Different components

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CPC
Y10T29/49137

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/49137Different components

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic component mounting method
- Patent number 10,667,448
- Issue date May 26, 2020
- FUJI CORPORATION
- Yoshihiro Yasui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Holding frame for a plug-type connector
- Patent number 10,554,007
- Issue date Feb 4, 2020
- Harting Electric GmbH & Co. KG
- Heiko Herbrechtsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component pickup position correction system and component pickup po...
- Patent number 10,531,601
- Issue date Jan 7, 2020
- FUJI CORPORATION
- Hidetoshi Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Holding frame for a plug-type connector
- Patent number 10,424,892
- Issue date Sep 24, 2019
- Harting Electric GmbH & Co. KG
- Heiko Herbrechtsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holding frame for a plug-type connector
- Patent number 10,418,773
- Issue date Sep 17, 2019
- Harting Electric GmbH & Co. KG
- Heiko Herbrechtsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing electronic package with heat transfer element(s)
- Patent number 10,237,964
- Issue date Mar 19, 2019
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting method and component mounting system
- Patent number 9,668,394
- Issue date May 30, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masayuki Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Identification chip holding apparatus, optical fiber splicing and d...
- Patent number 9,632,259
- Issue date Apr 25, 2017
- Huawei Technologies Co., Ltd.
- Mingsong Guo
- G02 - OPTICS
Information Patent Grant
Transducer and measurement apparatus
- Patent number 9,618,404
- Issue date Apr 11, 2017
- Canon Kabushiki Kaisha
- Atsushi Kandori
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Electronic component assembly
- Patent number 9,426,899
- Issue date Aug 23, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced modularity in heterogeneous 3D stacks
- Patent number 9,390,989
- Issue date Jul 12, 2016
- GLOBALFOUNDRIES Inc.
- Philip G. Emma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced modularity in heterogeneous 3D stacks
- Patent number 9,373,557
- Issue date Jun 21, 2016
- GLOBALFOUNDRIES Inc.
- Philip G. Emma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a photoelectric conversion module
- Patent number 9,075,208
- Issue date Jul 7, 2015
- Fujitsu Component Limited
- Osamu Daikuhara
- G02 - OPTICS
Information Patent Grant
Method and system for improving alignment precision of parts in MEMS
- Patent number 9,055,701
- Issue date Jun 9, 2015
- International Business Machines Corporation
- Stefano S. Oggioni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for mounting a component
- Patent number 8,769,809
- Issue date Jul 8, 2014
- Samsung Techwin Co., Ltd.
- Tanizaki Masahiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for aligning and connecting electrical components
- Patent number 8,758,040
- Issue date Jun 24, 2014
- Eaton Corporation
- Thomas Alfred Wallace
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced modularity in heterogeneous 3D stacks
- Patent number 8,677,613
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Eren Kursun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-voltage power supply device and image forming apparatus having...
- Patent number 8,549,742
- Issue date Oct 8, 2013
- Canon Kabushiki Kaisha
- Tetsuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed RFID circuit placement method and device
- Patent number 8,531,297
- Issue date Sep 10, 2013
- Avery Dennison Corporation
- Scott Wayne Ferguson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual sided system in a package
- Patent number 8,514,576
- Issue date Aug 20, 2013
- Juniper Networks, Inc.
- Howard Baxter Osgood
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of repair of electronic device and repair system
- Patent number 8,456,854
- Issue date Jun 4, 2013
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material application for integrated circuit cooling
- Patent number 8,411,444
- Issue date Apr 2, 2013
- International Business Machines Corporation
- Michael Anthony Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical device manufacturing method
- Patent number 8,250,731
- Issue date Aug 28, 2012
- Hon Hai Precision Industry Co., Ltd.
- Shih-Kun Hsu
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board sensor mounting and alignment
- Patent number 8,194,410
- Issue date Jun 5, 2012
- Apple Inc.
- Derek J. DiCarlo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for micro-SD flash memory card
- Patent number 8,141,240
- Issue date Mar 27, 2012
- Super Talent Electronics, Inc.
- Siew S. Hiew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System comprised of a chip and a substrate and method of assembling...
- Patent number 8,136,737
- Issue date Mar 20, 2012
- NXP B.V.
- Anton Salfelner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit module and radio communications equipment, and method for m...
- Patent number 8,125,788
- Issue date Feb 28, 2012
- Kyocera Corporation
- Hidefumi Hatanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing a probe card
- Patent number 8,117,740
- Issue date Feb 21, 2012
- Phicom Corporation
- Ki-Joon Kim
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of an electromechanical transducer
- Patent number 8,087,153
- Issue date Jan 3, 2012
- Canon Kabushiki Kaisha
- Ayako Kato
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Lens module and assembly method thereof
- Patent number 8,050,553
- Issue date Nov 1, 2011
- Hon Hai Precision Industry Co., Ltd.
- Chi-Wei Chiu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
IMPACT DETECTION DEVICE
- Publication number 20140318245
- Publication date Oct 30, 2014
- Mattia Perego
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
SYSTEMS AND METHODS FOR ALIGNING AND CONNECTING ELECTRICAL COMPONENTS
- Publication number 20140148043
- Publication date May 29, 2014
- EATON CORPORATION
- Thomas Alfred Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PASSIVE ALIGNMENT OF OPTICAL COMPONENTS TO A SUBSTRATE
- Publication number 20140082935
- Publication date Mar 27, 2014
- VOLEX PLC
- Ezra Gold
- G02 - OPTICS
Information Patent Application
Method and System for Improving Alignment Precision of Parts in MEMS
- Publication number 20130205588
- Publication date Aug 15, 2013
- International Business Machines Corporation
- Stefano S. Oggioni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING
- Publication number 20130118008
- Publication date May 16, 2013
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Modularity in Heterogeneous 3D Stacks
- Publication number 20120272202
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Philip G. Emma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enhanced Modularity in Heterogeneous 3D Stacks
- Publication number 20120272040
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Philip G. Emma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enhanced Modularity in Heterogeneous 3D Stacks
- Publication number 20120268909
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Philip G. Emma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROTARY MOUNTING HEAD UNIT, AND METHOD AND APPARATUS FOR MOUNTING CO...
- Publication number 20120159781
- Publication date Jun 28, 2012
- Samsung Techwin Co., Ltd.
- Tanizaki Masahiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING
- Publication number 20120063094
- Publication date Mar 15, 2012
- International Business Machines Corporation
- Michael A. Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enhanced Modularity in Heterogeneous 3D Stacks
- Publication number 20110286190
- Publication date Nov 24, 2011
- International Business Machines Corporation
- Eren Kursun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD SENSOR MOUNTING AND ALIGNMENT
- Publication number 20110242776
- Publication date Oct 6, 2011
- Apple Inc.
- Derek J. DiCarlo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE MANUFACTURING METHOD
- Publication number 20110167618
- Publication date Jul 14, 2011
- HON HAI Precision Industry CO., LTD.
- SHIH-KUN HSU
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS
- Publication number 20110167627
- Publication date Jul 14, 2011
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
- JI MA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LENS MODULE AND ASSEMBLY METHOD THEREOF
- Publication number 20110150462
- Publication date Jun 23, 2011
- HON HAI Precision Industry CO., LTD.
- CHI-WEI CHIU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRODUCTION METHOD FOR ELECTRONIC CHIP COMPONENT
- Publication number 20110088840
- Publication date Apr 21, 2011
- Murata Manufacturing Co., Ltd.
- Minoru DOOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR REACTIVE DISTILLATION EMULATION ELEMENTS INTEGRATED WITH IN...
- Publication number 20110061224
- Publication date Mar 17, 2011
- Lester F. LUDWIG
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
MULTI-FUNCTION MODULE
- Publication number 20100251543
- Publication date Oct 7, 2010
- Virtium Technology, Inc.
- Phan Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD
- Publication number 20100175246
- Publication date Jul 15, 2010
- PANASONIC CORPORATION
- Kazuhide Nagao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED RFID CIRCUIT PLACEMENT METHOD AND DEVICE
- Publication number 20100172737
- Publication date Jul 8, 2010
- Avery Dennison Corporation
- Jason MUNN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-FUNCTION MODULE
- Publication number 20100167557
- Publication date Jul 1, 2010
- Virtium Technology, Inc.
- Phan Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR ELECTRONIC CHIP COMPONENT
- Publication number 20100146778
- Publication date Jun 17, 2010
- Murata Manufacturing Co., Ltd.
- Minoru DOOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PART MOUNTING APPARATUS AND METHOD
- Publication number 20100132187
- Publication date Jun 3, 2010
- Fujitsu Limited
- Toru Nishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED RFID CIRCUIT PLACEMENT METHOD AND DEVICE
- Publication number 20100043203
- Publication date Feb 25, 2010
- Avery Dennison Corporation
- Scott Wayne FERGUSON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC PACKAGES WITH SMALL FOOTPRINTS AND ASSOCIATED METHO...
- Publication number 20100027233
- Publication date Feb 4, 2010
- Micron Technology, Inc.
- Peng Wang Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...
- Publication number 20100011572
- Publication date Jan 21, 2010
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SYSTEM COMPRISED OF A CHIP AND A SUBSTRATE AND METHOD OF ASSEMBLING...
- Publication number 20100006653
- Publication date Jan 14, 2010
- NXP, B.V.
- Anton Salfelner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTROMECHANICAL TRANSDUCER AND FABRICATION METHOD OF ELECTROMECHA...
- Publication number 20090313809
- Publication date Dec 24, 2009
- Canon Kabushiki Kaisha
- Ayako Kato
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for Producing Optoelectronic Components, and Products Produc...
- Publication number 20090217516
- Publication date Sep 3, 2009
- SCHOTT AG
- Edgar Pawlowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING LENS MODULE WITH IMAGE SENSOR
- Publication number 20090183365
- Publication date Jul 23, 2009
- HON HAI Precision Industry CO., LTD.
- BOR-YUAN HSIAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Different components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component mounting method

Holding frame for a plug-type connector

Component pickup position correction system and component pickup po...

Holding frame for a plug-type connector

Holding frame for a plug-type connector

Manufacturing electronic package with heat transfer element(s)

Component mounting method and component mounting system

Identification chip holding apparatus, optical fiber splicing and d...

Transducer and measurement apparatus

Electronic component assembly

Enhanced modularity in heterogeneous 3D stacks

Enhanced modularity in heterogeneous 3D stacks

Method for assembling a photoelectric conversion module

Method and system for improving alignment precision of parts in MEMS

Method for mounting a component

Systems and methods for aligning and connecting electrical components

Enhanced modularity in heterogeneous 3D stacks

High-voltage power supply device and image forming apparatus having...

High-speed RFID circuit placement method and device

Dual sided system in a package

Method of repair of electronic device and repair system

Thermal interface material application for integrated circuit cooling

Electrical device manufacturing method

Printed circuit board sensor mounting and alignment

Manufacturing method for micro-SD flash memory card

System comprised of a chip and a substrate and method of assembling...

Circuit module and radio communications equipment, and method for m...

Method and apparatus for manufacturing a probe card

Manufacturing method of an electromechanical transducer

Lens module and assembly method thereof

Patents Applicationslast 30 patents

IMPACT DETECTION DEVICE

SYSTEMS AND METHODS FOR ALIGNING AND CONNECTING ELECTRICAL COMPONENTS

METHOD FOR PASSIVE ALIGNMENT OF OPTICAL COMPONENTS TO A SUBSTRATE

Method and System for Improving Alignment Precision of Parts in MEMS

THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING

Enhanced Modularity in Heterogeneous 3D Stacks

Enhanced Modularity in Heterogeneous 3D Stacks

Enhanced Modularity in Heterogeneous 3D Stacks

ROTARY MOUNTING HEAD UNIT, AND METHOD AND APPARATUS FOR MOUNTING CO...

THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING

Enhanced Modularity in Heterogeneous 3D Stacks

PRINTED CIRCUIT BOARD SENSOR MOUNTING AND ALIGNMENT

ELECTRICAL DEVICE MANUFACTURING METHOD

METHOD OF MOUNTING ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS

LENS MODULE AND ASSEMBLY METHOD THEREOF

PRODUCTION METHOD FOR ELECTRONIC CHIP COMPONENT

MODULAR REACTIVE DISTILLATION EMULATION ELEMENTS INTEGRATED WITH IN...

MULTI-FUNCTION MODULE

COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD

HIGH-SPEED RFID CIRCUIT PLACEMENT METHOD AND DEVICE

MULTI-FUNCTION MODULE

PRODUCTION METHOD FOR ELECTRONIC CHIP COMPONENT

PART MOUNTING APPARATUS AND METHOD

HIGH-SPEED RFID CIRCUIT PLACEMENT METHOD AND DEVICE

MICROELECTRONIC PACKAGES WITH SMALL FOOTPRINTS AND ASSOCIATED METHO...

ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...

SYSTEM COMPRISED OF A CHIP AND A SUBSTRATE AND METHOD OF ASSEMBLING...

ELECTROMECHANICAL TRANSDUCER AND FABRICATION METHOD OF ELECTROMECHA...

Method for Producing Optoelectronic Components, and Products Produc...

METHOD FOR ASSEMBLING LENS MODULE WITH IMAGE SENSOR