Dielectric regions

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CPC
H01L21/762

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/762Dielectric regions

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming contact features in field-effect transistors
- Patent number 12,272,605
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,272,606
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Sangmin Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,272,646
- Issue date Apr 8, 2025
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-side type image sensors
- Patent number 12,272,720
- Issue date Apr 8, 2025
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor level interconnection methodologies utilizing 3D interco...
- Patent number 12,272,730
- Issue date Apr 8, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with conductive pillars and reinforcin...
- Patent number 12,272,687
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclical deposition method and apparatus for filling a recess forme...
- Patent number 12,272,593
- Issue date Apr 8, 2025
- ASM IP Holding B.V.
- Zecheng Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of fabricating the same having a se...
- Patent number 12,272,594
- Issue date Apr 8, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yu-Cheng Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing a substrate for the epitaxial growth of a laye...
- Patent number 12,270,123
- Issue date Apr 8, 2025
- Soitec
- Eric Guiot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage device and manufacturing method thereof
- Patent number 12,272,592
- Issue date Apr 8, 2025
- Richtek Technology Corporation
- Kun-Huang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded stressors in epitaxy source/drain regions
- Patent number 12,266,572
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench isolation structure and method of making the same
- Patent number 12,266,577
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rails and power distribution network for density sca...
- Patent number 12,268,031
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of single crystal semiconductors using planar vapor liqui...
- Patent number 12,266,526
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Martin Christopher Holland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,266,576
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,266,652
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Junmo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parasitic capacitance reduction in GaN-on-silicon devices
- Patent number 12,266,523
- Issue date Apr 1, 2025
- MACOM Technology Solutions Holdings, Inc.
- Gabriel R. Cueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact formed using bottom-...
- Patent number 12,266,688
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having gate dielectric layer
- Patent number 12,266,543
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having buried word lines
- Patent number 12,267,993
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Min-Chung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,266,728
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor isolation regions and methods of forming the same
- Patent number 12,266,573
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi Chen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-end-of-line strap for standard cell
- Patent number 12,261,113
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Hung Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming integrated circuit
- Patent number 12,261,175
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a strained semiconductor-on-insulator substrate
- Patent number 12,261,079
- Issue date Mar 25, 2025
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming low-stress silicon nitride layer through hydrogen treatment
- Patent number 12,261,036
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gapfill of variable aspect ratio features with a composite PEALD an...
- Patent number 12,261,038
- Issue date Mar 25, 2025
- Lam Research Corporation
- Hu Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming nitrogen-containing layers as oxidation blocking layers
- Patent number 12,261,042
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic multi-bit weight cell for neuromorphic computing
- Patent number 12,260,324
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Borna J. Obradovic
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME IN FIELD-EFFEC...
- Publication number 20250120115
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shi Ning Ju
- B82 - NANO-TECHNOLOGY
Information Patent Application
SHALLOW TRENCH ISOLATION PROCESSING WITH LOCAL OXIDATION OF SILICON
- Publication number 20250120169
- Publication date Apr 10, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Robert Martin Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF FIELD EFFECT TRANSISTOR STRUCTURE
- Publication number 20250120171
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Thinning a Semiconductor Substrate
- Publication number 20250118564
- Publication date Apr 10, 2025
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250118625
- Publication date Apr 10, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER
- Publication number 20250112067
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM FREE ISOLATION STRUCTURES AND METHOD FOR MAKING THE SAME
- Publication number 20250113602
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Ruei JHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT TRANSFER OF TRANSITION METAL DICHALCOGENIDE MONOLAYERS USING...
- Publication number 20250113521
- Publication date Apr 3, 2025
- Intel Corporation
- Andrey Vyatskikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTOR CRESCENT-SHAPED DIELECTRIC ISOLATION
- Publication number 20250113560
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250112116
- Publication date Apr 3, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER OF A 2D MATERIAL TO A TARGET SUBSTRATE
- Publication number 20250113520
- Publication date Apr 3, 2025
- Intel Corporation
- Andrey Vyatskikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPI HEIGHT REDUCTION FOR IMPROVED TRANSISTOR PERFORMANCE
- Publication number 20250113564
- Publication date Apr 3, 2025
- Intel Corporation
- Leonard Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL WORK FUNCTION WORD LINE FOR 4F2
- Publication number 20250107068
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Tong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CROSS-TALK NOISE RESISTIVE MEMORY DEVICES ON A SOI SUBSTRATE AN...
- Publication number 20250107104
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kao-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ELECTRICAL ISOLATION OF TRANSISTORS
- Publication number 20250107170
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Yun-Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250107242
- Publication date Mar 27, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250105192
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Tae Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250107210
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Kanako Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE DEVICE AND RELATED METHODS
- Publication number 20250107222
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Yang CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS
- Publication number 20250105053
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MEMORY DEVICE
- Publication number 20250105017
- Publication date Mar 27, 2025
- Macronix International Co., Ltd.
- Hsun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURES FOR MINIMIZING SUBTHRESHOLD HUMP EFFECT
- Publication number 20250107162
- Publication date Mar 27, 2025
- Cirrus Logic International Semiconductor Ltd.
- Kuen-Ting SHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRECISION HETEROGENEOUS INTEGRATION
- Publication number 20250105009
- Publication date Mar 27, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY
- Publication number 20250098160
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20250098325
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250098259
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Wen CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20250095994
- Publication date Mar 20, 2025
- United Semiconductor (Xiamen) Co., Ltd.
- Jian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096004
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIN-YUAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250098283
- Publication date Mar 20, 2025
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS

