
- Riccardo DEPETRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION MODULE FOR BACKSIDE POWER DELIVERY
- Publication number 20250040170
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Veeraraghavan S. BASKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF AND MEMORY S...
- Publication number 20250040125
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhaoyun TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS

Dielectric regions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure with recessed top semiconductor layer in su...

Method for manufacturing a semiconductor-on-insulator substrate

Method for fabricating semiconductor device

Semiconductor device and manufacturing method therefor

Semiconductor device, method of manufacture by monitoring relative...

Shield structure for backside through substrate vias (TSVs)

Method for manufacturing a MEMS switch having an embedded metal con...

Integrated filler capacitor cell device and corresponding manufactu...

Integrated circuit with BioFETs

Semiconductor circuit structure with direct die heat removal structure

Fabrication method of buried wordline structure

Method of forming backside power rails

Single crystalline silicon stack formation and bonding to a cmos wafer

Method for producing 3D semiconductor devices and structures with t...

Forming an oxide volume within a fin

Dual metal silicide structures for advanced integrated circuit stru...

Load switch including back-to-back connected transistors

Engineered substrate structures for power and RF applications

Method of manufacturing semiconductor devices with multiple silicid...

FinFET device and method of forming same

Deep trench intersections

Trench isolation process

Growth structure for strained channel, and strained channel using t...

Semiconductor device including gate separation region

False collectors and guard rings for semiconductor devices

Semiconductor device

Semiconductor structure cutting process and structures formed thereby

Semiconductor device and method

Hybrid channel semiconductor device and method

Methods of forming SOI substrates

Patents Applicationslast 30 patents

METHOD OF IMPLANTING SEMICONDUCTOR DONOR SUBSTRATE AND METHOD OF MA...

THIN WAFER, METHOD OF MANUFACTURING THE THIN WAFER, STACK TYPE SEMI...

FORMING NOTCHES ON WAFER SIDEWALL FOR WAFER CUT

NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING NITRIDE SE...

Contact Structures for Dual-Thickness Active Area SOI FETS

MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE

Shallow Trench Isolation using Porous Semiconductor

SEMICONDUCTOR DEVICE STRUCTURE WITH GATE SPACER AND METHOD FOR FORM...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

SILICON-ON-INSULATOR (SOI) STRUCTURES FOR CHARGE DAMAGE PROTECTION

GROUP III-NITRIDE SEMICONDUCTOR STRUCTURE ON SILICON-ON-INSULATOR A...

CONTROLLING FIN-THINNING THROUGH FEEDBACK

SEMICONDUCTOR DEVICE BACKSIDE ISOLATION FEATURE INTEGRATION

METHOD FOR FABRICATING A DONOR SUBSTRATE

NANOWIRE/NANOSHEET DEVICE WITH CRYSTAL SPACER AND METHOD OF MANUFAC...

METHOD FOR REDUCING WAFER EDGE DEFECTS

SOI SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

BACK-GATE EFFECT CONTROL VIA DOPING

SELF-ALIGNED BACKSIDE VIA WITH BURIED SEMICONDUCTOR STRUCTURE AND T...

METHOD OF WAFER BONDING

THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD...

DIFFUSION BREAK BETWEEN PASSIVE DEVICE AND LOGIC DEVICE WITH BACKSI...

WAFER-LEVEL DIE SINGULATION USING BURIED SACRIFICIAL STRUCTURE

HIGH VOLTAGE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

METHOD FOR FORMING ISOLATION TRENCH, AND ISOLATION TRENCH

DENDRITE MITIGATION OF PASSIVE COMPONENTS

SEMICONDUCTOR ELECTRONIC DEVICE INTEGRATING AN ELECTRONIC COMPONENT...

ISOLATION MODULE FOR BACKSIDE POWER DELIVERY

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF AND MEMORY S...

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF