Dielectric regions

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H01L21/762

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/762Dielectric regions

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,723
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-dimensional metal first device layout and circuit design
- Patent number 12,288,747
- Issue date Apr 29, 2025
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and associated fabricating method
- Patent number 12,289,905
- Issue date Apr 29, 2025
- Parabellum Strategic Opportunities Fund LLC
- Jia-Rui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors having increased effective channel width
- Patent number 12,289,924
- Issue date Apr 29, 2025
- OmniVision Technologies, Inc.
- Chiao-Ti Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal wrap-around contacts for semiconductor devices
- Patent number 12,284,820
- Issue date Apr 22, 2025
- Tokyo Electron Limited
- Hiroaki Niimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,516
- Issue date Apr 22, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Gongyi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,283,517
- Issue date Apr 22, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Pengchong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,284,827
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Gyu-Hwan Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin end plug structures for advanced integrated circuit structure f...
- Patent number 12,284,826
- Issue date Apr 22, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with isolation structure
- Patent number 12,278,235
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shi-Ning Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,279,455
- Issue date Apr 15, 2025
- Vanguard International Semiconductor Corporation
- Syed-Sarwar Imam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a fin with minimal length between two single...
- Patent number 12,278,265
- Issue date Apr 15, 2025
- United Microelectronics Corp.
- Chien-Heng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 12,278,180
- Issue date Apr 15, 2025
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,278,139
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure and semiconductor s...
- Patent number 12,278,137
- Issue date Apr 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhugen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing memory device with first and second isolati...
- Patent number 12,278,138
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with helmet structure between two semiconducto...
- Patent number 12,278,236
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming contact features in field-effect transistors
- Patent number 12,272,605
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,272,606
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Sangmin Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,272,646
- Issue date Apr 8, 2025
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-side type image sensors
- Patent number 12,272,720
- Issue date Apr 8, 2025
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor level interconnection methodologies utilizing 3D interco...
- Patent number 12,272,730
- Issue date Apr 8, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with conductive pillars and reinforcin...
- Patent number 12,272,687
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclical deposition method and apparatus for filling a recess forme...
- Patent number 12,272,593
- Issue date Apr 8, 2025
- ASM IP Holding B.V.
- Zecheng Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of fabricating the same having a se...
- Patent number 12,272,594
- Issue date Apr 8, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yu-Cheng Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
High voltage device and manufacturing method thereof
- Patent number 12,272,592
- Issue date Apr 8, 2025
- Richtek Technology Corporation
- Kun-Huang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a substrate for the epitaxial growth of a laye...
- Patent number 12,270,123
- Issue date Apr 8, 2025
- Soitec
- Eric Guiot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rails and power distribution network for density sca...
- Patent number 12,268,031
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded stressors in epitaxy source/drain regions
- Patent number 12,266,572
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BURIED INTERCONNECT TRAVERSING TRENCH ISOLATION
- Publication number 20250140692
- Publication date May 1, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Kiril B. Borisov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-PHOTON AVALANCHE DIODES WITH HYBRID TRENCH ISOLATION STRUCTURES
- Publication number 20250142983
- Publication date May 1, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Ping Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140602
- Publication date May 1, 2025
- SOITEC
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
- Publication number 20250142855
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Veeraraghavan S. Basker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH ISOLATION STRUCTURES
- Publication number 20250140599
- Publication date May 1, 2025
- GlobalFoundries U.S. INC.
- Jacob M. DeAngelis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250142875
- Publication date May 1, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED...
- Publication number 20250142938
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING A DOUBLE SEMICONDUCTOR-ON-INSULATOR STRUCTURE
- Publication number 20250140600
- Publication date May 1, 2025
- SOITEC
- Carine Duret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING A DOUBLE SEMICONDUCTOR-ON-INSULATOR STRUCTURE
- Publication number 20250140601
- Publication date May 1, 2025
- SOITEC
- Carine Duret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
- Publication number 20250140603
- Publication date May 1, 2025
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION
- Publication number 20250142856
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20250142939
- Publication date May 1, 2025
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Structures in Semiconductor Devices
- Publication number 20250132190
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsuan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH T...
- Publication number 20250133749
- Publication date Apr 24, 2025
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENGINEERED SUBSTRATE STRUCTURES FOR POWER AND RF APPLICATIONS
- Publication number 20250132152
- Publication date Apr 24, 2025
- QROMIS,INC.
- Vladimir Odnoblyudov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR OPERATING INTEGRATED CIRCUIT WITH BIOFETS
- Publication number 20250130198
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Tsun CHEN
- G01 - MEASURING TESTING
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250132187
- Publication date Apr 24, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20250133802
- Publication date Apr 24, 2025
- Vanguard International Semiconductor Corporation
- Sheng-Wei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH INTERSECTIONS
- Publication number 20250133780
- Publication date Apr 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR IMPROVING ESD PERFORMANCE OF METAL-GATE HI...
- Publication number 20250133813
- Publication date Apr 24, 2025
- Shanghai Huali Integrated Circuit Corporation
- Zhi TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING ISOLATION REGIONS WITH LOW PARASITIC CAPACITANCE AND REDUCE...
- Publication number 20250132191
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20250126883
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING SEMICONDUCTOR TRANSISTOR DEVICES WITH RECESSED S...
- Publication number 20250125187
- Publication date Apr 17, 2025
- ATOMERA INCORPORATED
- DONGHUN KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250126871
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jiwon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFER OF A THIN LAYER OF SILICON
- Publication number 20250125188
- Publication date Apr 17, 2025
- GlobalWafers Co. Ltd.
- Gaurab Samanta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20250126853
- Publication date Apr 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Peter MOENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...
- Publication number 20250126869
- Publication date Apr 17, 2025
- Intel Corporation
- Subhash JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250126882
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Sang Min YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20250126822
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION PROCESS
- Publication number 20250125186
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Lei CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Dielectric regions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Multi-dimensional metal first device layout and circuit design

Semiconductor structure and associated fabricating method

Transistors having increased effective channel width

Dual metal wrap-around contacts for semiconductor devices

Semiconductor device and method for manufacturing the same

Method for forming semiconductor structure

Semiconductor devices

Fin end plug structures for advanced integrated circuit structure f...

Semiconductor device with isolation structure

Semiconductor device and method of fabricating the same

Method for fabricating a fin with minimal length between two single...

Memory arrays and methods used in forming a memory array

Manufacturing method of semiconductor device

Manufacturing method of semiconductor structure and semiconductor s...

Method of manufacturing memory device with first and second isolati...

Semiconductor device with helmet structure between two semiconducto...

Methods of forming contact features in field-effect transistors

Semiconductor device

Semiconductor memory device

Front-side type image sensors

Transistor level interconnection methodologies utilizing 3D interco...

Semiconductor device package with conductive pillars and reinforcin...

Cyclical deposition method and apparatus for filling a recess forme...

Semiconductor device and method of fabricating the same having a se...

3D semiconductor memory device and structure with memory and metal...

High voltage device and manufacturing method thereof

Method for producing a substrate for the epitaxial growth of a laye...

Backside power rails and power distribution network for density sca...

Embedded stressors in epitaxy source/drain regions

Patents Applicationslast 30 patents

BURIED INTERCONNECT TRAVERSING TRENCH ISOLATION

SINGLE-PHOTON AVALANCHE DIODES WITH HYBRID TRENCH ISOLATION STRUCTURES

COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF

PUNCH THROUGH STOPPER IN BULK FINFET DEVICE

DEVICE WITH ISOLATION STRUCTURES

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED...

PROCESS FOR FABRICATING A DOUBLE SEMICONDUCTOR-ON-INSULATOR STRUCTURE

PROCESS FOR FABRICATING A DOUBLE SEMICONDUCTOR-ON-INSULATOR STRUCTURE

METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE

NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

Isolation Structures in Semiconductor Devices

METHOD FOR PRODUCING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH T...

ENGINEERED SUBSTRATE STRUCTURES FOR POWER AND RF APPLICATIONS

METHOD FOR OPERATING INTEGRATED CIRCUIT WITH BIOFETS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

DEEP TRENCH INTERSECTIONS

METHOD AND STRUCTURE FOR IMPROVING ESD PERFORMANCE OF METAL-GATE HI...

FORMING ISOLATION REGIONS WITH LOW PARASITIC CAPACITANCE AND REDUCE...

Semiconductor Structure Cutting Process and Structures Formed Thereby

METHODS FOR MAKING SEMICONDUCTOR TRANSISTOR DEVICES WITH RECESSED S...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

METHOD FOR TRANSFER OF A THIN LAYER OF SILICON

MONOLITHIC SEMICONDUCTOR DEVICE ASSEMBLIES

EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor Device and Method

TRENCH ISOLATION PROCESS