Dielectric regions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming contact features in field-effect transistors

Semiconductor device

Semiconductor memory device

Front-side type image sensors

Transistor level interconnection methodologies utilizing 3D interco...

Semiconductor device package with conductive pillars and reinforcin...

Cyclical deposition method and apparatus for filling a recess forme...

Semiconductor device and method of fabricating the same having a se...

3D semiconductor memory device and structure with memory and metal...

Method for producing a substrate for the epitaxial growth of a laye...

High voltage device and manufacturing method thereof

Embedded stressors in epitaxy source/drain regions

Deep trench isolation structure and method of making the same

Backside power rails and power distribution network for density sca...

Formation of single crystal semiconductors using planar vapor liqui...

Semiconductor device and methods of manufacture

Semiconductor device

Parasitic capacitance reduction in GaN-on-silicon devices

Semiconductor device with source/drain contact formed using bottom-...

Semiconductor device structure having gate dielectric layer

Semiconductor structure having buried word lines

Semiconductor device and method of manufacture

Transistor isolation regions and methods of forming the same

Middle-end-of-line strap for standard cell

Method for forming integrated circuit

Method for fabricating a strained semiconductor-on-insulator substrate

Forming low-stress silicon nitride layer through hydrogen treatment

Gapfill of variable aspect ratio features with a composite PEALD an...

Forming nitrogen-containing layers as oxidation blocking layers

Monolithic multi-bit weight cell for neuromorphic computing

Patents Applicationslast 30 patents

ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME IN FIELD-EFFEC...

SHALLOW TRENCH ISOLATION PROCESSING WITH LOCAL OXIDATION OF SILICON

MANUFACTURING METHOD OF FIELD EFFECT TRANSISTOR STRUCTURE

Method for Thinning a Semiconductor Substrate

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER

SEAM FREE ISOLATION STRUCTURES AND METHOD FOR MAKING THE SAME

DIRECT TRANSFER OF TRANSITION METAL DICHALCOGENIDE MONOLAYERS USING...

FIELD-EFFECT TRANSISTOR CRESCENT-SHAPED DIELECTRIC ISOLATION

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

TRANSFER OF A 2D MATERIAL TO A TARGET SUBSTRATE

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

EPI HEIGHT REDUCTION FOR IMPROVED TRANSISTOR PERFORMANCE

DUAL WORK FUNCTION WORD LINE FOR 4F2

LOW CROSS-TALK NOISE RESISTIVE MEMORY DEVICES ON A SOI SUBSTRATE AN...

METHODS FOR ELECTRICAL ISOLATION OF TRANSISTORS

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

MULTI-GATE DEVICE AND RELATED METHODS

SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS

METHOD OF MANUFACTURING MEMORY DEVICE

TRANSISTOR STRUCTURES FOR MINIMIZING SUBTHRESHOLD HUMP EFFECT

HIGH-PRECISION HETEROGENEOUS INTEGRATION

ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE