Different loop heights

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H01L2224/41052

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/41052Different loop heights

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 9,589,929
- Issue date Mar 7, 2017
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 8,451,621
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly and method of manufacture
- Patent number 8,449,339
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
- Publication number 20240120308
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE
- Publication number 20120064781
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20120063107
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR